Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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08/29/2001 | CN1310653A Device for the laser processing of workpieces |
08/29/2001 | CN1310580A Electronic element and its producing method |
08/29/2001 | CN1310494A 直角连接器 Right angle connector |
08/29/2001 | CN1310475A Installation structure of semi-conductor apparatus, electro-optical apparatus and electronic apparatus |
08/29/2001 | CN1310474A Large power semiconductor assembly capable of relieving mechanical stress |
08/29/2001 | CN1310469A Integrated circuit assembly band and its producing method |
08/29/2001 | CN1070211C Photopolymerisable composition |
08/28/2001 | US6281844 Electrical component and an electrical circuit module having connected ground planes |
08/28/2001 | US6281842 Conductive circuit device and method |
08/28/2001 | US6281693 Semiconductor device test board and a method of testing a semiconductor device |
08/28/2001 | US6281581 Substrate structure for improving attachment reliability of semiconductor chips and modules |
08/28/2001 | US6281571 Semiconductor device having an external connection electrode extending through a through hole formed in a substrate |
08/28/2001 | US6281452 Multi-level thin-film electronic packaging structure and related method |
08/28/2001 | US6281450 Substrate for mounting semiconductor chips |
08/28/2001 | US6281449 Printed board, manufacturing method therefor and structure for connecting conductor elements to the printed board |
08/28/2001 | US6281448 Printed circuit board and electronic components |
08/28/2001 | US6281445 Device and method for connecting two electronic components |
08/28/2001 | US6281436 Encapsulated surface mounting electronic part |
08/28/2001 | US6281435 Chip-type electronic devices |
08/28/2001 | US6281275 Polymeric coating compositions, polymer coated substrates, and methods of making and using the same |
08/28/2001 | US6281157 Bath comprising nickel sulfate, sodium hypophosphite as a reducing agent, acetic acid as a buffer, traces of lead as a stabilizer, a citrate used as a complexing agent and associated with a gluconate |
08/28/2001 | US6281107 Semiconductor device and method for manufacturing the same |
08/28/2001 | US6281106 Method of solder bumping a circuit component |
08/28/2001 | US6281105 Unzippable polymer selected from the group consisting of poly-alpha-methylstyrene, polypropylene carbonate, polyethylene carbonate and polychloral dissolved in said solvent |
08/28/2001 | US6281090 Method for the manufacture of printed circuit boards with plated resistors |
08/28/2001 | US6281041 Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball |
08/28/2001 | US6281040 Methods for making circuit substrates and electrical assemblies |
08/28/2001 | US6281026 Semiconductor device and method for manufacturing the same |
08/28/2001 | US6280907 Forming a polymer, thick film resistors on printed circuits for photoresists |
08/28/2001 | US6280858 Substrate with solder alloy for mounting electronic parts |
08/28/2001 | US6280851 Multilayer product for printed circuit boards |
08/28/2001 | US6280828 Flexible wiring board |
08/28/2001 | US6280641 Providing coating or sheet, carbon powder and metal powder on copper foil as outermost layer of copper-clad laminate; irradiating with carbon dioxide laser to remove micro-via-hole forming portion of copper foil; irradiating resin layer |
08/28/2001 | US6280640 Providing layers of copper conductors on base; electrically connecting layers of copper conductors by aluminum studs; providing barrier metal mask; anodizing unprotected aluminum; removing aluminum oxide; etching copper conductor; polishing |
08/28/2001 | US6280564 Robot mounter for mounting core slider |
08/28/2001 | US6280555 Method of forming a printed circuit board |
08/28/2001 | US6280552 Method of applying and edge electrode pattern to a touch screen and a decal for a touch screen |
08/28/2001 | US6280527 Aqueous quaternary ammonium hydroxide as a screening mask cleaner |
08/28/2001 | US6280248 Hold-down element for electrical and/or electronic components |
08/28/2001 | US6280246 Securing structure of connector |
08/28/2001 | US6280207 Intermediate electrical connector |
08/28/2001 | US6280205 Surface-mounted type connector and method for producing circuit device including the same |
08/28/2001 | US6280201 Laminated 90-degree connector |
08/28/2001 | US6279816 Apparatus and process for mounting conductor balls on terminal pads of semiconductor devices |
08/28/2001 | US6279814 Soldering apparatus for providing a fixed quantity of solder piece onto target plate |
08/28/2001 | US6279563 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
08/28/2001 | US6279227 Method of forming a resilient contact structure |
08/23/2001 | WO2001062055A1 Method of manufacturing wiring board |
08/23/2001 | WO2001061781A1 Antenna spring for electrical connection of a circuit board with an antenna |
08/23/2001 | WO2001061753A1 Electronic component comprising an electrically conductive connection consisting of carbon nanotubes and a method for producing the same |
08/23/2001 | WO2001061744A1 Method for manufacturing semiconductor device |
08/23/2001 | WO2001061732A2 Device for protecting an electric and/or electronic component arranged on a carrier substrate against electrostatic discharges |
