| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 10/18/2001 | DE10016037A1 Verfahren zur Herstellung eines Etiketts oder einer Chipkarte, Vorrichtung zur Durchführung des Verfahrens und danach hergestelltes Etikett oder Chipkarte Process for the preparation of a label or a chip card, apparatus for carrying out the process and then produced label or chip card |
| 10/18/2001 | DE10014382A1 Leiterbahn-Schichtstruktur und Vorstufe zu dieser Wiring layer structure, and the precursor to this |
| 10/17/2001 | EP1146780A2 Circuit board and method of manufacture |
| 10/17/2001 | EP1146596A2 Electrical connector with strain relief |
| 10/17/2001 | EP1146149A1 Aqueous dispersion for forming conductive layer, conductive layer, electronic component, circuit board and method for manufacturing the same, and multilayer wiring board and method for manufacturing the same |
| 10/17/2001 | EP1146143A1 Process and apparatus for nickel plating and nickel-plated product |
| 10/17/2001 | EP1146101A1 Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same |
| 10/17/2001 | EP1146065A1 Die attach adhesives for use in microelectronic devices |
| 10/17/2001 | EP1145914A2 Electrical junction box |
| 10/17/2001 | EP1145845A1 Composite film |
| 10/17/2001 | EP1145612A2 Method for mounting an electronic component |
| 10/17/2001 | EP1145610A2 Electronic control device |
| 10/17/2001 | EP1145609A1 Improved methods for wire-scribing filament circuit patterns with planar and non-planar portions; improved wire-scribed boards, interconnection cards, and smart cards made by these methods |
| 10/17/2001 | EP1145608A1 Printed circuit assembly having locally enhanced wiring density |
| 10/17/2001 | EP1145607A1 Production of photoresist coatings |
| 10/17/2001 | EP1145374A2 Remote entry integrally molded transmitter |
| 10/17/2001 | EP1145301A2 Conductor track supporting layer for laminating inside a chip card, chip card comprising a conductor track supporting layer, and method for producing a chip card |
| 10/17/2001 | EP1145256A2 Composition and method for manufacturing integral resistors in printed circuit boards |
| 10/17/2001 | EP1144198A1 Thermal transfer element for forming multilayer devices |
| 10/17/2001 | EP1144197A1 Thermal transfer element and process for forming organic electroluminescent devices |
| 10/17/2001 | EP1144152A1 Solder paste with a time-temperature indicator |
| 10/17/2001 | EP1144150A1 Method and apparatus for dispensing material in a printer |
| 10/17/2001 | EP1060494A4 Electroluminescent lamp devices and their manufacture |
| 10/17/2001 | EP0902973B1 Substrate for a semiconductor chip |
| 10/17/2001 | EP0732039B1 Fabrication multilayer combined rigid/flex printed circuit board |
| 10/17/2001 | EP0528874B2 Use of a dispersion-based two-component, filmforming reactive system |
| 10/17/2001 | CN2454921Y 电连接器 The electrical connector |
| 10/17/2001 | CN1318274A Multilayer build-up wiring board |
| 10/17/2001 | CN1318273A Method of producing multi-layer circuits |
| 10/17/2001 | CN1318272A Method for applying conductive lines on casing of mobile phone |
| 10/17/2001 | CN1318005A Solder ball placement appts. |
| 10/17/2001 | CN1317998A Device and method for mounting vibrator |
| 10/17/2001 | CN1317997A Electroless metal deposition of electronic components in enclosable vessel |
| 10/17/2001 | CN1317926A Component and device mounting device |
| 10/17/2001 | CN1317925A Printed distributing board |
| 10/17/2001 | CN1317863A Surface mounting type switching mains and its mounting method |
| 10/17/2001 | CN1317374A Binding agent coating method |
| 10/16/2001 | US6304450 Inter-circuit encapsulated packaging |
| 10/16/2001 | US6304232 Circuit module |
| 10/16/2001 | US6304166 Low profile mount for metal oxide varistor package and method |
| 10/16/2001 | US6304082 Printed circuit boards multi-axis magnetometer |
| 10/16/2001 | US6303993 Method and apparatus for testing bumped die |
| 10/16/2001 | US6303991 Electronic package and contact therefor |
| 10/16/2001 | US6303989 Integrated circuit device on metal board with CPU power converter |
| 10/16/2001 | US6303988 Wafer scale burn-in socket |
| 10/16/2001 | US6303982 Semiconductor device |
| 10/16/2001 | US6303902 Apparatus and method for processing |
| 10/16/2001 | US6303881 Via connector and method of making same |
| 10/16/2001 | US6303880 Printed circuit boards |
| 10/16/2001 | US6303878 Mounting structure of electronic component on substrate board |
| 10/16/2001 | US6303877 Multilayer thin-film wiring board |
| 10/16/2001 | US6303874 Electronic parts module and electronic equipment |
| 10/16/2001 | US6303873 Electronic part module and process for manufacturing the same |
| 10/16/2001 | US6303872 Anti-tombstoning solder joints |
| 10/16/2001 | US6303680 For dielectric films and is useful in the fabrication of solderable flexible circuits |
