Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2001
10/11/2001US20010028953 Adhesive compositions and methods of use
10/11/2001US20010028732 Method and system for detecting defects on a printed circuit board
10/11/2001US20010028556 Printed circuit board assembly
10/11/2001US20010028554 Module systems and module manufacturing processes
10/11/2001US20010028454 Optical inspection of laser vias
10/11/2001US20010028254 Test device for flat electronic assemblies
10/11/2001US20010028197 Electric junction box for vehicle
10/11/2001US20010028104 Semiconductor device, stacked-type semiconductor unit and method for manufacturing the same
10/11/2001US20010027990 Electrically conductive elevation shaping tool
10/11/2001US20010027967 Soldering apparatus and mounted part removing apparatus
10/11/2001US20010027964 Laser machining method, laser machining apparatus, and its control method
10/11/2001US20010027922 Copper foil composite including a release layer
10/11/2001US20010027877 Electronic component and mounting method and apparatus thereof
10/11/2001US20010027876 Fixture, circuit board with fixture, and electronic-component mounted body and method of manufacturing the same
10/11/2001US20010027875 Multi-layer printed circuit board and fabrication method thereof and a BGA semiconductor package using the multi-layer printed circuit board
10/11/2001US20010027874 Wiring substrate, method of manufacturing the same and semiconductor device
10/11/2001US20010027842 Method for filling high aspect ratio via holes in electronic substrates and the resulting holes
10/11/2001US20010027729 Screen printing method and holding table for plate to be printed
10/11/2001US20010027605 Method for producing printed wiring board
10/11/2001DE10115719A1 High frequency module for wireless apparatus has high frequency switch connected to baluns on receiver and transmitter sides
10/11/2001DE10113793A1 Wärmeisolationsanordnung eines Anzeigeinstruments Heat insulation arrangement of a display instrument
10/11/2001DE10113767A1 Elektrolytisches Plattierungsverfahren und Vorrichtung für eine Leiterbahnplatine Electrolytic plating method and apparatus for a printed wiring board
10/11/2001DE10031329C1 Electronic data card manufacturing method has transmission elements and/or conductor paths provided by application of conductive dispersion to carrier layer
10/11/2001DE10015270A1 Vertical implementation of thick film resistances in multilayer substrates
10/11/2001CA2365701A1 Method for producing solderable and functional surfaces on circuit carriers
10/10/2001EP1143776A1 Printed-circuit board and method of manufacture thereof
10/10/2001EP1143775A2 Electronic assembly with semi-crystalline copolymer adhesive
10/10/2001EP1143774A2 Wiring board comprising granular magnetic film
10/10/2001EP1143515A2 Wiring substrate, method of manufacturing the same and semiconductor device
10/10/2001EP1143509A2 Method of manufacturing the circuit device and circuit device
10/10/2001EP1143379A1 Method of realising a mixed chip card
10/10/2001EP1143038A1 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil
10/10/2001EP1142946A1 Curable silicone composition
10/10/2001EP1142922A2 Photo-curable resin composition, process for producing the same and products using the same
10/10/2001EP1142921A1 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board
10/10/2001EP1142457A1 Method for producing a multilayer printed circuit board
10/10/2001EP1142456A1 Process for depositing conducting layer on substrate
10/10/2001EP1141887A1 Method for making a contactless chip card
10/10/2001EP1141776A1 Method for patterning thin films
10/10/2001EP1141104A1 Heat debondable adhesive composition and adhesion structure
10/10/2001EP1141073A1 Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
10/10/2001EP1140373A1 Methods of manufacturing voidfree resin impregnated webs
10/10/2001EP1088371A4 Solder ball terminal
10/10/2001EP0797908B1 Single alloy solder clad substrate
10/10/2001EP0784514B1 Method of and arrangement for applying a fluid to a surface
10/10/2001CN2453643Y Structure for integrated circuit heat-radiator sheet
10/10/2001CN2453642Y Machine for cleaning circuit plate assembled with surface elements
10/10/2001CN2452675Y Two drilling bits milling head used for carvinkg able to be adjusted vertically and horizontally
10/10/2001CN2452660Y Structure improved milling-cutter
