| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 10/02/2001 | US6297469 Process for producing a metal-ceramic substrate |
| 10/02/2001 | US6297459 Processing low dielectric constant materials for high speed electronics |
| 10/02/2001 | US6297458 Printed circuit board and method for evaluating the inner layer hole registration process capability of the printed circuit board manufacturing process |
| 10/02/2001 | US6297294 Adding an adhesion promoter, which consists essentially of a polycarboxylic acid having three to six carbon atoms, to the photopolymerizable composition. |
| 10/02/2001 | US6297164 Method for producing contact structures |
| 10/02/2001 | US6296949 Printed circuits of laminates on substrates, metals, copper electrodeposits manufacturing printed circuits, comprising: a laminate that in a finished printed circuit constitutes a functional elements |
| 10/02/2001 | US6296897 Process for reducing extraneous metal plating |
| 10/02/2001 | US6296722 Lead-free solder alloy |
| 10/02/2001 | US6296494 Printed-circuit module having a printed-circuit board mounted to a printing wiring board |
| 10/02/2001 | US6296493 Method for electrically connecting two sets of electrode terminals in array on electronic board units |
| 10/02/2001 | US6296174 Method and circuit board for assembling electronic devices |
| 10/02/2001 | US6296173 Method and apparatus for soldering ball grid array modules to substrates |
| 10/02/2001 | US6296169 Flux-application fixture for a ball-grid-array (BGA) assembly process |
| 10/02/2001 | US6295730 Method and apparatus for forming metal contacts on a substrate |
| 10/02/2001 | US6295728 Printed circuit board assembly manufacturing system |
| 10/02/2001 | US6295727 Method of manufacturing an integrated circuit |
| 10/02/2001 | US6295726 Method of manufacturing surface-mountable SIL hybrid circuit |
| 10/02/2001 | US6295724 Apparatus for printed circuit board repair |
| 10/02/2001 | US6295709 Printed circuit board assembly and method for making a printed circuit board assembly |
| 09/27/2001 | WO2001072096A1 Treatment of circuit supports with impulse excitation |
| 09/27/2001 | WO2001071908A1 Isolating energy conditioning shield assembly |
| 09/27/2001 | WO2001071854A1 Electrical connection material and electrical connection method |
| 09/27/2001 | WO2001071852A1 Method for making an electroconductive joint |
| 09/27/2001 | WO2001071806A1 Semiconductor device, method of manufacturing electronic device, electronic device, and portable information terminal |
| 09/27/2001 | WO2001071371A1 Testing device for printed boards |
| 09/27/2001 | WO2001071369A1 Method and apparatus for inspection |
| 09/27/2001 | WO2001071067A2 An energy enhanced process for treating a conductive surface and products formed thereby |
| 09/27/2001 | WO2001070867A2 Flame retardant epoxy molding compositions |
| 09/27/2001 | WO2001070843A2 High molecular weight epoxy resin and resinous composition for printed circuit board |
| 09/27/2001 | WO2001070435A1 Ultra fine composite metal particles |
| 09/27/2001 | WO2001035006A3 Metal-infiltrated ceramic seal |
| 09/27/2001 | WO2001020059A3 Method for producing a conductor pattern on a dielectric substrate |
| 09/27/2001 | US20010025016 Solution for removing thermal grease from electronic cards |
| 09/27/2001 | US20010024933 Composition and method for polishing in metal CMP |
| 09/27/2001 | US20010024890 Contactor having LSI-circuit-side contact piece and test-board-side contact piece for testing semiconductor device and manufacturing method thereof |
| 09/27/2001 | US20010024888 Electromagnetic coupler socket |
| 09/27/2001 | US20010024691 Semiconductor substrate processing apparatus and method |
| 09/27/2001 | US20010024682 Coating with absorber and crosslinked binder |
| 09/27/2001 | US20010024600 Drilling apparatus for flexible sheet made of thick thermoplastic material |
| 09/27/2001 | US20010024360 Printed wiring board |
| 09/27/2001 | US20010024273 Apparatus and method for the visual inspection in particular of concealed soldered joints |
| 09/27/2001 | US20010024259 Tape carrier package film |
| 09/27/2001 | US20010024197 Display device for an electronic appliance |
| 09/27/2001 | US20010024129 Interposer and methods for fabricating same |
| 09/27/2001 | US20010024127 Semiconductor testing using electrically conductive adhesives |
| 09/27/2001 | US20010024118 Bondpad attachments having self-limiting properties for penetration of semiconductor die |
| 09/27/2001 | US20010023985 Assemblies for temporarily connecting microelectronic elements for testing and methods therefor |
| 09/27/2001 | US20010023983 Semiconductor devices |
| 09/27/2001 | US20010023982 Semiconductor package using terminals formed on a conductive layer of a circuit board |
| 09/27/2001 | US20010023973 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 09/27/2001 | US20010023860 Excimer laser ablation process control of multilaminate materials |
