Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2001
08/29/2001CN1310653A Device for the laser processing of workpieces
08/29/2001CN1310580A Electronic element and its producing method
08/29/2001CN1310494A 直角连接器 Right angle connector
08/29/2001CN1310475A Installation structure of semi-conductor apparatus, electro-optical apparatus and electronic apparatus
08/29/2001CN1310474A Large power semiconductor assembly capable of relieving mechanical stress
08/29/2001CN1310469A Integrated circuit assembly band and its producing method
08/29/2001CN1070211C Photopolymerisable composition
08/28/2001US6281844 Electrical component and an electrical circuit module having connected ground planes
08/28/2001US6281842 Conductive circuit device and method
08/28/2001US6281693 Semiconductor device test board and a method of testing a semiconductor device
08/28/2001US6281581 Substrate structure for improving attachment reliability of semiconductor chips and modules
08/28/2001US6281571 Semiconductor device having an external connection electrode extending through a through hole formed in a substrate
08/28/2001US6281452 Multi-level thin-film electronic packaging structure and related method
08/28/2001US6281450 Substrate for mounting semiconductor chips
08/28/2001US6281449 Printed board, manufacturing method therefor and structure for connecting conductor elements to the printed board
08/28/2001US6281448 Printed circuit board and electronic components
08/28/2001US6281445 Device and method for connecting two electronic components
08/28/2001US6281436 Encapsulated surface mounting electronic part
08/28/2001US6281435 Chip-type electronic devices
08/28/2001US6281275 Polymeric coating compositions, polymer coated substrates, and methods of making and using the same
08/28/2001US6281157 Bath comprising nickel sulfate, sodium hypophosphite as a reducing agent, acetic acid as a buffer, traces of lead as a stabilizer, a citrate used as a complexing agent and associated with a gluconate
08/28/2001US6281107 Semiconductor device and method for manufacturing the same
08/28/2001US6281106 Method of solder bumping a circuit component
08/28/2001US6281105 Unzippable polymer selected from the group consisting of poly-alpha-methylstyrene, polypropylene carbonate, polyethylene carbonate and polychloral dissolved in said solvent
08/28/2001US6281090 Method for the manufacture of printed circuit boards with plated resistors
08/28/2001US6281041 Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball
08/28/2001US6281040 Methods for making circuit substrates and electrical assemblies
08/28/2001US6281026 Semiconductor device and method for manufacturing the same
08/28/2001US6280907 Forming a polymer, thick film resistors on printed circuits for photoresists
08/28/2001US6280858 Substrate with solder alloy for mounting electronic parts
08/28/2001US6280851 Multilayer product for printed circuit boards
08/28/2001US6280828 Flexible wiring board
08/28/2001US6280641 Providing coating or sheet, carbon powder and metal powder on copper foil as outermost layer of copper-clad laminate; irradiating with carbon dioxide laser to remove micro-via-hole forming portion of copper foil; irradiating resin layer
08/28/2001US6280640 Providing layers of copper conductors on base; electrically connecting layers of copper conductors by aluminum studs; providing barrier metal mask; anodizing unprotected aluminum; removing aluminum oxide; etching copper conductor; polishing
08/28/2001US6280564 Robot mounter for mounting core slider
08/28/2001US6280555 Method of forming a printed circuit board
08/28/2001US6280552 Method of applying and edge electrode pattern to a touch screen and a decal for a touch screen
08/28/2001US6280527 Aqueous quaternary ammonium hydroxide as a screening mask cleaner
08/28/2001US6280248 Hold-down element for electrical and/or electronic components
08/28/2001US6280246 Securing structure of connector
08/28/2001US6280207 Intermediate electrical connector
08/28/2001US6280205 Surface-mounted type connector and method for producing circuit device including the same
08/28/2001US6280201 Laminated 90-degree connector
08/28/2001US6279816 Apparatus and process for mounting conductor balls on terminal pads of semiconductor devices
08/28/2001US6279814 Soldering apparatus for providing a fixed quantity of solder piece onto target plate
08/28/2001US6279563 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
08/28/2001US6279227 Method of forming a resilient contact structure
08/23/2001WO2001062055A1 Method of manufacturing wiring board
08/23/2001WO2001061781A1 Antenna spring for electrical connection of a circuit board with an antenna
08/23/2001WO2001061753A1 Electronic component comprising an electrically conductive connection consisting of carbon nanotubes and a method for producing the same
08/23/2001WO2001061744A1 Method for manufacturing semiconductor device
08/23/2001WO2001061732A2 Device for protecting an electric and/or electronic component arranged on a carrier substrate against electrostatic discharges
08/23/2001WO2001061079A1 Process for electroplating a work piece coated with an electrically conducting polymer
