| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 10/04/2001 | WO2001074125A1 Insulating material, method for producing insulating material, method for manufacturing multilayer circuit board |
| 10/04/2001 | WO2001073885A1 Rf switch |
| 10/04/2001 | WO2001073800A1 Method for producing a tag or a chip card, device for implementing said method and tag or chip card produced according to said method |
| 10/04/2001 | WO2001073715A1 Device for manufacturing a tag for an electronic article surveillance system and method thereof |
| 10/04/2001 | WO2001073510A1 Photocurable/thermosetting resin composition, photosensitive dry film formed therefrom, and method of forming pattern with the same |
| 10/04/2001 | WO2001073451A1 High frequency circuit impedance measuring probe for inner-layer-containing laminated sheet used for multi-layer printed board |
| 10/04/2001 | WO2001072919A2 Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
| 10/04/2001 | WO2001072902A1 Curable composition and multilayered circuit substrate |
| 10/04/2001 | WO2001072887A1 Screen printable flame retardant coating |
| 10/04/2001 | WO2001072857A1 Resins curable with actinic radiation, process for the production thereof, and photo- and thermo-setting resin composition |
| 10/04/2001 | WO2001033673A8 Connecting device to be soldered to circuit boards for connection of electrical conductors, a method for production of the connecting device and a device for connecting conductors to the connecting device |
| 10/04/2001 | WO2001012880A3 Method for the production of a self-supporting copper foil |
| 10/04/2001 | US20010027232 Obtained by plastifying thermoplastic resin and compression molding; printed circuit boards |
| 10/04/2001 | US20010027172 Made by decarboxylation of the corresponding fluoroalkyl ether carboxylic acids; use in fluorinated polyether deposition, soldering, and cleaning and drying; low boiling, shorter atomospheric life, less harmful to ozone layer |
| 10/04/2001 | US20010027052 Method for connecting a terminal fitting and a flat conductor, a terminal connection apparatus and a terminal fitting |
| 10/04/2001 | US20010027035 Electrical connector |
| 10/04/2001 | US20010027013 Method for forming conductor members, manufacturing method of semiconductor element and manufacturing method of thin-film magnetic head |
| 10/04/2001 | US20010026888 Battery pack and method of manufacturing the same |
| 10/04/2001 | US20010026866 Anisotropically electroconductive adhesive material and connecting method |
| 10/04/2001 | US20010026864 Insulating ceramic, multilayer ceramic substrate, ceramic electronic parts and laminated ceramic electronic parts |
| 10/04/2001 | US20010026863 Finely crusted thermosetting resin and inorganic dielectric powder; casting into metal mold, heating, pressurization |
| 10/04/2001 | US20010026663 Optical wavelength division multiplexer/demultiplexer having adhesive overflow channels with dams to achieve tight adhesive bond |
| 10/04/2001 | US20010026638 Positioning apparatus used in a process for producing multi-layered printed circuit board and method of using the same |
| 10/04/2001 | US20010026444 Electronic circuit board with built-in thin film capacitor and manufacturing method thereof |
| 10/04/2001 | US20010026442 Conductor track layer structure and prestage thereof |
| 10/04/2001 | US20010026441 Printed wiring board having heat radiating means and method of manufacturing the same |
| 10/04/2001 | US20010026438 Electric power module and method for making same |
| 10/04/2001 | US20010026435 Monolithic ceramic electronic component, method for manufacturing same, and electronic device including same |
| 10/04/2001 | US20010026211 Production method of thin film resistance element formed on printed circuit board, and thin film resistance element employing the method |
| 10/04/2001 | US20010026166 Probe contactor and production method thereof |
| 10/04/2001 | US20010026029 Method for producing and applying a screening profile |
| 10/04/2001 | US20010026023 Vertically mountable and alignable semiconductor device, assembly, and methods |
| 10/04/2001 | US20010025964 Connecting device for power semiconductor modules with compensation for mechanical stresses |
| 10/04/2001 | US20010025875 Solder, solder paste and soldering method |
| 10/04/2001 | US20010025874 Method of forming solder bumps, method of mounting flip chips, and a mounting structure |
| 10/04/2001 | US20010025873 Soldering method for soldering electronic parts and soldering apparatus therefor |
| 10/04/2001 | US20010025726 Circuit board and manufacturing method thereof |
| 10/04/2001 | US20010025725 Electrically Conductive Apparatuses |
| 10/04/2001 | US20010025724 Optical scanning device |
| 10/04/2001 | US20010025723 Mounting structure of electronic component on substrate board |
| 10/04/2001 | US20010025722 Glass-ceramic wiring board |
| 10/04/2001 | US20010025721 Printed wiring board, IC card module using the same, and method for producing IC card module |
| 10/04/2001 | US20010025718 Bus bar wiring plate body for electric coupling box |
| 10/04/2001 | US20010025673 Composition for increasing activity of a no-clean flux |
| 10/04/2001 | US20010025596 Heat insulation arrangement of indicating instrument |
| 10/04/2001 | US20010025574 Method and apparatus for screen printing |
| 10/04/2001 | US20010025415 Method of manufacturing printed circuit board |
| 10/04/2001 | US20010025414 Method of producing a multi-layered wiring board |
