Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/2001
09/12/2001CN1312673A Electronic element with protective box and production method thereof
09/12/2001CN1312671A Multi-layer flexible wiring board and its production method
09/12/2001CN1312670A Formation of metal interconnection structure
09/12/2001CN1312565A Insulator ceramic composition
09/12/2001CN1070769C Heat-resisting cushion material and producing method
09/11/2001US6289306 Data processing of a bitstream signal
09/11/2001US6288924 Semiconductor device and process for manufacturing the same
09/11/2001US6288906 Multiple layer printed circuit board having power planes on outer layers
09/11/2001US6288905 Contact module, as for a smart card, and method for making same
09/11/2001US6288887 Ceramic electronic component
09/11/2001US6288650 Device and method for monitoring the operation of an industrial installation
09/11/2001US6288627 Embedded trimmable resistors
09/11/2001US6288562 Test pin for a printed circuit board
09/11/2001US6288559 Semiconductor testing using electrically conductive adhesives
09/11/2001US6288386 Circuit having a flexible printed circuit board for electronically controlling a night vision device and night vision device including the same
09/11/2001US6288360 Excimer laser ablation process control of multilaminate materials
09/11/2001US6288346 System and method for easily inspecting a bonded state of a BGA/CSP type electronic part to a board
09/11/2001US6288345 Compact z-axis DC and control signals routing substrate
09/11/2001US6288343 Printed circuit board
09/11/2001US6287895 Semiconductor package having enhanced ball grid array protective dummy members
09/11/2001US6287891 Method for transferring semiconductor device layers to different substrates
09/11/2001US6287503 Method for encasing array packages
09/11/2001US6287444 Method for producing very small metal ball
09/11/2001US6286424 Plastic mask unit for paste printing and method of fabricating such plastic mask unit
09/11/2001US6286422 Method and apparatus for dispensing viscous material
09/11/2001US6286208 Interconnector with contact pads having enhanced durability
09/11/2001US6286207 Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it
09/11/2001US6286206 Heat-resistant electronic systems and circuit boards
09/11/2001US6286205 Method for making connections to a microelectronic device having bump leads
09/11/2001US6286204 Method for fabricating double sided ceramic circuit boards using a titanium support substrate
09/11/2001US6286202 System for mounting a plurality of circuit components on a circuit substrate
09/07/2001WO2001065896A1 Direct electrostatic printing method and device for manufacturing printed circuit boards
09/07/2001WO2001065602A1 Wiring board, semiconductor device, and method of manufacturing wiring board
09/07/2001WO2001065595A2 A method of forming an opening or cavity in a substrate for receiving an electronic component
09/07/2001WO2001065574A1 Coil assembly with a circuit board and a coil body
09/07/2001WO2001065344A2 Method and apparatus for providing power to a microprocessor with integrated thermal and emi management
09/07/2001WO2001065294A2 Apparatus and packaging method to assemble optical modules to a common substrate with adjustable plugs
09/07/2001WO2001064807A1 Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same
09/07/2001WO2001064433A1 Carrier foil-pasted metal foil and production method thereof
09/07/2001WO2001064411A1 Method for producing prepreg, preprig, metal-clad laminate and printed wiring board
09/07/2001WO2001012433A3 Nanostructure coatings
09/07/2001WO2001011676A3 Sputtering process
09/07/2001CA2400568A1 Method and apparatus for providing power to a microprocessor with integrated thermal and emi management
09/06/2001US20010020071 Thermosetting resins
09/06/2001US20010019854 Low-pin-count chip package and manufacturing method thereof
09/06/2001US20010019780 Preventing wrinkling
09/06/2001US20010019744 Process for plating metal coatings
09/06/2001US20010019739 On synthetic resin substrates
09/06/2001US20010019686 Pinted board processing machine
09/06/2001US20010019476 Construction of fixing flexible sheet on electronic device
09/06/2001US20010019301 Thin-film resistor, wiring substrate, and method for manufacturing the same
09/06/2001US20010019298 Structure of making a thick film low value high frequency inductor
09/06/2001US20010019178 Method of interconnecting electronic components using a plurality of conductive studs
09/06/2001US20010019177 Method of manufacturing a contact element and a multi-layered wiring substrate, and wafer batch contact board