| 09/27/2001 | US20010023830 Electrolytic plating method and device for a wiring board |
| 09/27/2001 | US20010023829 Method for anisotropic etching of structures in conducting materials |
| 09/27/2001 | US20010023782 Substrate on which ball grid array type electrical part is mounted and method for mounting ball grid array type electrical part on substrate |
| 09/27/2001 | US20010023781 Substrate for mounting electronic parts thereon and method of manufacturing same |
| 09/27/2001 | US20010023780 Printed wiring board |
| 09/27/2001 | US20010023779 Transfer material, method for producing the same and wiring substrate produced by using the same |
| 09/27/2001 | US20010023771 Metal line, method for fabricating the metal line, thin film transistor employing the metal line and display device |
| 09/27/2001 | US20010023645 Screen printing apparatus and screen printing method |
| 09/27/2001 | US20010023535 Polymer thick-film resistor printed on planar circuit board surface |
| 09/27/2001 | US20010023532 Method for producing multilayer circuit board |
| 09/27/2001 | DE10018415C1 Connection between sensor terminal and conductor path applied to glass plate uses conductive connection element ultrasonically welded to conductor path |
| 09/27/2001 | DE10015502A1 Photostructurizable paste, for producing structurized resistance film or wiring trace on green ceramic substrate, contains platinum (compound) powder and optionally ceramic (precursor) as filler in light-sensitive organic binder |
| 09/27/2001 | DE10013483A1 Circuit board has connecting pads with upper sides arranged in planes which are at the height of and/or above the plane of the upper side of the conducting pathways |
| 09/27/2001 | CA2402383A1 Flame retardant epoxy molding compositions |
| 09/27/2001 | CA2397078A1 Treatment of circuit circuit carriers with pulse like excitation |
| 09/27/2001 | CA2387813A1 An energy enhanced process for treating a conductive surface and products formed thereby |
| 09/26/2001 | EP1137333A1 Multilayer build-up wiring board |
| 09/26/2001 | EP1137332A1 Printed wiring board and method of producing the same and capacitor to be contained in printed wiring board |
| 09/26/2001 | EP1137331A2 Copper on polymer component having improved adhesion |
| 09/26/2001 | EP1137330A1 Pattern design for electronic components on a 400 micron copper layer in printed circuits |
| 09/26/2001 | EP1137329A2 Fixture, circuit board with fixture, and electronic-component mounted body and method of manufacturing the same |
| 09/26/2001 | EP1137107A2 Abutting connector |
| 09/26/2001 | EP1137067A2 Multi-chip ball grid array ic packages |
| 09/26/2001 | EP1137060A2 Method for producing multilayer circuit board and multilayer circuit board |
| 09/26/2001 | EP1136944A1 Non-contact type ic card and method and apparatus for manufacturing the same |
| 09/26/2001 | EP1136827A2 Contactor having LSI-circuit-side contact piece and test-board-side contact piece for testing semiconductor device and manufacturing method thereof |
| 09/26/2001 | EP1135977A1 Method of manufacturing an interlayer via and a laminate precursor useful therefor |
| 09/26/2001 | EP1135799A1 Method and device for producing shaped ceramic bodies using setter plates |
| 09/26/2001 | EP1135794A1 A method and apparatus for the transport and tracking of an electronic component |
| 09/26/2001 | EP1135783A1 Capacitance-coupled high dielectric constant embedded capacitors |
| 09/26/2001 | EP1135777A1 Particles |
| 09/26/2001 | EP1135693A1 Probe card for probing wafers with raised contact elements |
| 09/26/2001 | EP1135690A2 Lithographic contact elements |
| 09/26/2001 | EP0970543A4 Compression connector |
| 09/26/2001 | EP0963687B1 Coating device for coating solder resist on both sides of a printed circuit board |
| 09/26/2001 | CN1315055A Through hole bump contact |
| 09/26/2001 | CN1315044A Electronic device and manufacture thereof |
| 09/26/2001 | CN1314958A 接触元件 Contact element |
| 09/26/2001 | CN1314932A Process for preparing green pigment composition containing no halogen |
| 09/26/2001 | CN1314837A Polymeric material and process for producing same |
| 09/26/2001 | CN1314829A Printing of electronic circuit and components |
| 09/26/2001 | CN1314778A Method for producing printed circuit board |
| 09/26/2001 | CN1314776A Monolithic ceramic electronic element and its producing method and electronic device |
| 09/26/2001 | CN1314703A Contact switch for semiconductor device detection and its producing method |
| 09/26/2001 | CN1314618A Method for preparing multiple layer inner connection circuit |
| 09/26/2001 | CN1071911C Waterborne photoresists having binders neutralized with amino acrylates |
| 09/26/2001 | CN1071910C Waterborne Photoresists having non-ionic fluorocarbon surfactants |
| 09/26/2001 | CN1071806C Printed circuit board manufacture |
| 09/26/2001 | CN1071805C Method for forming silver plating on metal surface |