| 10/04/2001 | US20010025413 Circuit-component mounting mehtod and circuit-component mounting system |
| 10/04/2001 | EP1139712A2 Article comprising surface-mountable, EMI-shielded plastic cover and process for fabricating article |
| 10/04/2001 | EP1139706A2 Positioning apparatus used in a process for producing multi-layered printed circuit board and method of using the same |
| 10/04/2001 | EP1139705A1 Printed wiring board and method of producing the same |
| 10/04/2001 | EP1139704A1 Copper-clad plate and laser machining for copper-clad plate |
| 10/04/2001 | EP1139492A2 A method for connecting a terminal fitting and a flat conductor, a terminal connection apparatus and a terminal fitting |
| 10/04/2001 | EP1139410A2 Method of manufacturing bump-component mounted body and device for manufacturing the same |
| 10/04/2001 | EP1139355A1 Electronic device of ceramic |
| 10/04/2001 | EP1139353A2 Production method of thin film resistance element formed on printed circuit board, and thin film resistance element employing the method |
| 10/04/2001 | EP1139104A2 Electrical conductor multilayer arrangement with integrated current detection |
| 10/04/2001 | EP1138803A2 Method for metallizing an insulator and/or a dielectric |
| 10/04/2001 | EP1138737A1 Anisotropically electroconductive adhesive material and connecting method |
| 10/04/2001 | EP1138553A2 Electric junction box for vehicle |
| 10/04/2001 | EP1138181A1 Article having an embedded electronic device, and method of making same |
| 10/04/2001 | EP1138180A1 Printed circuit board and method for fabricating such board |
| 10/04/2001 | EP1138070A1 Low alpha emissive solder bumps |
| 10/04/2001 | EP1138047A2 Method and apparatus for photosensitized ultraviolet decontamination of surfaces and aerosol clouds |
| 10/04/2001 | EP1137970A2 Method and device for aligning two photo masks with each other and optionally, an unexposed printed circuit board blank, and for subsequent simultaneous exposure in the production of double-sided printed circuit boards |
| 10/04/2001 | EP1137683A1 Polyoxazolidone adhesive resin composition prepared from polyepoxides and polyisocyanates |
| 10/04/2001 | EP0956747B1 Circuit board for electrical apparatus with hf components, particularly for mobile radiocommunications equipment |
| 10/04/2001 | EP0538457B1 Fabrication of metal matrix composites by vacuum die casting |
| 10/04/2001 | DE19958644A1 Verfahren und Vorrichtung zur Herstellung von Multilayern Method and apparatus for production of multilayers |
| 10/04/2001 | DE10014338C1 Press connector has contact elements connected to pressure elements, pressure elements connected to connecting elements via bending lines so parts can lie in plane when not contacting |
| 10/04/2001 | DE10012244A1 Manufacturing printing plate involves applying structurable coating to plate, structuring coating to form a structured coating with recesses, filling recesses and removing structured coating |
| 10/03/2001 | CN2452247Y Improvement of printed circuit board working table |
| 10/03/2001 | CN1316175A Printed circuit board and method of manufacture thereof |
| 10/03/2001 | CN1316116A Method for vertical connection of conductors in device in microwave range |
| 10/03/2001 | CN1315903A Resin/copper/metal laminate and method of producing same |
| 10/03/2001 | CN1315896A Device for automated machining of workpieces |
| 10/03/2001 | CN1315895A Solder powder and method for preparing same and solder paste |
| 10/03/2001 | CN1315824A Mask equipment |
| 10/03/2001 | CN1315823A Method for manufacturing circuit device and circuit device |
| 10/03/2001 | CN1315822A Film resistance element for printed circuit board and forming method thereof |
| 10/03/2001 | CN1315760A Anisotropic conductive connecting material |
| 10/03/2001 | CN1315677A Two-side exposure system |
| 10/03/2001 | CN1315591A Forming method of plating chrome on copper layer of printed circuit board |
| 10/03/2001 | CN1315246A 3-D structure and producing method thereof |
| 10/03/2001 | CN1072278C Currentless metallisation process for non electro-conductive substrates |
| 10/03/2001 | CN1072257C Furfuryl alcohol mixtures for use as cleaning agents |
| 10/02/2001 | US6298013 Device for monitoring the travel time of mail shipments |
| 10/02/2001 | US6297968 Mounting structure for mounting flexible printed circuit board and recording/reproducing apparatus using same |
| 10/02/2001 | US6297964 Semiconductor device, method of fabricating the same film carrier tape, circuit board, and electronic apparatus |
| 10/02/2001 | US6297869 Substrate and a liquid crystal display panel capable of being cut by using a laser and a method for manufacturing the same |
| 10/02/2001 | US6297722 Surface mountable electrical device |
| 10/02/2001 | US6297721 Electronic surface mount package |
| 10/02/2001 | US6297720 Electronic surface mount package |
| 10/02/2001 | US6297598 Single-side mounted light emitting diode module |
| 10/02/2001 | US6297564 Semiconductor chip; contact pads with oxidation resistant coating; flip chip; thermosetting or thermplastic resin; core particles of copper, nickel, aluminum, glass or polymer plated with gold, palladium or platinum |
| 10/02/2001 | US6297560 Semiconductor flip-chip assembly with pre-applied encapsulating layers |
| 10/02/2001 | US6297559 Structure, materials, and applications of ball grid array interconnections |
| 10/02/2001 | US6297553 Semiconductor device and process for producing the same |
| 10/02/2001 | US6297551 Integrated circuit packages with improved EMI characteristics |