| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 10/25/2001 | DE10103807A1 Verdrahtungssubstrat und Prozess zu seiner Herstellung Wiring substrate and process for its manufacture |
| 10/25/2001 | DE10015349A1 Treatment method for wetting, removal of gas bubbles and improving material exchange in both through and blind holes in circuit boards by impulse generation |
| 10/24/2001 | EP1148156A2 Copper Electroplating |
| 10/24/2001 | EP1147905A1 Method of manufacturing printed-circuit board, method of manufacturing recording device, and mask for printed-circuit board |
| 10/24/2001 | EP1147694A1 Electronic module |
| 10/24/2001 | EP1147234A1 Method for treating a brittle thin metal strip and magnetic parts made from a nanocrystalline alloy strip |
| 10/24/2001 | EP1147070A1 Electrically conductive ceramics |
| 10/24/2001 | EP1147067A1 Aqueous cleaning |
| 10/24/2001 | EP1051887B1 Process for producing a plastic object containing an electronic component |
| 10/24/2001 | EP0886810B1 Multi-tool positioning system |
| 10/24/2001 | EP0843599B1 Vacuum flash evaporated polymer composites |
| 10/24/2001 | EP0813590B1 Cleaning process and apparatus |
| 10/24/2001 | EP0776596B1 Rigid flex printed circuit board |
| 10/24/2001 | CN2456445Y Structure of receiver of material supplier |
| 10/24/2001 | CN2456441Y Chip connector |
| 10/24/2001 | CN2456440Y Angular regulator for electronic parts |
| 10/24/2001 | CN1319323A Method for producing etched circuit |
| 10/24/2001 | CN1319245A Method for assembling metal printed conductors as electrodes on channel plate for ultrawide plat screens |
| 10/24/2001 | CN1319239A Method of manufacturing ceramic electronic copmonents |
| 10/24/2001 | CN1318973A Positioning device for use in process for manufacturing multi-layer printed circuit board and its using method |
| 10/24/2001 | CN1318972A Production process of copper-clad panel and printed circuit board |
| 10/24/2001 | CN1318971A Method for manufacturing printed circuit board |
| 10/23/2001 | US6308056 Double super tuner |
| 10/23/2001 | US6307753 Connection assembly of printed-circuit board and connector and an electronic-equipment plug-in card provided with same |
| 10/23/2001 | US6307749 Overmolded electronic module with underfilled surface-mount components |
| 10/23/2001 | US6307462 Low profile mount for metal oxide varistor package with short circuit protection and method |
| 10/23/2001 | US6307458 Split inductor with fractional turn of each winding and PCB including same |
| 10/23/2001 | US6307446 Planar interconnects using compressible wire bundle contacts |
| 10/23/2001 | US6307389 Test device for flat electronic assemblies |
| 10/23/2001 | US6307260 Microelectronic assembly fabrication with terminal formation from a conductive layer |
| 10/23/2001 | US6307259 Plastic package for semiconductor device |
| 10/23/2001 | US6307176 Light beam heating apparatus |
| 10/23/2001 | US6307161 Partially-overcoated elongate contact structures |
| 10/23/2001 | US6307160 High-strength solder interconnect for copper/electroless nickel/immersion gold metallization solder pad and method |
| 10/23/2001 | US6307159 Bump structure and method for making the same |
| 10/23/2001 | US6306980 Resin composites and method for producing the same |
| 10/23/2001 | US6306935 Thermosetting resin compositions for build-up method |
| 10/23/2001 | US6306688 Method of reworkably removing a fluorinated polymer encapsulant |
| 10/23/2001 | US6306511 Substrate comprising compact of first powder comprising partially sintered glass, functional layer comprising compact of second powder comprising ceramic material having specified electrical property, diffusion bonded by substrate material |
| 10/23/2001 | US6306481 Multilayer circuit board having insulating layer with via-holes |
| 10/23/2001 | US6306456 Filling conductive paste in slit of slit plate; making an external surface of electronic part come in contact with and press against surface of slit plate, wherein elastomer is on second surface; elastically deforming elastomer to protrude |
| 10/23/2001 | US6306224 Process and device for treatment of sheet objects in a liquid bath |
| 10/23/2001 | US6306223 Degreasing method using a surfactant-free composition |
| 10/23/2001 | US6305972 Apparatus for mounting an electronic component to a printed circuit board |
| 10/23/2001 | US6305968 Terminal hardware for flat-type conductor and a method of making a terminal conductor |
| 10/23/2001 | US6305949 Press-fit pin, connector and printed circuit board-connected structure |
| 10/23/2001 | US6305825 Vehicle lighting device with a plurality of light-emitting diodes employed as light source |
| 10/23/2001 | US6305596 Apparatus and method for soldering through-hole components on circuit board |
| 10/23/2001 | US6305258 Punch actuator monitoring system and method |
| 10/23/2001 | CA2067784C Method and device for hermetic encapsulation of electronic components |
| 10/18/2001 | WO2001078477A1 A method for fastening a printed board to an element and a guide element |
| 10/18/2001 | WO2001078475A1 Method and device for fabricating electrical connecting elements, and connecting element |
