| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/04/2001 | US6285086 Semiconductor device and substrate for semiconductor device |
| 09/04/2001 | US6285083 Comprising a metallic bump (nickel or copper) electrically connecting the electrode of the semiconductor to conductive pad, increasing melting point and fatigue resistance |
| 09/04/2001 | US6285081 Deflectable interconnect |
| 09/04/2001 | US6285080 Planar metallized substrate with embedded camber control material and method thereof |
| 09/04/2001 | US6285079 Semiconductor device employing grid array electrodes and compact chip-size package |
| 09/04/2001 | US6285000 Laser processing device |
| 09/04/2001 | US6284998 Method for laser soldering a three dimensional component |
| 09/04/2001 | US6284996 Method for mounting integrated circuits on printed circuit boards |
| 09/04/2001 | US6284985 Ceramic circuit board with a metal plate projected to prevent solder-flow |
| 09/04/2001 | US6284984 Printed circuit board, for mounting BGA elements and a manufacturing method of a printed circuit board for mounting BGA elements |
| 09/04/2001 | US6284983 Multifunctional printed circuit board with an opto-electronically active component |
| 09/04/2001 | US6284982 Method and component for forming an embedded resistor in a multi-layer printed circuit |
| 09/04/2001 | US6284981 Element and method for securing a circuit component to a circuit board |
| 09/04/2001 | US6284827 Having a reduced content of fluoride ions extractable with water; magnesium compound |
| 09/04/2001 | US6284381 Polymerizable compositions made with polymerization initiator systems based on organoborane amine complexes |
| 09/04/2001 | US6284353 Printed wiring board and method of manufacturing the same |
| 09/04/2001 | US6284329 Method of forming adherent metal components on a polyimide substrate |
| 09/04/2001 | US6284309 Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom |
| 09/04/2001 | US6284308 Manufacturing method of printed circuit board |
| 09/04/2001 | US6284121 Additive molecules are absorbed by exterior surface relative to interior |
| 09/04/2001 | US6284086 Apparatus and method for attaching a microelectronic device to a carrier using a photo initiated anisotropic conductive adhesive |
| 09/04/2001 | US6284080 Barrier metallization in ceramic substrate for implantable medical devices |
| 09/04/2001 | US6284079 Method and structure to reduce low force pin pull failures in ceramic substrates |
| 09/04/2001 | US6284072 Multifunctional microstructures and preparation thereof |
| 09/04/2001 | US6284057 Solder and soldering method |
| 09/04/2001 | US6283681 Method and device for aligning a workpiece on a machine tool table |
| 09/04/2001 | US6283379 Method for correlating processor and part temperatures using an air temperature sensor for a conveyorized thermal processor |
| 09/04/2001 | US6283360 Soldering an electron part or printed board via forming a coating film comprising a polymer containing units of an unsaturated ester containing fluoroalkyl groups, a fluorine-type surfactant, and an aqueous medium |
| 09/04/2001 | US6283359 Method for enhancing fatigue life of ball grid arrays |
| 09/04/2001 | US6283358 System for forming contacts on a semiconductor component by aligning and attaching ferromagnetic balls |
| 09/04/2001 | US6282782 Forming plugs in vias of circuit board layers and subassemblies |
| 09/04/2001 | CA2232647C Method for joining members at ordinary temperature |
| 08/30/2001 | WO2001063996A2 Electronic printed-circuit board for electronic devices, especially communications terminals |
| 08/30/2001 | WO2001063994A2 Tamper proof case for electronic devices having memories with sensitive information |
| 08/30/2001 | WO2001063993A1 Printed wiring board with controlled line impedance |
| 08/30/2001 | WO2001063992A1 Alignment plate with matched thermal coefficient of expansion |
| 08/30/2001 | WO2001063990A1 Composite material and method of manufacturing multilayer circuit board |
| 08/30/2001 | WO2001063989A1 Bond ply structure and associated process for interconnection of circuit layer pairs with conductive inks |
| 08/30/2001 | WO2001063988A1 Method of printing and printing machine |
| 08/30/2001 | WO2001063987A1 Dielectric processing with included stabilization periods |
| 08/30/2001 | WO2001063986A1 Electronic supports and methods and apparatus for forming apertures in electronic supports |
| 08/30/2001 | WO2001063985A2 Electronic supports and methods and apparatus for forming apertures in electronic supports |
| 08/30/2001 | WO2001063984A1 Electronic supports and methods and apparatus for forming apertures in electronic supports |
| 08/30/2001 | WO2001063668A2 Method of forming lead-free solder alloys by electrochemical deposition process |
| 08/30/2001 | WO2001063016A1 Composite copper foil and manufacturing method thereof |
| 08/30/2001 | WO2001063001A2 Laser deposition process |
| 08/30/2001 | WO2001062828A1 Modified polyphenylene ether |