| 10/16/2001 | US6303408 Microelectronic assemblies with composite conductive elements |
| 10/16/2001 | US6303407 Method for the transfer of flux coated particles to a substrate |
| 10/16/2001 | US6303400 Temporary attach article and method for temporary attach of devices to a substrate |
| 10/16/2001 | US6303278 Method of applying metal layers in distinct patterns |
| 10/16/2001 | US6303230 For the manufacture of hard disk drive(hdd) suspensions of an integrated circuit/wiring structure with high accuracy |
| 10/16/2001 | US6303181 Providing substrate having non-conductive surface; contacting with conditioning agent comprising cationic substantive conditioner effective to deposit film; contacting with carbon dispersion comprising conductive carbon and binder |
| 10/16/2001 | US6303014 Electrodeposition of metals in small recesses using modulated electric fields |
| 10/16/2001 | US6302719 Locking assembly for securing semiconductor device to carrier substrate |
| 10/16/2001 | US6302705 Electrical circuit connector with support |
| 10/16/2001 | US6302704 Method and apparatus for selectively connecting flexible circuits |
| 10/16/2001 | US6302703 Connector for sending power to an IC-chip thru four pressed joints in series |
| 10/16/2001 | US6302702 Connecting devices and method for interconnecting circuit components |
| 10/16/2001 | US6302600 Apparatus for treating surface of boards |
| 10/16/2001 | US6302316 Ball arrangement method and arrangement apparatus |
| 10/16/2001 | US6302306 Method and apparatus for dispensing viscous material |
| 10/16/2001 | CA2229596C Hermetically sealed electrical feedthrough for use with implantable electronic devices |
| 10/16/2001 | CA2006708C Release film composed of a laminate |
| 10/14/2001 | CA2343632A1 Die attach adhesives for use in microelectronic devices |
| 10/11/2001 | WO2001076337A1 Method of manufacturing build-up wiring board |
| 10/11/2001 | WO2001076336A1 Method for fabricating electrical connecting elements, and connecting element |
| 10/11/2001 | WO2001076335A1 Mounting structure of electronic device and method of mounting electronic device |
| 10/11/2001 | WO2001076334A1 Method for producing solderable and functional surfaces on circuit carriers |
| 10/11/2001 | WO2001076333A1 Method and apparatus for applying viscous or paste material onto a substrate |
| 10/11/2001 | WO2001076332A1 Circuit board, method of manufacture thereof, integrated circuit and method of manufacture thereof |
| 10/11/2001 | WO2001076331A1 Element for an electronic assembly |
| 10/11/2001 | WO2001076330A1 Electrical connecting element and method of fabricating the same |
| 10/11/2001 | WO2001075970A2 Element and method for connecting constituents of an electronic assembly |
| 10/11/2001 | WO2001075969A1 Electronic component with flexible contact points and method for the production thereof |
| 10/11/2001 | WO2001075832A1 A method for forming a product sensor, and a product sensor |
| 10/11/2001 | WO2001075461A1 Tester, testing unit and method of manufacturing tester |
| 10/11/2001 | WO2001075458A1 Multiple layer electrical interface |
| 10/11/2001 | WO2001075424A1 Solder cream print visual inspection device and inspecting method |
| 10/11/2001 | WO2001074927A1 Process for producing novel silicone polymer, silicone polymer produced by the process, thermosetting resin composition, resin film, metal foil with insulating material, insulating film with metal foil on each side, metal-clad laminate, multilayered metal-clad laminate, and multilayered printed circuit board |
| 10/11/2001 | WO2001074585A1 Metallized polyimide film |
| 10/11/2001 | WO2001074529A2 Laser system and method for single pass micromachining of multilayer workpieces |
| 10/11/2001 | WO2001074523A1 Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods |
| 10/11/2001 | WO2000054322A8 Flip chip with integrated flux and underfill |
| 10/11/2001 | US20010029130 Electrical connection arrangement and method for the manufacture thereof |
| 10/11/2001 | US20010029128 Electrical connecting structure of mounted part, computer apparatus, and electronic equipment |
| 10/11/2001 | US20010029119 Fine-pitch flexible electrical connector, and method for making same |
| 10/11/2001 | US20010029118 Structure for connecting terminals on wiring board |
| 10/11/2001 | US20010029095 Solder material, device using the same and manufacturing process thereof |
| 10/11/2001 | US20010029066 Method for planarizing circuit board and method for manufacturing semiconductor device |
| 10/11/2001 | US20010029065 Dimensionally stable core for use in high density chip packages and a method of fabricating same |
| 10/11/2001 | US20010029062 Semiconductor device, method of making the same, circuit board, and film carrier tape |