| 10/18/2001 | WO2001078474A1 Fixing plate, fixing arrangement comprising the fixing plate and the use of said fixing plate |
| 10/18/2001 | WO2001078473A1 Copper-clad laminated sheet |
| 10/18/2001 | WO2001078472A1 Flexible circuit with plated cover layer and overlapping protective layer |
| 10/18/2001 | WO2001078354A2 Hands-free communication device |
| 10/18/2001 | WO2001078199A2 Printed circuit board assembly |
| 10/18/2001 | WO2001078140A2 Chip carrier, relative manufacturing process, and electronic component incorporating such a carrier |
| 10/18/2001 | WO2001078139A1 Common electrode wire for plating |
| 10/18/2001 | WO2001078132A2 Method for transferring semiconductor device layers to different substrates |
| 10/18/2001 | WO2001077753A1 Photoimageable, aqueous acid soluble polyimide polymers |
| 10/18/2001 | WO2001077420A1 Laser hole drilling copper foil |
| 10/18/2001 | WO2001077415A1 3-dimensional imprint tooling and method therefor |
| 10/18/2001 | WO2001077409A2 Method for the selective, metal-based activation of substrate surfaces for the wet-chemical metal deposition without external current and a means therefore |
| 10/18/2001 | WO2001076866A1 Laminate and multilayer printed board manufactured by using the same |
| 10/18/2001 | WO2001076808A2 A method and system for laser drilling |
| 10/18/2001 | US20010032030 Method of part mounting |
| 10/18/2001 | US20010031706 Lubricant film |
| 10/18/2001 | US20010031690 Insulator ceramic is composed of an magnesium oxide-magnesium aluminate (MgO-MgAl2O4) ceramic powder, and a glass powder containing oxides of silicon, boron and with or without alumina, also contains oxides of 1a, 11a, zinc and copper |
| 10/18/2001 | US20010031580 Connector for smart cards |
| 10/18/2001 | US20010031576 Surface mount holding feature |
| 10/18/2001 | US20010031569 High density wirebond connector assembly |
| 10/18/2001 | US20010031567 Interposition structure between substrates |
| 10/18/2001 | US20010030882 Flanged terminal pins for dc/dc converters |
| 10/18/2001 | US20010030550 Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate |
| 10/18/2001 | US20010030521 Cross-connect method and apparatus |
| 10/18/2001 | US20010030295 Electromagnetic wave assisted chemical processing |
| 10/18/2001 | US20010030251 Method for separating metallic material from waste printed circuit boards, and dry distillation apparatus used for waste treatment |
| 10/18/2001 | US20010030225 Soldering method and soldering apparatus |
| 10/18/2001 | US20010030223 Copper preservative treatment |
| 10/18/2001 | US20010030185 Connection of a junction to an electrical conductor track on a plate |
| 10/18/2001 | US20010030176 Switchable wavelength laser-based etched circuit board processing system |
| 10/18/2001 | US20010030122 Laminate comprising polyimide and conductor layer, multi-layer wiring board with the use of the same and process for producing the same |
| 10/18/2001 | US20010030062 Conductive composition |
| 10/18/2001 | US20010030061 Surface-mounting substrate and structure comprising substrate and part mounted on the substrate |
| 10/18/2001 | US20010030058 Multi-layer printed circuit board registration |
| 10/18/2001 | US20010030057 Electronic component package, printing circuit board, and method of inspecting the printed circuit board |
| 10/18/2001 | US20010030019 Anisotropically electroconductive connecting material |
| 10/18/2001 | US20010030013 Method and structure to reduce low force pin pull failures in ceramic substrates |
| 10/18/2001 | US20010029893 Deposited film forming apparatus and deposited film forming method |
| 10/18/2001 | US20010029852 Screen printing method |
| 10/18/2001 | US20010029820 Method and device for separating products, mounted on a common substrate, from each other along (a) cutting lines(s) |
| 10/18/2001 | US20010029674 Abbe error correction system and method |
| 10/18/2001 | US20010029666 Printed-circuit board having projection electrodes and method for producing the same |
| 10/18/2001 | US20010029665 Method of manufacturing ceramic thick-film printed circuit board |
| 10/18/2001 | DE10117872A1 Multilayer monolithic ceramic substrate has thick boundary green layer in contact with thick base green layer |
| 10/18/2001 | DE10115776A1 Sammelschienentragplatte für einen elektrischen Anschlußkasten Busbar support plate for an electric connection box |
| 10/18/2001 | DE10018025A1 Production of solderable surface on circuit carriers in circuit board manufacture comprises preparing a dielectric substrate having copper structures, producing solderable surfaces, and forming functional surfaces in functional regions |
| 10/18/2001 | DE10017774A1 Befestigungsplatte, Befestigungsanordnung mit der Befestigungsplatte und Verwendung der Befestigungsplatte Mounting plate, mounting assembly to the mounting plate and use the mounting plate |
| 10/18/2001 | DE10016132A1 Electronic component for electronic devices comprises electronic switch and conducting paths on surface of the component to electrically connect the switch with metal-coated protrusions made from rubber-elastic insulating material |