Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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08/16/2001 | EP1123212A1 Method for manufacture of electronic parts |
08/16/2001 | EP1123157A1 Integrated multilayered microfluidic devices and methods for making the same |
08/16/2001 | EP0953166B1 Pattern-forming methods |
08/16/2001 | EP0907763B1 Process for the reduction of copper oxide |
08/16/2001 | DE4217075C2 Fluorpolymer-Verbundmaterial mit niedrigem Volumenanteil an keramischem Füllstoff Fluoropolymer composite material having a low volume fraction of ceramic filler |
08/16/2001 | DE10100002A1 Verfahren und Vorrichtung zur sequentiellen Verpressung von HDI Multilayerlaminaten. Method and apparatus for the sequential injection of HDI multilayer laminates. |
08/16/2001 | DE10008031A1 Verfahren und Vorrichtung zum Verfüllen von Kavitäten Method and device for filling cavities |
08/16/2001 | DE10006530A1 Antennenfeder Antenna spring |
08/16/2001 | DE10006279A1 Applying coatings to plate-shaped bearer, e.g. circuit board, involves applying liquid paint to board in overflow container selectively between pots covering electrical components |
08/16/2001 | DE10006092A1 Luminaire for advertising, display etc. includes intermediate base made of weather resistant material, for mounting of circuit boards with LEDs |
08/16/2001 | CA2402138A1 Method and apparatus of immobilizing solder spheres |
08/16/2001 | CA2399031A1 Passive alignment using slanted wall pedestal |
08/15/2001 | CN2443579Y Carrying clamp for thermometer of tin furnace |
08/15/2001 | CN2442779Y Digital display temp. auto-controlled air soldering machine |
08/15/2001 | CN1308839A Method for producing interconnections with electrically conductive cross connectious between the top and the bottom part of a substrate and interconnections having such cross connections |
08/15/2001 | CN1308838A Method for brazing by solder reflow etectronic components using pre-dre-deposits of solder alloy and brazing device therefor |
08/15/2001 | CN1308837A Scanner system |
08/15/2001 | CN1308836A Improved method for forming conductive traces and printed circuits made thereby |
08/15/2001 | CN1308487A Wiring technique for multiplayer printed circuit board |
08/15/2001 | CN1308449A Vibrator holder |
08/15/2001 | CN1308448A Vibrator holder |
08/15/2001 | CN1308447A Vibrator holder |
08/15/2001 | CN1308446A Vibrator holder |
08/15/2001 | CN1308445A Vibrator holder |
08/15/2001 | CN1308444A Vibrator holder |
08/15/2001 | CN1308443A vibrator holder |
08/15/2001 | CN1308442A Vibrator holder |
08/15/2001 | CN1308441A Vibrator holder |
08/15/2001 | CN1308440A Vibrator holder |
08/15/2001 | CN1308393A Manufacture of socket connector |
08/15/2001 | CN1308346A Single-disk capacitor |
08/15/2001 | CN1308323A Optical detector with HF overlapping circuit |
08/15/2001 | CN1069617C Large ceramic article and method of manufacturing |
08/14/2001 | US6275750 Apparatus for setting heating condition in heating furnace and thermal analyzer for object to be heated in heating furnace |
08/14/2001 | US6275514 Laser repetition rate multiplier |
08/14/2001 | US6275384 Electrical transition device with improved LED positioning means |
08/14/2001 | US6274955 Vibration motor holding apparatus and portable electronic equipment having the same |
08/14/2001 | US6274824 Method of arranging signal and destination pads to provide multiple signal/destination connection combinations |
08/14/2001 | US6274823 Interconnection substrates with resilient contact structures on both sides |
08/14/2001 | US6274822 Manufacture of semiconductor connection components with frangible lead sections |
08/14/2001 | US6274821 Shock-resistive printed circuit board and electronic device including the same |
08/14/2001 | US6274820 Electrical connections with deformable contacts |
08/14/2001 | US6274819 Method and article for the connection and repair of flex and other circuits |
08/14/2001 | US6274491 Process of manufacturing thin ball grid array substrates |
08/14/2001 | US6274474 Method of forming BGA interconnections having mixed solder profiles |
08/14/2001 | US6274473 Flip chip packages |
08/14/2001 | US6274412 Material and method for printing high conductivity electrical conductors and other components on thin film transistor arrays |
08/14/2001 | US6274405 Semiconductor device, method of making the same, circuit board, and film carrier tape |
08/14/2001 | US6274404 Multilayered wiring structure and method of manufacturing the same |
08/14/2001 | US6274390 Method and apparatus providing redundancy for fabricating highly reliable memory modules |
08/14/2001 | US6274389 Sealing space between carrier substrate and circuit board with reaction product of epoxy resin, curing agent and plasticizer |