| 08/30/2001 | WO2001062433A1 A control method for copper content in a solder dipping bath |
| 08/30/2001 | WO2001009980A3 Controlled compliance fine pitch interconnect |
| 08/30/2001 | WO2000048845A9 Improved stencil |
| 08/30/2001 | US20010018761 Design assisting system and design assisting method |
| 08/30/2001 | US20010018477 Adhesive composition |
| 08/30/2001 | US20010018320 Chemical planar head dampening system |
| 08/30/2001 | US20010018263 Bump-forming method using two plates and electronic device |
| 08/30/2001 | US20010018234 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components |
| 08/30/2001 | US20010018230 Flip chip C4 extension structure and process |
| 08/30/2001 | US20010018131 Oxidation resistance |
| 08/30/2001 | US20010018122 Epoxy resin blend |
| 08/30/2001 | US20010018030 A solder comprising 2.0 to 3.5 wt % of silver, 5 to 18 wt % of bismuth and rest is tin; used for soldering an electronic part to a circuit board |
| 08/30/2001 | US20010017987 Device and method for electrically connecting flexible printed wiring boards |
| 08/30/2001 | US20010017923 Electroacoustic transducer |
| 08/30/2001 | US20010017770 Module with thin-film circuit |
| 08/30/2001 | US20010017768 Soldermask opening to prevent delamination |
| 08/30/2001 | US20010017690 Method and device for exposing both sides of a sheet |
| 08/30/2001 | US20010017425 Mounting structure of semiconductor device and mounting method thereof |
| 08/30/2001 | US20010017413 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components |
| 08/30/2001 | US20010017373 Diamond interconnection substrate and a manufacturing method therefor |
| 08/30/2001 | US20010017221 Wiring boards, semiconductor devices and their production processes |
| 08/30/2001 | US20010017191 Apparatus for removing a coating film |
| 08/30/2001 | US20010017142 Method of washing substrate with UV radiation and ultrasonic cleaning |
| 08/30/2001 | US20010017086 Screen printing method and screen printing apparatus |
| 08/30/2001 | US20010016982 Ablative method for forming RF ceramic block filters |
| 08/30/2001 | US20010016980 Multi-layer circuit board with supporting layers of different materials |
| 08/30/2001 | DE19945914C1 Verfahren zur Erzeugung von präzisen Lötflächen auf einem Schaltungsträger, insbesondere Dünnfilm-Substrat A method for generating precision soldering areas on a circuit carrier, in particular thin-film-substrate |
| 08/30/2001 | DE19861112A1 Gehäuse mit einem Kontaktbereich Housing with a contact portion |
| 08/30/2001 | DE10043127A1 Infrarot-Daten-Kommunikationsmodul und Verfahren zu dessen Herstellung Infrared data communication module and method for its production |
| 08/30/2001 | DE10009509A1 Verbindungselement zum Verbinden zweier Leiterplatten Connecting element for connecting two printed circuit boards |
| 08/30/2001 | DE10008340A1 Elektronische Flachbaugruppe für elektronische Geräte, insbesondere Kommunikationsendgeräte Electronic PCB for electronic devices, particularly communication terminals |
| 08/30/2001 | DE10007967A1 Mehrschichtige Anordnung elektrischer Leiter mit integrierter Stromerfassung Multi-layered arrangement of electrical conductors with integrated current detection |
| 08/30/2001 | DE10000090A1 Electrical connecting element production method has embossed substrate provided with selectively etched conductive galvanic coating |
| 08/30/2001 | CA2400790A1 Electronic supports and methods and apparatus for forming apertures in electronic supports |
| 08/30/2001 | CA2400787A1 Electronic supports and methods and apparatus for forming apertures in electronic supports |
| 08/29/2001 | EP1128714A1 Circuit board assembly |
| 08/29/2001 | EP1128475A2 Right angle connector |
| 08/29/2001 | EP1128326A2 Circuit module |
| 08/29/2001 | EP1127479A1 An electrical component and an electrical circuit module having connected ground planes |
| 08/29/2001 | EP1127387A1 Non-circular micro-via |
| 08/29/2001 | EP1127287A1 Device for thermally, stably supporting a miniaturised component |
| 08/29/2001 | EP1127285A1 Electro-optic module and method for the production thereof |
| 08/29/2001 | EP1126973A1 Electrically conductive adhesive transfers |
| 08/29/2001 | EP1002451A4 Circuit board mount |
| 08/29/2001 | EP0951807B1 Improvements in or relating to thermal trip arrangements |
| 08/29/2001 | EP0858488B1 Reactive hot melt composition, composition for preparation of reactive hot melt composition, and film-form hot melt adhesive |
| 08/29/2001 | CN2445544Y Six-layer circuit board |
| 08/29/2001 | CN2444690Y Feed mechanism of circuit board cutting machine |
| 08/29/2001 | CN1310871A Laser repetition rate multiplier |
| 08/29/2001 | CN1310859A A method for providing an electrical ground connection between a printed circuit board and a metallic substrate |
| 08/29/2001 | CN1310848A Anisotropically conductive paste |
| 08/29/2001 | CN1310835A Electrical connection structure and flat display device |
| 08/29/2001 | CN1310666A Phenol-novolacs with improved optical properties |