Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2001
08/16/2001EP1123212A1 Method for manufacture of electronic parts
08/16/2001EP1123157A1 Integrated multilayered microfluidic devices and methods for making the same
08/16/2001EP0953166B1 Pattern-forming methods
08/16/2001EP0907763B1 Process for the reduction of copper oxide
08/16/2001DE4217075C2 Fluorpolymer-Verbundmaterial mit niedrigem Volumenanteil an keramischem Füllstoff Fluoropolymer composite material having a low volume fraction of ceramic filler
08/16/2001DE10100002A1 Verfahren und Vorrichtung zur sequentiellen Verpressung von HDI Multilayerlaminaten. Method and apparatus for the sequential injection of HDI multilayer laminates.
08/16/2001DE10008031A1 Verfahren und Vorrichtung zum Verfüllen von Kavitäten Method and device for filling cavities
08/16/2001DE10006530A1 Antennenfeder Antenna spring
08/16/2001DE10006279A1 Applying coatings to plate-shaped bearer, e.g. circuit board, involves applying liquid paint to board in overflow container selectively between pots covering electrical components
08/16/2001DE10006092A1 Luminaire for advertising, display etc. includes intermediate base made of weather resistant material, for mounting of circuit boards with LEDs
08/16/2001CA2402138A1 Method and apparatus of immobilizing solder spheres
08/16/2001CA2399031A1 Passive alignment using slanted wall pedestal
08/15/2001CN2443579Y Carrying clamp for thermometer of tin furnace
08/15/2001CN2442779Y Digital display temp. auto-controlled air soldering machine
08/15/2001CN1308839A Method for producing interconnections with electrically conductive cross connectious between the top and the bottom part of a substrate and interconnections having such cross connections
08/15/2001CN1308838A Method for brazing by solder reflow etectronic components using pre-dre-deposits of solder alloy and brazing device therefor
08/15/2001CN1308837A Scanner system
08/15/2001CN1308836A Improved method for forming conductive traces and printed circuits made thereby
08/15/2001CN1308487A Wiring technique for multiplayer printed circuit board
08/15/2001CN1308449A Vibrator holder
08/15/2001CN1308448A Vibrator holder
08/15/2001CN1308447A Vibrator holder
08/15/2001CN1308446A Vibrator holder
08/15/2001CN1308445A Vibrator holder
08/15/2001CN1308444A Vibrator holder
08/15/2001CN1308443A vibrator holder
08/15/2001CN1308442A Vibrator holder
08/15/2001CN1308441A Vibrator holder
08/15/2001CN1308440A Vibrator holder
08/15/2001CN1308393A Manufacture of socket connector
08/15/2001CN1308346A Single-disk capacitor
08/15/2001CN1308323A Optical detector with HF overlapping circuit
08/15/2001CN1069617C Large ceramic article and method of manufacturing
08/14/2001US6275750 Apparatus for setting heating condition in heating furnace and thermal analyzer for object to be heated in heating furnace
08/14/2001US6275514 Laser repetition rate multiplier
08/14/2001US6275384 Electrical transition device with improved LED positioning means
08/14/2001US6274955 Vibration motor holding apparatus and portable electronic equipment having the same
08/14/2001US6274824 Method of arranging signal and destination pads to provide multiple signal/destination connection combinations
08/14/2001US6274823 Interconnection substrates with resilient contact structures on both sides
08/14/2001US6274822 Manufacture of semiconductor connection components with frangible lead sections
08/14/2001US6274821 Shock-resistive printed circuit board and electronic device including the same
08/14/2001US6274820 Electrical connections with deformable contacts
08/14/2001US6274819 Method and article for the connection and repair of flex and other circuits
08/14/2001US6274491 Process of manufacturing thin ball grid array substrates
08/14/2001US6274474 Method of forming BGA interconnections having mixed solder profiles
08/14/2001US6274473 Flip chip packages
08/14/2001US6274412 Material and method for printing high conductivity electrical conductors and other components on thin film transistor arrays
08/14/2001US6274405 Semiconductor device, method of making the same, circuit board, and film carrier tape
08/14/2001US6274404 Multilayered wiring structure and method of manufacturing the same
08/14/2001US6274390 Method and apparatus providing redundancy for fabricating highly reliable memory modules
08/14/2001US6274389 Sealing space between carrier substrate and circuit board with reaction product of epoxy resin, curing agent and plasticizer
08/14/2001US6274291 Method of reducing defects in I/C card and resulting card
08/14/2001US6274254 Electrodeposited precious metal finishes having wear resistant particles therein
08/14/2001US6274245 Foil for use in filing substrate recesses
08/14/2001US6274242 Polymer capable of forming an optically anisotropic melt phase is, after having been laminated on a base material capable of supporting shape of film during heat treatment, heat-treated number of times and base material is removed
08/14/2001US6274224 Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
08/14/2001US6274214 Microelectronic package module with temporary lid
08/14/2001US6274057 Method for etch formation of electrical contact posts on a charge plate used for ink jet printing
08/14/2001US6274010 Electroplating apparatus
08/14/2001US6273989 Bonding electronic components such as printed circuit boards. superior peel strength, chemical resistance, moisture resistance, and temperature stability.
