Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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08/22/2001 | EP1125480A1 Method for assembling electronic components on a support and resulting device |
08/22/2001 | EP1125479A1 Fabrication process for flex circuit applications |
08/22/2001 | EP1125330A1 Method of creating an electrical interconnect device bearing an array of electrical contact pads |
08/22/2001 | EP1125329A1 Tape ball grid array with interconnected ground plane |
08/22/2001 | EP1125325A1 Device for providing balls or preforms for making flip-chip connections |
08/22/2001 | EP1124770A1 Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric |
08/22/2001 | EP1124769A1 Impregnated glass fiber strands and products including the same |
08/22/2001 | EP1124710A1 Ribbed trim panel for thermal spraying of electrical circuit |
08/22/2001 | EP1092248A4 Pcb to metallic ground connection method |
08/22/2001 | EP0980642B1 Process and apparatus for the treatment of flat-form material, especially of printed circuit boards |
08/22/2001 | EP0975979B1 Method for making cards with multiple contact tips for testing semiconductor chips |
08/22/2001 | CN2444380Y 光电模块装置 Photovoltaic module device |
08/22/2001 | CN2444379Y Full automatic routing machine for printing circuit board |
08/22/2001 | CN2443938Y Floating type blocking mater rolling wheel |
08/22/2001 | CN1309881A Method for metal coating of substrates |
08/22/2001 | CN1309825A IC socket |
08/22/2001 | CN1309680A Heat curable epoxy compositions |
08/22/2001 | CN1309527A Removeable film, substrate with film, method for forming said film and circuit board mfg. method |
08/22/2001 | CN1309526A Technology for making underboarding used on perforating on PCB or insulating board for electric appliances |
08/22/2001 | CN1309525A 印刷电路板 A printed circuit board |
08/22/2001 | CN1309320A Base board for display device and its mfg. method, liquid crystal device and electronic apparatus |
08/22/2001 | CN1069988C Objective actuator |
08/21/2001 | US6279141 Preburn-in dynamic random access memory module and preburn-in circuit board thereof |
08/21/2001 | US6278951 Crosstalk noise calculation method and storage medium |
08/21/2001 | US6278618 Substrate strips for use in integrated circuit packaging |
08/21/2001 | US6278601 Infrared shield for capacitors |
08/21/2001 | US6278509 Display device having particular ribs between TCPs |
08/21/2001 | US6278356 Flat, built-in resistors and capacitors for a printed circuit board |
08/21/2001 | US6278345 Flexible printed circuit and the method for making the same |
08/21/2001 | US6278286 Interconnect and system for making temporary electrical connections to semiconductor components |
08/21/2001 | US6278185 Semi-additive process (SAP) architecture for organic leadless grid array packages |
08/21/2001 | US6278184 Solder disc connection |
08/21/2001 | US6278183 Semiconductor device and method for manufacturing the same |
08/21/2001 | US6278180 Ball-grid-array-type semiconductor device and its fabrication method and electronic device |
08/21/2001 | US6278078 Laser soldering method |
08/21/2001 | US6277799 Aqueous cleaning of paste residue |
08/21/2001 | US6277671 Methods of forming integrated circuit packages |
08/21/2001 | US6277263 Alkaline electrolytic copper bath is used to electroplate copper onto a barrier layer or enhance an ultra-thin copper seed layer which has been deposited on the barrier layer |
08/21/2001 | US6277222 Electronic component connecting method |
08/21/2001 | US6276995 Electronic component and method of manufacturing same |
08/21/2001 | US6276992 Method of forming a groove in a surface of a mother substrate |
08/21/2001 | US6276676 Manual registration pin alignment system |
08/21/2001 | US6276599 Method and apparatus for forming solder bumps |
08/21/2001 | US6276598 Method and apparatus for ball placement |
08/21/2001 | US6276596 Low temperature solder column attach by injection molded solder and structure formed |
08/21/2001 | US6276593 Apparatus and method for solder attachment of high powered transistors to base heatsink |
08/21/2001 | US6276590 Conductive ball attaching apparatus and method |
08/21/2001 | US6276355 Cutting method and apparatus for sectioning multilayer electronic devices |
08/21/2001 | US6276246 Method for punching slug from workpiece |
08/21/2001 | US6276055 Method and apparatus for forming plugs in vias of a circuit board layer |
