Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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09/12/2001 | CN1312673A Electronic element with protective box and production method thereof |
09/12/2001 | CN1312671A Multi-layer flexible wiring board and its production method |
09/12/2001 | CN1312670A Formation of metal interconnection structure |
09/12/2001 | CN1312565A Insulator ceramic composition |
09/12/2001 | CN1070769C Heat-resisting cushion material and producing method |
09/11/2001 | US6289306 Data processing of a bitstream signal |
09/11/2001 | US6288924 Semiconductor device and process for manufacturing the same |
09/11/2001 | US6288906 Multiple layer printed circuit board having power planes on outer layers |
09/11/2001 | US6288905 Contact module, as for a smart card, and method for making same |
09/11/2001 | US6288887 Ceramic electronic component |
09/11/2001 | US6288650 Device and method for monitoring the operation of an industrial installation |
09/11/2001 | US6288627 Embedded trimmable resistors |
09/11/2001 | US6288562 Test pin for a printed circuit board |
09/11/2001 | US6288559 Semiconductor testing using electrically conductive adhesives |
09/11/2001 | US6288386 Circuit having a flexible printed circuit board for electronically controlling a night vision device and night vision device including the same |
09/11/2001 | US6288360 Excimer laser ablation process control of multilaminate materials |
09/11/2001 | US6288346 System and method for easily inspecting a bonded state of a BGA/CSP type electronic part to a board |
09/11/2001 | US6288345 Compact z-axis DC and control signals routing substrate |
09/11/2001 | US6288343 Printed circuit board |
09/11/2001 | US6287895 Semiconductor package having enhanced ball grid array protective dummy members |
09/11/2001 | US6287891 Method for transferring semiconductor device layers to different substrates |
09/11/2001 | US6287503 Method for encasing array packages |
09/11/2001 | US6287444 Method for producing very small metal ball |
09/11/2001 | US6286424 Plastic mask unit for paste printing and method of fabricating such plastic mask unit |
09/11/2001 | US6286422 Method and apparatus for dispensing viscous material |
09/11/2001 | US6286208 Interconnector with contact pads having enhanced durability |
09/11/2001 | US6286207 Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it |
09/11/2001 | US6286206 Heat-resistant electronic systems and circuit boards |
09/11/2001 | US6286205 Method for making connections to a microelectronic device having bump leads |
09/11/2001 | US6286204 Method for fabricating double sided ceramic circuit boards using a titanium support substrate |
09/11/2001 | US6286202 System for mounting a plurality of circuit components on a circuit substrate |
09/07/2001 | WO2001065896A1 Direct electrostatic printing method and device for manufacturing printed circuit boards |
09/07/2001 | WO2001065602A1 Wiring board, semiconductor device, and method of manufacturing wiring board |
09/07/2001 | WO2001065595A2 A method of forming an opening or cavity in a substrate for receiving an electronic component |
09/07/2001 | WO2001065574A1 Coil assembly with a circuit board and a coil body |
09/07/2001 | WO2001065344A2 Method and apparatus for providing power to a microprocessor with integrated thermal and emi management |
09/07/2001 | WO2001065294A2 Apparatus and packaging method to assemble optical modules to a common substrate with adjustable plugs |
09/07/2001 | WO2001064807A1 Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same |
09/07/2001 | WO2001064433A1 Carrier foil-pasted metal foil and production method thereof |
09/07/2001 | WO2001064411A1 Method for producing prepreg, preprig, metal-clad laminate and printed wiring board |
09/07/2001 | WO2001012433A3 Nanostructure coatings |
09/07/2001 | WO2001011676A3 Sputtering process |
09/07/2001 | CA2400568A1 Method and apparatus for providing power to a microprocessor with integrated thermal and emi management |
09/06/2001 | US20010020071 Thermosetting resins |
09/06/2001 | US20010019854 Low-pin-count chip package and manufacturing method thereof |
09/06/2001 | US20010019780 Preventing wrinkling |
09/06/2001 | US20010019744 Process for plating metal coatings |
09/06/2001 | US20010019739 On synthetic resin substrates |
09/06/2001 | US20010019686 Pinted board processing machine |
09/06/2001 | US20010019476 Construction of fixing flexible sheet on electronic device |
09/06/2001 | US20010019301 Thin-film resistor, wiring substrate, and method for manufacturing the same |
09/06/2001 | US20010019298 Structure of making a thick film low value high frequency inductor |
09/06/2001 | US20010019178 Method of interconnecting electronic components using a plurality of conductive studs |
09/06/2001 | US20010019177 Method of manufacturing a contact element and a multi-layered wiring substrate, and wafer batch contact board |
