Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2001
08/22/2001EP1125480A1 Method for assembling electronic components on a support and resulting device
08/22/2001EP1125479A1 Fabrication process for flex circuit applications
08/22/2001EP1125330A1 Method of creating an electrical interconnect device bearing an array of electrical contact pads
08/22/2001EP1125329A1 Tape ball grid array with interconnected ground plane
08/22/2001EP1125325A1 Device for providing balls or preforms for making flip-chip connections
08/22/2001EP1124770A1 Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric
08/22/2001EP1124769A1 Impregnated glass fiber strands and products including the same
08/22/2001EP1124710A1 Ribbed trim panel for thermal spraying of electrical circuit
08/22/2001EP1092248A4 Pcb to metallic ground connection method
08/22/2001EP0980642B1 Process and apparatus for the treatment of flat-form material, especially of printed circuit boards
08/22/2001EP0975979B1 Method for making cards with multiple contact tips for testing semiconductor chips
08/22/2001CN2444380Y 光电模块装置 Photovoltaic module device
08/22/2001CN2444379Y Full automatic routing machine for printing circuit board
08/22/2001CN2443938Y Floating type blocking mater rolling wheel
08/22/2001CN1309881A Method for metal coating of substrates
08/22/2001CN1309825A IC socket
08/22/2001CN1309680A Heat curable epoxy compositions
08/22/2001CN1309527A Removeable film, substrate with film, method for forming said film and circuit board mfg. method
08/22/2001CN1309526A Technology for making underboarding used on perforating on PCB or insulating board for electric appliances
08/22/2001CN1309525A 印刷电路板 A printed circuit board
08/22/2001CN1309320A Base board for display device and its mfg. method, liquid crystal device and electronic apparatus
08/22/2001CN1069988C Objective actuator
08/21/2001US6279141 Preburn-in dynamic random access memory module and preburn-in circuit board thereof
08/21/2001US6278951 Crosstalk noise calculation method and storage medium
08/21/2001US6278618 Substrate strips for use in integrated circuit packaging
08/21/2001US6278601 Infrared shield for capacitors
08/21/2001US6278509 Display device having particular ribs between TCPs
08/21/2001US6278356 Flat, built-in resistors and capacitors for a printed circuit board
08/21/2001US6278345 Flexible printed circuit and the method for making the same
08/21/2001US6278286 Interconnect and system for making temporary electrical connections to semiconductor components
08/21/2001US6278185 Semi-additive process (SAP) architecture for organic leadless grid array packages
08/21/2001US6278184 Solder disc connection
08/21/2001US6278183 Semiconductor device and method for manufacturing the same
08/21/2001US6278180 Ball-grid-array-type semiconductor device and its fabrication method and electronic device
08/21/2001US6278078 Laser soldering method
08/21/2001US6277799 Aqueous cleaning of paste residue
08/21/2001US6277671 Methods of forming integrated circuit packages
08/21/2001US6277263 Alkaline electrolytic copper bath is used to electroplate copper onto a barrier layer or enhance an ultra-thin copper seed layer which has been deposited on the barrier layer
08/21/2001US6277222 Electronic component connecting method
08/21/2001US6276995 Electronic component and method of manufacturing same
08/21/2001US6276992 Method of forming a groove in a surface of a mother substrate
08/21/2001US6276676 Manual registration pin alignment system
08/21/2001US6276599 Method and apparatus for forming solder bumps
08/21/2001US6276598 Method and apparatus for ball placement
08/21/2001US6276596 Low temperature solder column attach by injection molded solder and structure formed
08/21/2001US6276593 Apparatus and method for solder attachment of high powered transistors to base heatsink
08/21/2001US6276590 Conductive ball attaching apparatus and method
08/21/2001US6276355 Cutting method and apparatus for sectioning multilayer electronic devices
08/21/2001US6276246 Method for punching slug from workpiece
08/21/2001US6276055 Method and apparatus for forming plugs in vias of a circuit board layer
08/16/2001WO2001060136A1 Printed-circuit board, multilayer printed-circuit board and method of manufacture thereof