08/16/2001 | WO2001060136A1 Printed-circuit board, multilayer printed-circuit board and method of manufacture thereof |
08/16/2001 | WO2001060135A1 Printed circuit board |
08/16/2001 | WO2001059838A1 Passive alignment using slanted wall pedestal |
08/16/2001 | WO2001059799A1 Security device for a printed circuit board, said device providing better security |
08/16/2001 | WO2001059747A1 Light bodies for advertisements, displays and similar visible surfaces |
08/16/2001 | WO2001059185A2 Pre-plate treating system |
08/16/2001 | WO2001059023A1 Adhesive film and method for manufacturing multilayer printed wiring board |
08/16/2001 | WO2001059007A1 Resin composition, adhesives prepared therewith for bonding circuit members, and circuit boards |
08/16/2001 | WO2001058977A1 Photocurable/thermosetting composition for forming matte film |
08/16/2001 | WO2001058765A2 Method and apparatus of immobilizing solder spheres |
08/16/2001 | WO2001058639A1 Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method |
08/16/2001 | WO2001016402A8 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil |
08/16/2001 | WO2001009054A9 Impregnated glass fiber strands and products including the same |
08/16/2001 | WO2000046837A3 Improved circuit board manufacturing process |
08/16/2001 | US20010014963 Method for designing a decoupling circuit |
08/16/2001 | US20010014553 Terminal and connecting method of circuit body and the terminal |
08/16/2001 | US20010014551 Plug-in module with installation guide, retention feature, and handle |
08/16/2001 | US20010014491 Lead frame and manufacturing method thereof |
08/16/2001 | US20010014490 Method of manufacturing semiconductor integrated circuit device |
08/16/2001 | US20010014429 Potassium, boron and silicon oxide |
08/16/2001 | US20010014410 Acid resistance; waterproof |
08/16/2001 | US20010014409 Article, method, and apparatus for electrochemical fabrication |
08/16/2001 | US20010014408 Surface -treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil |
08/16/2001 | US20010014407 Acid resistance |
08/16/2001 | US20010014406 Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil |
08/16/2001 | US20010014212 Fibrous supported polymer encapsulated electrical component |
08/16/2001 | US20010014016 Electronic circuit package assembly and method of producing the same |
08/16/2001 | US20010014015 Electronic package with stacked connections and method for making same |
08/16/2001 | US20010014014 Casing for an electronic unit |
08/16/2001 | US20010014004 Parallel plate buried capacitor |
08/16/2001 | US20010013832 Device and method for monitoring the operation of an industrial installation |
08/16/2001 | US20010013783 Circuit board testing apparatus and method |
08/16/2001 | US20010013653 Array of electrodes reliable, durable and economical and process for fabrication thereof |
08/16/2001 | US20010013650 Circuit interconnect providing reduced crosstalk and simultaneous switching noise |
08/16/2001 | US20010013535 Method of connecting circuit boards |
08/16/2001 | US20010013473 Pre-plate treating system |
08/16/2001 | US20010013472 Forming copper film on insulation layer; immersion in solution of plating promoter; removing promoter from copper film leaving it on side walls and bottoms of via holes; electroplating to fill holes; improvement over planarization |
08/16/2001 | US20010013425 Multilayered Substrate for Semiconductor Device |
08/16/2001 | US20010013423 Flip chip attach on flexible circuit carrier using chip with metallic cap on solder |
08/16/2001 | US20010013421 Leaded semiconductor device package for use in nonsoldering assembling |
08/16/2001 | US20010013171 Method and equipment for removing insulation from a flat cable |
08/16/2001 | US20010013170 Component alignment methods |
08/16/2001 | EP1124297A1 Method and device for stripping of a flat cable |
08/16/2001 | EP1124264A2 Method of manufacturing transparent conducting structures and use of transparent conducting oxide layers to pattern transparent conducting regions |
08/16/2001 | EP1123988A1 Method of forming chromium coated copper for printed circuit boards |
08/16/2001 | EP1123753A2 Mesoporous ceramic films having reduced dielectric constants |
08/16/2001 | EP1123644A1 Method for producing multi-layer circuits |
08/16/2001 | EP1123643A1 Printed board assembly and method of its manufacture |
08/16/2001 | EP1123525A1 Device and method for the optical inspection of concealed soldered connections |
08/16/2001 | EP1123512A1 High density printed circuit board |