08/14/2001US6273700 Mold structure used in method of molding circuitry
08/14/2001US6273554 Apparatus for aligning a flexible circuit on a ink jet printer carriage
08/14/2001US6273328 Solder bump forming method and apparatus
08/14/2001US6273327 Apparatus and method for depositing solder material onto a circuit board
08/14/2001US6273326 Method and device for producing a metallic or ceramic body
08/14/2001US6273319 Wave soldering method and system used for the method
08/14/2001US6272984 Squeegee for screen printing and screen printing method
08/14/2001US6272962 Cutting blade
08/14/2001US6272957 Flex die punching apparatus and method
08/14/2001US6272745 Methods for the production of printed circuit boards with through-platings
08/14/2001US6272744 Semiconductor connection components and methods with releasable lead support
08/14/2001US6272741 Hybrid solder ball and pin grid array circuit board interconnect system and method
08/14/2001CA2136748C Three-dimensional printing techniques
08/09/2001WO2001058230A1 Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards
08/09/2001WO2001058229A1 Capacitor structure of wiring board and capacitor sheet
08/09/2001WO2001058228A1 Method for manufacturing multilayer circuit board
08/09/2001WO2001058227A1 Package for microwave components
08/09/2001WO2001058225A1 Copper foil excellent in laser beam drilling performance and production method therefor
08/09/2001WO2001058213A1 Vacuum deposition of bus bars onto conductive transparent films
08/09/2001WO2001057990A1 Stamped grid with an integrated hall sensor for rotational speed pick-off
08/09/2001WO2001057960A1 Method for contacting a printed circuit board to a conductor arranged on a support, and device
08/09/2001WO2001057923A1 Method for producing electrical connections in particular for an electronic device
08/09/2001WO2001057893A1 Chip capacitor
08/09/2001WO2001057145A1 Water-based ink, process for producing the same, and method of printing with the same
08/09/2001WO2001057112A1 Adhesive polyimide resin and adhesive laminate
08/09/2001WO2001056793A1 Printing plate, and printing method using the same
08/09/2001WO2001056771A2 Method for fabricating micro-structures with various surface properties in multilayer body by plasma etching
08/09/2001WO2000071921A3 Burrless castellation via process and product for plastic chip carrier
08/09/2001US20010012870 A heat-cured polyether based on a 9,9-bis(p-hydroxyphenyl)-fluorene having at least one alkyl substituent and a dihydroxy aromatic comonomer; low dielectric protective coatings; heat resistance; noncracking
08/09/2001US20010012869 Attaching catalytic metal nuclei to the polysilane modified by a carbon-functional silane, immersing the substrate in an electroless plating bath to deposit a metal film on the patterned coating
08/09/2001US20010012800 Method of connecting circuit element
08/09/2001US20010012739 Composite microelectronic spring structure and method for making same
08/09/2001US20010012736 Bus-bar wiring board and method of producing the same
08/09/2001US20010012723 Connecting terminal and a connecting terminal assembly
08/09/2001US20010012716 Locking assembly for securing semiconductor device to carrier substrate
08/09/2001US20010012708 Electric connection box
08/09/2001US20010012707 Integrated circuit socket with contact pad
08/09/2001US20010012706 Connecting structure, electro-optical device, and electronic apparatus
08/09/2001US20010012704 Interconnect assemblies and methods
08/09/2001US20010012692 Thick-film etch-back process for use in manufacturing fine-line hybrid circuits