09/06/2001 | US20010019176 Chip-type electronic component |
09/06/2001 | US20010019171 Package for semiconductor chip |
09/06/2001 | US20010019075 Thermosetting soldering flux and soldering process |
09/06/2001 | US20010018986 Resin compound, and adhesive film, metal-clad adhesive film, circuit board, and assembly structure, using the resin compound |
09/06/2001 | US20010018985 High-frequency circuit board and method of producing the same |
09/06/2001 | US20010018983 Multilayer integrated substrate and manufacturing method for multilayer ceramic element |
09/06/2001 | US20010018982 Circuit board having bonding areas to be joined with bumps by ultrasonic bonding |
09/06/2001 | US20010018851 Drops of liquid metal are emitted from an acoustic device through an inert gas; the inert gas prevents formation of an oxide skin; drops can form solder bumps, circuit traces, or a three-dimensional device |
09/06/2001 | US20010018799 Method of forming a chip carrier by joining a laminate layer and stiffener |
09/06/2001 | US20010018797 Low temperature co-fired ceramic with improved registration |
09/06/2001 | US20010018796 Method of forming multilayer circuit structure |
09/06/2001 | DE10062109A1 Electric system module for electronic products, has power pins and signal pins arranged on three edges of case |
09/06/2001 | DE10008569A1 Substrate for power semiconductor device |
09/06/2001 | DE10007414A1 Process for through-plating a substrate comprises forming a through-hole in a metal plate in orientation with the through-hole of a ceramic plate, applying a solder paste to one side of the substrate, and passing through an oven |
09/06/2001 | DE10005330A1 Verfahren zur Herstellung von leitfähigen transparenten Strukturen sowie Verwendung von transparenten, leitfähigen Oxidschichten zur Strukturierung von leitfähigen, transparenten Bereichen A process for preparing conductive transparent structures as well as use of transparent conductive oxide layers for patterning conductive transparent areas |
09/05/2001 | EP1130530A2 Part marking method applicable to industrial parts |
09/05/2001 | EP1130473A2 A system, method and article of manufacture for direct image processing of printed circuit boards |
09/05/2001 | EP1129605A1 Edge connectors for printed circuit boards comprising conductive ink |
09/05/2001 | EP1129511A1 Electric components for printed boards and method for automatically inserting said components in printed boards |
09/05/2001 | EP1129480A1 Semiconductor copper bond pad surface protection |
09/05/2001 | EP1129050A1 Paste for screenprinting electric structures onto carrier substrates |
09/05/2001 | EP1129048A1 Composite plate and method for producing and using such a composite plate |
09/05/2001 | EP1129003A1 Improvements relating to power steering |
09/05/2001 | EP0852897B1 Method for surface mounting a heatsink to a printed circuit board |
09/05/2001 | CN2446748Y Circuit board cleaner |
09/05/2001 | CN2445847Y Tin furnace appts. |
09/05/2001 | CN1311977A Clad board for printed-circuit board, multilayered printed-circuit board, and method for mfg. same |
09/05/2001 | CN1311909A Connector with two rows of terminals having tail portions with smilar impadance |
09/05/2001 | CN1311900A Device for electronic packaging, pin jig fixture |
09/05/2001 | CN1311899A Catacitive mounting arrangement for securing an integrated circuit package to a heat sink |
09/05/2001 | CN1311897A Misted precursor deposition apparatus and method with improved mist and mist flow |
09/05/2001 | CN1311625A Nano stack film circuit material |
09/05/2001 | CN1311526A Method for mfg. conductive seat used for electric connection and formed conductive seat therefor |
09/05/2001 | CN1311511A Aeolotropic conductive adhering film |
09/05/2001 | CN1311506A Electroacoustic transducer |
09/05/2001 | CN1311077A Soldering agent composition used for soldering paste |
09/04/2001 | US6285560 Method for increasing device reliability by selectively depopulating solder balls from a foot print of a ball grid array (BGA) package, and device so modified |
09/04/2001 | US6285558 Microprocessor subsystem module for PCB bottom-side BGA installation |
09/04/2001 | US6285554 Method and an arrangement for the electrical contact of components |
09/04/2001 | US6285551 Overmolded electronic assembly |
09/04/2001 | US6285542 Ultra-small resistor-capacitor thin film network for inverted mounting to a surface |
09/04/2001 | US6285433 Method for mounting TCP film to display panel |
09/04/2001 | US6285275 Surface mountable electrical device |
09/04/2001 | US6285272 Low profile inductive component |
09/04/2001 | US6285196 Process for the electrical testing of the base material for the manufacture of printed circuit boards |
09/04/2001 | US6285125 Structure for mounting an EL lamp |