08/23/2001WO2001060559A1 A method of mixing solder paste
08/23/2001US20010016436 Contact-making device, in particular for making contact between electrical components and lead frames, and process for its production
08/23/2001US20010016247 Laminate structure and method of manufacturing the same
08/23/2001US20010016232 Immersion silver plating solution containing additives
08/23/2001US20010015891 FPC for mounting components and spread illuminating apparatus using the same
08/23/2001US20010015888 Sub-modular configurable avionics
08/23/2001US20010015687 Low profile mount for metal oxide varistor package with short circuit protection and method
08/23/2001US20010015686 Low profile mount for plural upper electrode metal oxide varistor package and method
08/23/2001US20010015685 Low profile mount for plural lower electrode metal oxide varistor package and method
08/23/2001US20010015684 Circuit board and method of manufacturing therefor
08/23/2001US20010015655 Removable electrical interconnect apparatuses and removable engagement probes
08/23/2001US20010015652 Probe card assembly and kit, and methods of making same
08/23/2001US20010015641 Circuit board testing apparatus
08/23/2001US20010015497 Integrated circuit package, ball-grid array integrated circuit package and methods of packaging an integrated circuit
08/23/2001US20010015495 Process for forming cone shaped solder for chip interconnection
08/23/2001US20010015491 Printed-wiring substrate having lead pins
08/23/2001US20010015424 A conductive adhesive comprising a thermoplastic or thermosetting binder resin contains a functional group in its molecular chain that forms multidentate bonding with electrode metal after binder is adhered, and a metal filler
08/23/2001US20010015373 High density connector having a ball type of contact surface
08/23/2001US20010015372 Apparatus for transferring micro-balls
08/23/2001US20010015368 Soldering machine
08/23/2001US20010015347 Connection structure and method for connecting printed circuit and metal terminal, and reinforcing structure and method for reinforcing junction therebetween
08/23/2001US20010015321 Contacting the surface with an electroplating solution comprising metal ions, a suppressor, an accelerator and a leveler additives, in succession applying direct cathodic current density optimized to form conformal thin film
08/23/2001US20010015289 Circuit board with an air-wound coil for vacuum pick-up, surface mounting, and adjusting
08/23/2001US20010015288 Microcircuit shielded, controlled impedance "gatling gun" via
08/23/2001US20010015287 Printed circuit boards having at least one metal layer
08/23/2001US20010015286 Method of surface- mounting electronic components
08/23/2001US20010015285 Semiconductor device
08/23/2001US20010015257 Contacting copper foil with an inert silane, titanate or zirconate compound to form a resin dust resistant film, laminating metal foil to a resin selected from polyimde, polyester or epoxy resin
08/23/2001US20010015250 Laminated ceramic electronic components and manufacturing method therefor
08/23/2001US20010015012 Structure of conductive bump in wiring board
08/23/2001US20010015010 Method of manufacturing bump-component mounted body and device for manufacturing the same
08/23/2001US20010015008 Process for fabricating a thin multi-layer circuit board
08/23/2001DE19956498A1 Anordnung eines Relais mit einem Adaptersockel Arrangement of a relay with an adapter socket
08/23/2001DE10065019A1 Einrichtung zum Schutz eines auf einem Trägersubstrat angeordneten elektrischen und/oder elektronischen Bauteils vor elektrostatischen Entladungen Device for protecting an object arranged on a supporting substrate electric and / or electronic component against electrostatic discharges
08/23/2001DE10063944A1 Steuergerät für ein Schließsystem in einem Kraftfahrzeug Control unit for a locking system in a motor vehicle
08/23/2001DE10007435A1 Verfahren zum Galvanisieren eines mit einem elektrisch leitenden Polymer beschichteten Werkstücks A method for electroplating a substrate coated with an electrically conductive polymer workpiece
08/23/2001DE10005836A1 Electrical or electronic device, e.g. voltage adapter for lamp, has circuit board carrying conductor to be protected with reduced cross-section burn-through region
08/23/2001CA2369687A1 Process for electroplating a work piece coated with an electrically conducting polymer
08/22/2001EP1126752A2 Chip scale packaging on CTE matched printed wiring boards
08/22/2001EP1126565A1 Casing for an electronic unit
08/22/2001EP1126562A1 Conducting guide plate
08/22/2001EP1126517A2 Method for flip-chip assembly of semiconductor devices using adhesives
08/22/2001EP1126512A2 Wafer plating method and apparatus
08/22/2001EP1126319A1 Photosensitive resin composition and method of improving dry etching resistance of photosensitive resin composition
08/22/2001EP1126016A2 Solvent compositions
08/22/2001EP1125669A2 Holes fill up method and apparatus
08/22/2001EP1125483A1 Case for circuit board for horizontal or vertical mounting