| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/26/2001 | CN1071804C Process for manufacturing inductive counting system |
| 09/25/2001 | US6295631 Method for determining the compensation value of the width of a wire by measuring the resistance of the wire |
| 09/25/2001 | US6295210 Chassis grounding ring for a printed wiring board mounting aperture |
| 09/25/2001 | US6295207 Retractable and removable extensions with edge plated PCB's in thin-profile electronic devices |
| 09/25/2001 | US6295199 Electronics module and a method of manufacturing such a module |
| 09/25/2001 | US6294840 Dual-thickness solder mask in integrated circuit package |
| 09/25/2001 | US6294837 Semiconductor interconnect having laser machined contacts |
| 09/25/2001 | US6294827 Hybrid microwave-frequency integrated circuit |
| 09/25/2001 | US6294756 Thick film low value high frequency inductor, and method of making the same |
| 09/25/2001 | US6294745 Solder anchor decal |
| 09/25/2001 | US6294744 Used in electronics |
| 09/25/2001 | US6294743 Used in electronics |
| 09/25/2001 | US6294741 Electronics module having high density interconnect structures incorporating an improved dielectric lamination adhesive |
| 09/25/2001 | US6294731 Apparatus for multichip packaging |
| 09/25/2001 | US6294730 Adapted electrically conductive layer |
| 09/25/2001 | US6294621 Resin composites and method for producing the same |
| 09/25/2001 | US6294410 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
| 09/25/2001 | US6294407 Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein, and methods of fabricating the same |
| 09/25/2001 | US6294316 Having fine metal bumps. |
| 09/25/2001 | US6294270 Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 09/25/2001 | US6294255 Method of and structure for fixing a flexible electrical conductor |
| 09/25/2001 | US6294220 Post-treatment for copper on printed circuit boards |
| 09/25/2001 | US6294060 Conveyorized electroplating device |
| 09/25/2001 | US6293997 Depleting air in oxygen in order to obtain first gas mixture; delivering portion of gas mixture as first working gas to a chamber for storing electronic components in controlled atmosphere; depleting air in oxygen; delivering |
| 09/25/2001 | US6293819 Battery stage module |
| 09/25/2001 | US6293456 Methods for forming solder balls on substrates |
| 09/25/2001 | US6293455 Method for producing a reliable BGA solder joint interconnection |
| 09/25/2001 | US6293008 Method for producing foil circuit boards |
| 09/21/2001 | CA2327801A1 Copper on polymer component having improved adhesion |
| 09/20/2001 | WO2001069999A1 A method for printing a conductive coating on an electronic unit |
| 09/20/2001 | WO2001069991A1 Method of manufacturing multilayer ceramic substrate, and conductor paste |
| 09/20/2001 | WO2001069990A1 Bonded structure and electronic circuit board |
| 09/20/2001 | WO2001069988A1 Printed-circuit board with fuse |
| 09/20/2001 | WO2001069987A2 Printed circuit board assembly with improved thermal performance |
| 09/20/2001 | WO2001069717A1 Method for forming radio frequency antenna using conductive inks |
| 09/20/2001 | WO2001069680A2 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
| 09/20/2001 | WO2001069675A1 Method for making a flexible circuit interposer having high-aspect ratio conductors |
| 09/20/2001 | WO2001069640A2 Method for applying metallic strip conductors acting as electrodes on a channel plate made of glass for large-surface flat screens |
| 09/20/2001 | WO2001068951A1 Electro-plating apparatus and a method of electro-plating |
| 09/20/2001 | WO2001068752A1 Impregnated glass fiber strands and products including the same |
| 09/20/2001 | WO2001068567A2 Photostructured paste |
| 09/20/2001 | WO2001068311A1 Flip chip interconnection structure |
| 09/20/2001 | WO2001068193A2 Multilayer golf ball with filled inner layer having dual core, liquid core, or wound core |
| 09/20/2001 | WO2001033926A3 Electronic control device |
| 09/20/2001 | WO2000059000A8 Method for making segmented through holes in printed circuit boards |
| 09/20/2001 | WO2000046837B1 Improved circuit board manufacturing process |
| 09/20/2001 | US20010023144 Arrangement for supplying power from a buss bar to a circuit board |
| 09/20/2001 | US20010023139 Center bond flip chip semiconductor carrier and a method of making and using it |
| 09/20/2001 | US20010023113 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 09/20/2001 | US20010023081 Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices |
| 09/20/2001 | US20010023055 Process and apparatus for heat-treating substrate having film-forming composition thereon |
| 09/20/2001 | US20010023044 Curing photodielectric material |
