Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/2001
09/19/2001CN1071535C Assembly for mounting components to flexible cables
09/18/2001US6292374 Assembly having a back plate with inserts
09/18/2001US6292372 Solder thieving pad for wave soldered through-hole components
09/18/2001US6292370 Flexible circuit board and method for making a flexible circuit board
09/18/2001US6292353 Laminated ceramic electronic component
09/18/2001US6292139 Electronic part and a method of manufacturing the same
09/18/2001US6292083 Surface-mount coil
09/18/2001US6292073 Solderless circuit interconnect having a spring contact passing through an aperture
09/18/2001US6291899 Method and apparatus for reducing BGA warpage caused by encapsulation
09/18/2001US6291897 Carriers including projected contact structures for engaging bumped semiconductor devices
09/18/2001US6291892 Semiconductor package that includes a shallow metal basin surrounded by an insulator frame
09/18/2001US6291889 High temperature resistant thin-film system
09/18/2001US6291780 Method and device for connecting FPCs
09/18/2001US6291779 Fine pitch circuitization with filled plated through holes
09/18/2001US6291778 Printed circuit boards
09/18/2001US6291777 Conductive feed-through for creating a surface electrode connection within a dielectric body and method of fabricating same
09/18/2001US6291309 Semiconductor device and method for manufacturing the same
09/18/2001US6291126 Thermal transfer element and process for forming organic electroluminescent devices
09/18/2001US6291116 Thermal transfer element and process for forming organic electroluminescent devices
09/18/2001US6291081 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof
09/18/2001US6291025 Electroless coatings formed from organic liquids
09/18/2001US6291016 Method for increasing contact area between a viscous liquid and a substrate
09/18/2001US6290881 Ultraviolet curable silver composition and related method
09/18/2001US6290860 Process for design and manufacture of fine line circuits on planarized thin film dielectrics and circuits manufactured thereby
09/18/2001US6290833 Providing electroplating bath including copper sulfate, ammonium sulfate, complexing agenta and ethylene glycol; exposing workpiece surface on which microelectronic devices are to be formed; applying electroplating power to deposit
09/18/2001US6290802 Method of manufacturing laminate and grommet used for the method
09/18/2001US6290746 Method of producing metal ball and semiconductor package
09/18/2001US6290532 Apparatus and method for positioning wires in a highspeed serial data connector
09/18/2001US6290510 Spring structure with self-aligned release material
09/18/2001US6290118 Method and apparatus for soldering and soldering land of a printed circuit board
09/18/2001US6289804 Apparatus for supporting and tensioning a stencil
09/18/2001US6289803 Method and apparatus for screen printing
09/18/2001US6289583 Method for making cards with multiple contact tips for testing semiconductor chips
09/18/2001US6289580 Surface mount power supply device
09/18/2001CA2245413C Conductive elastomer for grafting to an elastic substrate
09/18/2001CA2202426C Mounting structure for a semiconductor circuit
09/13/2001WO2001067836A1 Electric power module and methods for making same
09/13/2001WO2001067835A1 Apparatus for inspecting solder paste printed on a pcb and supplementary dispensing solder paste
09/13/2001WO2001067834A1 Flexible circuits with static discharge protection and process for manufacture
09/13/2001WO2001067832A1 Electrical circuit and substrate therefor
09/13/2001WO2001067512A2 Method and apparatus for delivering power to high performance electronic assemblies
09/13/2001WO2001067506A1 Method and apparatus for mounting chip
09/13/2001WO2001067494A2 Precision electroplated solder bumps and method for manufacturing thereof
09/13/2001WO2001067178A1 Solder resist ink
09/13/2001WO2001066350A1 Improvements relating to screen printing apparatus
09/13/2001WO2000007197A3 Composition and method for manufacturing integral resistors in printed circuit boards
09/13/2001US20010021611 Bus bar structure
09/13/2001US20010021610 C-shaped compliant contact
09/13/2001US20010021547 Bonding materials
09/13/2001US20010021543 Integrated component, composite element comprising an integrated component and a conductor structure, chip card, and method of producing the integrated component
09/13/2001US20010021483 Forming masking layer with aperture; filling with conductive material; removal
09/13/2001US20010021206 Laser repetition rate multiplier
09/13/2001US20010021103 Control unit and method of manufacturing the same
09/13/2001US20010020996 Liquid crystal display
09/13/2001US20010020895 Information recording tag
09/13/2001US20010020749 Bond-pad with pad edge strengthening structure