08/23/2001 | WO2001061079A1 Process for electroplating a work piece coated with an electrically conducting polymer |
08/23/2001 | WO2001060559A1 A method of mixing solder paste |
08/23/2001 | US20010016436 Contact-making device, in particular for making contact between electrical components and lead frames, and process for its production |
08/23/2001 | US20010016247 Laminate structure and method of manufacturing the same |
08/23/2001 | US20010016232 Immersion silver plating solution containing additives |
08/23/2001 | US20010015891 FPC for mounting components and spread illuminating apparatus using the same |
08/23/2001 | US20010015888 Sub-modular configurable avionics |
08/23/2001 | US20010015687 Low profile mount for metal oxide varistor package with short circuit protection and method |
08/23/2001 | US20010015686 Low profile mount for plural upper electrode metal oxide varistor package and method |
08/23/2001 | US20010015685 Low profile mount for plural lower electrode metal oxide varistor package and method |
08/23/2001 | US20010015684 Circuit board and method of manufacturing therefor |
08/23/2001 | US20010015655 Removable electrical interconnect apparatuses and removable engagement probes |
08/23/2001 | US20010015652 Probe card assembly and kit, and methods of making same |
08/23/2001 | US20010015641 Circuit board testing apparatus |
08/23/2001 | US20010015497 Integrated circuit package, ball-grid array integrated circuit package and methods of packaging an integrated circuit |
08/23/2001 | US20010015495 Process for forming cone shaped solder for chip interconnection |
08/23/2001 | US20010015491 Printed-wiring substrate having lead pins |
08/23/2001 | US20010015424 A conductive adhesive comprising a thermoplastic or thermosetting binder resin contains a functional group in its molecular chain that forms multidentate bonding with electrode metal after binder is adhered, and a metal filler |
08/23/2001 | US20010015373 High density connector having a ball type of contact surface |
08/23/2001 | US20010015372 Apparatus for transferring micro-balls |
08/23/2001 | US20010015368 Soldering machine |
08/23/2001 | US20010015347 Connection structure and method for connecting printed circuit and metal terminal, and reinforcing structure and method for reinforcing junction therebetween |
08/23/2001 | US20010015321 Contacting the surface with an electroplating solution comprising metal ions, a suppressor, an accelerator and a leveler additives, in succession applying direct cathodic current density optimized to form conformal thin film |
08/23/2001 | US20010015289 Circuit board with an air-wound coil for vacuum pick-up, surface mounting, and adjusting |
08/23/2001 | US20010015288 Microcircuit shielded, controlled impedance "gatling gun" via |
08/23/2001 | US20010015287 Printed circuit boards having at least one metal layer |
08/23/2001 | US20010015286 Method of surface- mounting electronic components |
08/23/2001 | US20010015285 Semiconductor device |
08/23/2001 | US20010015257 Contacting copper foil with an inert silane, titanate or zirconate compound to form a resin dust resistant film, laminating metal foil to a resin selected from polyimde, polyester or epoxy resin |
08/23/2001 | US20010015250 Laminated ceramic electronic components and manufacturing method therefor |
08/23/2001 | US20010015012 Structure of conductive bump in wiring board |
08/23/2001 | US20010015010 Method of manufacturing bump-component mounted body and device for manufacturing the same |
08/23/2001 | US20010015008 Process for fabricating a thin multi-layer circuit board |
08/23/2001 | DE19956498A1 Anordnung eines Relais mit einem Adaptersockel Arrangement of a relay with an adapter socket |
08/23/2001 | DE10065019A1 Einrichtung zum Schutz eines auf einem Trägersubstrat angeordneten elektrischen und/oder elektronischen Bauteils vor elektrostatischen Entladungen Device for protecting an object arranged on a supporting substrate electric and / or electronic component against electrostatic discharges |
08/23/2001 | DE10063944A1 Steuergerät für ein Schließsystem in einem Kraftfahrzeug Control unit for a locking system in a motor vehicle |
08/23/2001 | DE10007435A1 Verfahren zum Galvanisieren eines mit einem elektrisch leitenden Polymer beschichteten Werkstücks A method for electroplating a substrate coated with an electrically conductive polymer workpiece |
08/23/2001 | DE10005836A1 Electrical or electronic device, e.g. voltage adapter for lamp, has circuit board carrying conductor to be protected with reduced cross-section burn-through region |
08/23/2001 | CA2369687A1 Process for electroplating a work piece coated with an electrically conducting polymer |
08/22/2001 | EP1126752A2 Chip scale packaging on CTE matched printed wiring boards |
08/22/2001 | EP1126565A1 Casing for an electronic unit |
08/22/2001 | EP1126562A1 Conducting guide plate |
08/22/2001 | EP1126517A2 Method for flip-chip assembly of semiconductor devices using adhesives |
08/22/2001 | EP1126512A2 Wafer plating method and apparatus |
08/22/2001 | EP1126319A1 Photosensitive resin composition and method of improving dry etching resistance of photosensitive resin composition |
08/22/2001 | EP1126016A2 Solvent compositions |
08/22/2001 | EP1125669A2 Holes fill up method and apparatus |
08/22/2001 | EP1125483A1 Case for circuit board for horizontal or vertical mounting |