10/10/2001CN1317227A Method and device for processing substrates
10/10/2001CN1317224A Interconnect assembly for printed circuit boards and manufacturing method thereof
10/10/2001CN1317221A Door-dependent system for enabling and adjusting options on hearing aids
10/10/2001CN1317163A Non-circular micro-via
10/10/2001CN1317039A Adhesive compositions and their precursors
10/10/2001CN1316874A Method for forming through holes on substrate of printed circuit
10/10/2001CN1316873A Flexible printed substrate
10/10/2001CN1316872A Panel and its making method and installation method for electronic circuit component
10/10/2001CN1316766A Indicating lamp
10/10/2001CN1316495A Water-base composite detergent for printed circuit board
10/10/2001CN1316481A Sealing material
10/10/2001CN1316463A Phasphorus-containing epoxy resin composition, flame-retarded sheet resin composite metal forming, semi-solidified sheet, veneer shect, multiply sheet using the phasphorus-containing epoxy resin
10/10/2001CN1072812C Photoimaging composition and dry plate coating the composition
10/10/2001CN1072736C Method of coating copper film on ceramic substrate
10/09/2001US6301443 Low profile strobe device with conductive elastic members
10/09/2001US6301132 Compact fast battery charger
10/09/2001US6301127 Circuit block for power supply
10/09/2001US6301121 Direct-chip-attach (DCA) multiple chip module (MCM) with repair-chip ready site to simplify assembling and testing process
10/09/2001US6301120 Circuit board apparatus
10/09/2001US6301114 Multilayered electronic part and electronic circuit module including therein the multilayered electronic part
10/09/2001US6300997 Liquid crystal display device having an IC chip mounted on a narrow film wiring board
10/09/2001US6300778 Solder paste and residue
10/09/2001US6300771 Electrical inspection device for detecting a latent defect
10/09/2001US6300678 I/O pin having solder dam for connecting substrates
10/09/2001US6300675 Low-cost tape carrier package and liquid crystal module using the same
10/09/2001US6300594 Method and apparatus for machining an electrically conductive film
10/09/2001US6300579 Grounding terminal and mounting structure of the same on a printed circuit board
10/09/2001US6300578 Pad-on-via assembly technique
10/09/2001US6300576 Printed-circuit board having projection electrodes and method for producing the same
10/09/2001US6300575 Conductor interconnect with dendrites through film
10/09/2001US6300566 Electrical connection of a circuit carrier to a conductor-track carrier
10/09/2001US6300565 Controller for a motor vehicle
10/09/2001US6300402 Compositions created by the separation and isolation of the metallic and non-metallic constituent components of printed wiring assemblies and printed wiring boards
10/09/2001US6300236 Copper stud structure with refractory metal liner
10/09/2001US6300164 Structure, materials, and methods for socketable ball grid
10/09/2001US6300038 Articles having imagable coatings
10/09/2001US6299942 Method of producing the plated molded articles by non-electrode plating, and the resin compositions for that use
10/09/2001US6299785 Electrode formation process
10/09/2001US6299749 Method of fabricating an electrical component
10/09/2001US6299721 Coatings for improved resin dust resistance
10/09/2001US6299713 Optical radiation conducting zones and associated bonding and alignment systems
10/09/2001US6299460 Spring-loaded backing plate assembly for use with land grid array-type devices
10/09/2001US6299456 Interposer with contact structures for electrical testing
10/09/2001US6299390 Headpiece for machine tools that produce multiple holes
10/09/2001US6299058 Positioning method for attaching a solder ball to an electrical connector and the connector using the same
10/09/2001US6299056 Light-emitting diode and manufacturing method thereof and method for mounting light-emitting diode on electric wiring board
10/09/2001US6299055 Manufacturing processes of service boxes and their parts
10/09/2001US6298761 Thin film hole making apparatus
10/09/2001US6298552 Method for making socket connector
10/09/2001US6298551 Methods of forming compliant interface structures with partially open interiors for coupling two electrically conductive contact areas
10/09/2001CA2045272C Process for improving the surface of liquid crystal polymers