08/14/2001 | US6274291 Method of reducing defects in I/C card and resulting card |
08/14/2001 | US6274254 Electrodeposited precious metal finishes having wear resistant particles therein |
08/14/2001 | US6274245 Foil for use in filing substrate recesses |
08/14/2001 | US6274242 Polymer capable of forming an optically anisotropic melt phase is, after having been laminated on a base material capable of supporting shape of film during heat treatment, heat-treated number of times and base material is removed |
08/14/2001 | US6274224 Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article |
08/14/2001 | US6274214 Microelectronic package module with temporary lid |
08/14/2001 | US6274057 Method for etch formation of electrical contact posts on a charge plate used for ink jet printing |
08/14/2001 | US6274010 Electroplating apparatus |
08/14/2001 | US6273989 Bonding electronic components such as printed circuit boards. superior peel strength, chemical resistance, moisture resistance, and temperature stability. |
08/14/2001 | US6273700 Mold structure used in method of molding circuitry |
08/14/2001 | US6273554 Apparatus for aligning a flexible circuit on a ink jet printer carriage |
08/14/2001 | US6273328 Solder bump forming method and apparatus |
08/14/2001 | US6273327 Apparatus and method for depositing solder material onto a circuit board |
08/14/2001 | US6273326 Method and device for producing a metallic or ceramic body |
08/14/2001 | US6273319 Wave soldering method and system used for the method |
08/14/2001 | US6272984 Squeegee for screen printing and screen printing method |
08/14/2001 | US6272962 Cutting blade |
08/14/2001 | US6272957 Flex die punching apparatus and method |
08/14/2001 | US6272745 Methods for the production of printed circuit boards with through-platings |
08/14/2001 | US6272744 Semiconductor connection components and methods with releasable lead support |
08/14/2001 | US6272741 Hybrid solder ball and pin grid array circuit board interconnect system and method |
08/14/2001 | CA2136748C Three-dimensional printing techniques |
08/09/2001 | WO2001058230A1 Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards |
08/09/2001 | WO2001058229A1 Capacitor structure of wiring board and capacitor sheet |
08/09/2001 | WO2001058228A1 Method for manufacturing multilayer circuit board |
08/09/2001 | WO2001058227A1 Package for microwave components |
08/09/2001 | WO2001058225A1 Copper foil excellent in laser beam drilling performance and production method therefor |
08/09/2001 | WO2001058213A1 Vacuum deposition of bus bars onto conductive transparent films |
08/09/2001 | WO2001057990A1 Stamped grid with an integrated hall sensor for rotational speed pick-off |
08/09/2001 | WO2001057960A1 Method for contacting a printed circuit board to a conductor arranged on a support, and device |
08/09/2001 | WO2001057923A1 Method for producing electrical connections in particular for an electronic device |
08/09/2001 | WO2001057893A1 Chip capacitor |
08/09/2001 | WO2001057145A1 Water-based ink, process for producing the same, and method of printing with the same |
08/09/2001 | WO2001057112A1 Adhesive polyimide resin and adhesive laminate |
08/09/2001 | WO2001056793A1 Printing plate, and printing method using the same |
08/09/2001 | WO2001056771A2 Method for fabricating micro-structures with various surface properties in multilayer body by plasma etching |
08/09/2001 | WO2000071921A3 Burrless castellation via process and product for plastic chip carrier |
08/09/2001 | US20010012870 A heat-cured polyether based on a 9,9-bis(p-hydroxyphenyl)-fluorene having at least one alkyl substituent and a dihydroxy aromatic comonomer; low dielectric protective coatings; heat resistance; noncracking |
08/09/2001 | US20010012869 Attaching catalytic metal nuclei to the polysilane modified by a carbon-functional silane, immersing the substrate in an electroless plating bath to deposit a metal film on the patterned coating |
08/09/2001 | US20010012800 Method of connecting circuit element |
08/09/2001 | US20010012739 Composite microelectronic spring structure and method for making same |
08/09/2001 | US20010012736 Bus-bar wiring board and method of producing the same |
08/09/2001 | US20010012723 Connecting terminal and a connecting terminal assembly |
08/09/2001 | US20010012716 Locking assembly for securing semiconductor device to carrier substrate |
08/09/2001 | US20010012708 Electric connection box |
08/09/2001 | US20010012707 Integrated circuit socket with contact pad |
08/09/2001 | US20010012706 Connecting structure, electro-optical device, and electronic apparatus |
08/09/2001 | US20010012704 Interconnect assemblies and methods |
08/09/2001 | US20010012692 Thick-film etch-back process for use in manufacturing fine-line hybrid circuits |