| 09/20/2001 | US20010023028 Connecting material; preremoval of surface oxide |
| 09/20/2001 | US20010023002 Method of manufacturing laminate and grommet used for the method |
| 09/20/2001 | US20010022989 Protective coating on metal pads, apertures |
| 09/20/2001 | US20010022718 Printed circuit board capacitor structure and method |
| 09/20/2001 | US20010022644 Display device substrate, method for manufacturing the display device substrate, liquid-crystal display device, and electronic equipment |
| 09/20/2001 | US20010022547 Multilayer inductor |
| 09/20/2001 | US20010022416 Manufacturing method for multilayer ceramic device |
| 09/20/2001 | US20010022401 Solid-state image pickup apparatus and manufacturing method thereof |
| 09/20/2001 | US20010022400 Bus line wiring structure in a semiconductor device and method of manufacturing the same |
| 09/20/2001 | US20010022397 Hybrid BGA and QFP chip package assembly and process for same |
| 09/20/2001 | US20010022396 Fan-out semiconductor chip assembly |
| 09/20/2001 | US20010022392 Tented plated through-holes and method for fabrication thereof |
| 09/20/2001 | US20010022316 Soldering method |
| 09/20/2001 | US20010022236 Substrate for power semiconductor modules with through-plating of solder and method for its production |
| 09/20/2001 | US20010022021 Method of producing chip-type electronic devices |
| 09/20/2001 | DE10112328A1 Electroluminescent device with contoured light-emitting surfaces has conductive films of flexible printed circuit connected by grid-like arrangement of contacts |
| 09/20/2001 | DE10111789A1 Multilayer inductor has groove in core which ensures each connection electrode is insulated from other connection electrodes |
| 09/20/2001 | DE10111718A1 Electronic circuit device has one board connected by solder to metal spacers, which are connected to other board by conductive adhesive |
| 09/20/2001 | DE10111710A1 Befestigungsverfahren für elektrische Bauteile Attachment methods for electrical components |
| 09/20/2001 | DE10111033A1 Siebdruckverfahren Screen printing |
| 09/20/2001 | DE10110151A1 Wiring board e.g. for mobile communications device or computer, has insulating pattern formed on substrate, intersecting wiring pattern to define electrode |
| 09/20/2001 | DE10011455A1 Applying metallic conducting pathways as electrodes to a glass channel plate for large surface flat screens comprises roughening the channel plate in the electrode regions of the channels |
| 09/20/2001 | CA2403135A1 Impregnated glass fiber strands and products including the same |
| 09/20/2001 | CA2403116A1 Electro-plating apparatus and a method of electro-plating |
| 09/20/2001 | CA2402626A1 Multilayer golf ball with filled inner layer having dual core, liquid core, or wound core |
| 09/19/2001 | EP1135012A2 Method of manufacturing printed circuit board |
| 09/19/2001 | EP1135011A2 Printed-wiring board |
| 09/19/2001 | EP1134695A1 Microchip card comprising a separable board that is partially precut in a card substrate |
| 09/19/2001 | EP1133904A1 Deposited thin build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates |
| 09/19/2001 | EP1133903A1 Method for applying conductive lines on the casing of mobile phone |
| 09/19/2001 | EP1133902A2 Electromechanical component |
| 09/19/2001 | EP1133812A1 High density electrical connector |
| 09/19/2001 | EP1133800A1 Electronic component and coating agent |
| 09/19/2001 | EP0960038B1 Manufacture of a wiring loom |
| 09/19/2001 | EP0917501B1 Method for isolating ultrafine and fine particles and resulting particles |
| 09/19/2001 | EP0914230B1 A flux formulation |
| 09/19/2001 | EP0898802B1 Protective device for an electronic circuit |
| 09/19/2001 | EP0729397B2 Fluxless soldering pretreating system and method using fluorine-containing plasma |
| 09/19/2001 | CN2449446Y Six-layer circuit board |
| 09/19/2001 | CN1314072A High density printed circuit substrate and method of fabrication |
| 09/19/2001 | CN1314071A Method for producing circuit-forming board, circuit-forming board, and carbon sheet |
| 09/19/2001 | CN1313993A Electronic component, and electronic apparatus in which the electronic component is mounted and its manufacturing method |
| 09/19/2001 | CN1313962A Photosensitive resin composition and method of improving dry etching resistance of photosensitive resin composition |
| 09/19/2001 | CN1313724A Method for installing high-power device |
| 09/19/2001 | CN1313722A Multi-layer printed circuit board and method for measuring impendance thereof |
| 09/19/2001 | CN1313574A Information recording label |
| 09/19/2001 | CN1313534A Display of electronic device |
| 09/19/2001 | CN1313165A Laser cutting laminated core carrier |