09/13/2001US20010020748 Microelectronic packages with solder interconnections
09/13/2001US20010020744 Solder circuit
09/13/2001US20010020741 Semiconductor memory module having double-sided stacked memory chip layout
09/13/2001US20010020739 Flip chip type semiconductor device and method for manufacturing the same
09/13/2001US20010020697 Thermosetting adhesive material
09/13/2001US20010020637 Automatic wave soldering apparatus and method
09/13/2001US20010020636 Patterned array of metal balls and methods of making
09/13/2001US20010020635 Electronic part mounting method
09/13/2001US20010020549 Wiring board, semiconductor device and production methods thereof
09/13/2001US20010020548 Blind via laser drilling system
09/13/2001US20010020546 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
09/13/2001US20010020545 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
09/13/2001US20010020535 Circuit pack, multilayer printed wiring board, and device
09/13/2001US20010020408 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
09/13/2001EP1145256A3 Composition and method for manufacturing integral resistors in printed circuit boards
09/13/2001DE10108785A1 Steckverbindung für Chipkarten Connector for smart cards
09/13/2001DE10108762A1 Electronic component mounting method for fixing component on substrate, involves detecting dislocation of divided block of substrate based on detected relative position data and substrate entire position
09/13/2001DE10108666A1 Insulating thick film composition calcined with a ceramic blank used in mobile communication devices consists of a first ceramic powder having the same setting system as the second ceramic powder contained in the blank
09/13/2001DE10023354A1 Circuit board has electrically conducting structure in at least one defined area forming planar antenna terminated by at least one resistance in an at least approximately reflection-free manner
09/13/2001DE10011595A1 Joining a flexible printed circuit to a circuit of a circuit carrier used in the production of molded interconnected devices comprises using a conducting adhesive
09/13/2001DE10011373A1 Flexible printed circuit used in the production of an instrument panel for vehicles consists of a base material, a conductor pattern applied on one side, and a flexible or semi-flexible reinforcing material applied on the other side
09/13/2001DE10010979A1 Electrical circuit on substrate e.g. PCB, has component(s) mounted on conducting track layer on substrate and enclosed by recesses in conducting track layer in form of round holes or trenches
09/13/2001DE10009974A1 Device for separating multi-use circuit board into at least two individual circuit boards, has carrier with supporting surface with groove for separating tool, and holder per individual circuit board
09/13/2001DE10008572A1 Power semiconductor module for e.g. vehicular and industrial controls, contains substrate with sleeves connected to it, to grip pins making electrical connection with circuit board
09/13/2001DE10006964A1 Elektronisches Bauelement, Verfahren zum Herstellen einer leitenden Verbindung in einem elektronischen Bauelelent und Verfahren zum Herstellen eines elektronischen Bauelements Electronic component, method for producing a conductive connection in an electronic Bauelelent and method for fabricating an electronic device
09/13/2001CA2402229A1 Method and apparatus for delivering power to high performance electronic assemblies
09/12/2001EP1133220A2 Copper foil with low profile bond enhancement
09/12/2001EP1133219A1 Heating device and heating method
09/12/2001EP1133218A2 Multilayered circuit board and method for producing the same
09/12/2001EP1133217A2 High frequency circuit board and method of producing the same
09/12/2001EP1133014A2 Electrical connector
09/12/2001EP1133011A2 Method of connecting circuit element
09/12/2001EP1132962A2 Wiring board, semiconductor device and production methods thereof
09/12/2001EP1132859A2 Information recording security tag
09/12/2001EP1132127A2 Method for isolating ultrafine and fine particles and resulting particles
09/12/2001EP1131168A1 Methods of forming metal contact pads on a metal support substrate
09/12/2001EP0969982B1 Control device for a vehicle
09/12/2001CN2448048Y Electronic element device
09/12/2001CN2448047Y Six-layer circuit board
09/12/2001CN2448046Y Six-layer circuit board adapted for high-speed signals
09/12/2001CN2447307Y Conveying wheel with wringing function
09/12/2001CN1313023A Thermal management device and method of making such device
09/12/2001CN1312957A Integrated circuit module with one surface comprising an electrically insulated peripheral zone of the integrated circuit, and mixed connection card comprising such a module
09/12/2001CN1312674A Element and device mounting method