08/16/2001WO2001060135A1 Printed circuit board
08/16/2001WO2001059838A1 Passive alignment using slanted wall pedestal
08/16/2001WO2001059799A1 Security device for a printed circuit board, said device providing better security
08/16/2001WO2001059747A1 Light bodies for advertisements, displays and similar visible surfaces
08/16/2001WO2001059185A2 Pre-plate treating system
08/16/2001WO2001059023A1 Adhesive film and method for manufacturing multilayer printed wiring board
08/16/2001WO2001059007A1 Resin composition, adhesives prepared therewith for bonding circuit members, and circuit boards
08/16/2001WO2001058977A1 Photocurable/thermosetting composition for forming matte film
08/16/2001WO2001058765A2 Method and apparatus of immobilizing solder spheres
08/16/2001WO2001058639A1 Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method
08/16/2001WO2001016402A8 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil
08/16/2001WO2001009054A9 Impregnated glass fiber strands and products including the same
08/16/2001WO2000046837A3 Improved circuit board manufacturing process
08/16/2001US20010014963 Method for designing a decoupling circuit
08/16/2001US20010014553 Terminal and connecting method of circuit body and the terminal
08/16/2001US20010014551 Plug-in module with installation guide, retention feature, and handle
08/16/2001US20010014491 Lead frame and manufacturing method thereof
08/16/2001US20010014490 Method of manufacturing semiconductor integrated circuit device
08/16/2001US20010014429 Potassium, boron and silicon oxide
08/16/2001US20010014410 Acid resistance; waterproof
08/16/2001US20010014409 Article, method, and apparatus for electrochemical fabrication
08/16/2001US20010014408 Surface -treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil
08/16/2001US20010014407 Acid resistance
08/16/2001US20010014406 Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil
08/16/2001US20010014212 Fibrous supported polymer encapsulated electrical component
08/16/2001US20010014016 Electronic circuit package assembly and method of producing the same
08/16/2001US20010014015 Electronic package with stacked connections and method for making same
08/16/2001US20010014014 Casing for an electronic unit
08/16/2001US20010014004 Parallel plate buried capacitor
08/16/2001US20010013832 Device and method for monitoring the operation of an industrial installation
08/16/2001US20010013783 Circuit board testing apparatus and method
08/16/2001US20010013653 Array of electrodes reliable, durable and economical and process for fabrication thereof
08/16/2001US20010013650 Circuit interconnect providing reduced crosstalk and simultaneous switching noise
08/16/2001US20010013535 Method of connecting circuit boards
08/16/2001US20010013473 Pre-plate treating system
08/16/2001US20010013472 Forming copper film on insulation layer; immersion in solution of plating promoter; removing promoter from copper film leaving it on side walls and bottoms of via holes; electroplating to fill holes; improvement over planarization
08/16/2001US20010013425 Multilayered Substrate for Semiconductor Device
08/16/2001US20010013423 Flip chip attach on flexible circuit carrier using chip with metallic cap on solder
08/16/2001US20010013421 Leaded semiconductor device package for use in nonsoldering assembling
08/16/2001US20010013171 Method and equipment for removing insulation from a flat cable
08/16/2001US20010013170 Component alignment methods
08/16/2001EP1124297A1 Method and device for stripping of a flat cable
08/16/2001EP1124264A2 Method of manufacturing transparent conducting structures and use of transparent conducting oxide layers to pattern transparent conducting regions
08/16/2001EP1123988A1 Method of forming chromium coated copper for printed circuit boards
08/16/2001EP1123753A2 Mesoporous ceramic films having reduced dielectric constants
08/16/2001EP1123644A1 Method for producing multi-layer circuits
08/16/2001EP1123643A1 Printed board assembly and method of its manufacture
08/16/2001EP1123525A1 Device and method for the optical inspection of concealed soldered connections
08/16/2001EP1123512A1 High density printed circuit board