09/06/2001US20010019176 Chip-type electronic component
09/06/2001US20010019171 Package for semiconductor chip
09/06/2001US20010019075 Thermosetting soldering flux and soldering process
09/06/2001US20010018986 Resin compound, and adhesive film, metal-clad adhesive film, circuit board, and assembly structure, using the resin compound
09/06/2001US20010018985 High-frequency circuit board and method of producing the same
09/06/2001US20010018983 Multilayer integrated substrate and manufacturing method for multilayer ceramic element
09/06/2001US20010018982 Circuit board having bonding areas to be joined with bumps by ultrasonic bonding
09/06/2001US20010018851 Drops of liquid metal are emitted from an acoustic device through an inert gas; the inert gas prevents formation of an oxide skin; drops can form solder bumps, circuit traces, or a three-dimensional device
09/06/2001US20010018799 Method of forming a chip carrier by joining a laminate layer and stiffener
09/06/2001US20010018797 Low temperature co-fired ceramic with improved registration
09/06/2001US20010018796 Method of forming multilayer circuit structure
09/06/2001DE10062109A1 Electric system module for electronic products, has power pins and signal pins arranged on three edges of case
09/06/2001DE10008569A1 Substrate for power semiconductor device
09/06/2001DE10007414A1 Process for through-plating a substrate comprises forming a through-hole in a metal plate in orientation with the through-hole of a ceramic plate, applying a solder paste to one side of the substrate, and passing through an oven
09/06/2001DE10005330A1 Verfahren zur Herstellung von leitfähigen transparenten Strukturen sowie Verwendung von transparenten, leitfähigen Oxidschichten zur Strukturierung von leitfähigen, transparenten Bereichen A process for preparing conductive transparent structures as well as use of transparent conductive oxide layers for patterning conductive transparent areas
09/05/2001EP1130530A2 Part marking method applicable to industrial parts
09/05/2001EP1130473A2 A system, method and article of manufacture for direct image processing of printed circuit boards
09/05/2001EP1129605A1 Edge connectors for printed circuit boards comprising conductive ink
09/05/2001EP1129511A1 Electric components for printed boards and method for automatically inserting said components in printed boards
09/05/2001EP1129480A1 Semiconductor copper bond pad surface protection
09/05/2001EP1129050A1 Paste for screenprinting electric structures onto carrier substrates
09/05/2001EP1129048A1 Composite plate and method for producing and using such a composite plate
09/05/2001EP1129003A1 Improvements relating to power steering
09/05/2001EP0852897B1 Method for surface mounting a heatsink to a printed circuit board
09/05/2001CN2446748Y Circuit board cleaner
09/05/2001CN2445847Y Tin furnace appts.
09/05/2001CN1311977A Clad board for printed-circuit board, multilayered printed-circuit board, and method for mfg. same
09/05/2001CN1311909A Connector with two rows of terminals having tail portions with smilar impadance
09/05/2001CN1311900A Device for electronic packaging, pin jig fixture
09/05/2001CN1311899A Catacitive mounting arrangement for securing an integrated circuit package to a heat sink
09/05/2001CN1311897A Misted precursor deposition apparatus and method with improved mist and mist flow
09/05/2001CN1311625A Nano stack film circuit material
09/05/2001CN1311526A Method for mfg. conductive seat used for electric connection and formed conductive seat therefor
09/05/2001CN1311511A Aeolotropic conductive adhering film
09/05/2001CN1311506A Electroacoustic transducer
09/05/2001CN1311077A Soldering agent composition used for soldering paste
09/04/2001US6285560 Method for increasing device reliability by selectively depopulating solder balls from a foot print of a ball grid array (BGA) package, and device so modified
09/04/2001US6285558 Microprocessor subsystem module for PCB bottom-side BGA installation
09/04/2001US6285554 Method and an arrangement for the electrical contact of components
09/04/2001US6285551 Overmolded electronic assembly
09/04/2001US6285542 Ultra-small resistor-capacitor thin film network for inverted mounting to a surface
09/04/2001US6285433 Method for mounting TCP film to display panel
09/04/2001US6285275 Surface mountable electrical device
09/04/2001US6285272 Low profile inductive component
09/04/2001US6285196 Process for the electrical testing of the base material for the manufacture of printed circuit boards
09/04/2001US6285125 Structure for mounting an EL lamp