| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 10/31/2001 | EP1149422A1 Method and apparatus for applying a metallization pattern to a substrate for a photovoltaic cell |
| 10/31/2001 | EP1149189A2 Method for producing a self-supporting metal film |
| 10/31/2001 | EP0908311B1 Screen printing apparatus and screen printing method |
| 10/31/2001 | EP0894043B1 Method of forming articles and patterning surfaces via capillary micromolding |
| 10/31/2001 | EP0755571B1 Process and device for chemically treating substrates |
| 10/31/2001 | EP0710431B1 Multi-layer printed circuit board and space-saving memory module |
| 10/31/2001 | DE19851868C1 Elektrisches Leiterplatten-Bauteil und Verfahren zur automatischen Bestückung von Leiterplatten mit solchen Bauteilen Electrical PCB component and method for the automatic assembly of printed circuit boards with such components |
| 10/31/2001 | DE10116797A1 Elektrischer Verbinder The electrical connector |
| 10/31/2001 | DE10050726A1 Multi-pole printed circuit board connector has relatively spaced fixing elements for holding contact paths at required relative spacing |
| 10/31/2001 | DE10021125A1 Manufacturing flexible circuit involves positioning flexible circuit foil on grid structure on workpiece bearer with pins, providing solder past, mounting components, soldering in oven |
| 10/31/2001 | DE10019720A1 Verfahren und Vorrichtung zum elektrischen Kontaktieren von plattenförmigem Behandlungsgut bei elektrolytischen Prozessen Method and apparatus for electrically contacting of sheet material to be treated in electrolytic processes |
| 10/31/2001 | DE10019713A1 Vorrichtung und Verfahren zur elektrischen Kontaktierung von elektrolytisch zu behandelndem Gut in Durchlaufanlagen Apparatus and method for electrically contacting electrolytic material to be treated in continuous flow systems |
| 10/31/2001 | DE10019420A1 Solder melting monitoring device evaluates detected electromagnetic radiation reflected from solder joint for providing solder parameter |
| 10/31/2001 | DE10018419A1 Production of a flexible or rigid switching carrier plate comprises providing a composite layer containing a conductor layer and an electrically conducting carrier on a conductor |
| 10/31/2001 | DE10018020A1 Electrical connection arrangement for vehicle closing device, has housing wall arranged in vicinity of connection portion and connection zone of electrical component to form basin |
| 10/31/2001 | DE10017977A1 Device for sealing openings in circuit board, has vertically displaceable sealing medium dispenser and squeegee arranged downstream of scraper |
| 10/31/2001 | DE10001956C1 Electrical connecting element has laminated contact element with two surfaces for contacting different conductors mutually offset with respect to vertical projection |
| 10/31/2001 | CN2457843Y Automatic positioner for ocnnecting interface |
| 10/31/2001 | CN2457842Y Face cleaner for printed circuit board |
| 10/31/2001 | CN2457841Y Circuit board leveler |
| 10/31/2001 | CN1320276A Clad plate for lead frame,s lead frame using the same, and method of manufacturing the lead frame |
| 10/31/2001 | CN1320012A Method for producing multi-layer circuit board |
| 10/31/2001 | CN1319977A Signal receiving/transmitting assembly |
| 10/31/2001 | CN1319885A Fixing clamp distribution board and electronic component assembly and making method thereof |
| 10/31/2001 | CN1319825A Indicator |
| 10/31/2001 | CN1319636A Adhesion agent for electrode conection and connection method using same |
| 10/31/2001 | CN1319571A Isolation ceramic, multi-layer ceramic substrate and laminated electronic component |
| 10/31/2001 | CN1319474A Heating head for hot-pressing bonding and making method thereof |
| 10/31/2001 | CN1074236C Process for producing multilayer printed circuit boards |
| 10/31/2001 | CN1074235C Terminal connecting structure of flexible board and printed circuit board |
| 10/31/2001 | CN1073901C Method and device for dry fluxing of metallic surfaces before soldering or tinning |
| 10/30/2001 | US6310782 Apparatus for maximizing memory density within existing computer system form factors |
| 10/30/2001 | US6310780 Surface mount assembly for electronic components |
| 10/30/2001 | US6310775 Power module substrate |
| 10/30/2001 | US6310759 Ceramic capacitor |
| 10/30/2001 | US6310757 Electronic component having external electrodes and method for the manufacture thereof |
| 10/30/2001 | US6310752 Variable voltage protection structures and method for making same |
| 10/30/2001 | US6310701 Method and apparatus for ablating high-density array of vias or indentation in surface of object |
| 10/30/2001 | US6310536 Termination resistor in printed circuit board |
| 10/30/2001 | US6310527 Multi-layer circuit board including reactance element and a method of trimming a reactance element in a circuit board |
| 10/30/2001 | US6310403 Method of manufacturing components and component thereof |
| 10/30/2001 | US6310401 Substrate for high-voltage modules |
| 10/30/2001 | US6310392 Stacked micro ball grid array packages |
| 10/30/2001 | US6310391 Mounted structure of circuit board and multi-layer circuit board therefor |
| 10/30/2001 | US6310304 Electronic part fabricated by intaglio printing |
| 10/30/2001 | US6310303 Structure for printed circuit design |
| 10/30/2001 | US6310301 Inter-substrate conductive mount for a circuit board, circuit board and power magnetic device employing the same |
| 10/30/2001 | US6310299 Glass connector and fabricating method thereof |
| 10/30/2001 | US6310298 Printed circuit board substrate having solder mask-free edges |
| 10/30/2001 | US6310135 Polyimide resin composition |
| 10/30/2001 | US6309808 Heat mode recording element |
| 10/30/2001 | US6309805 Method for securing and processing thin film materials |
| 10/30/2001 | US6309737 Circuit substrate |
| 10/30/2001 | US6309528 Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes |
| 10/30/2001 | US6309517 Apparatus for inline plating |
| 10/30/2001 | US6309502 Curable alicyclic epoxy resin, styrene thermoplastic elastomer with epoxy group, ultraviolet-active cationic polymerization catalyst; and fluorenediol; heat resistance, waterproofing |
| 10/30/2001 | US6309259 Metal terminal with elastic locking portions |
| 10/30/2001 | US6309241 Branch connection structure for flat cable |
| 10/30/2001 | US6309228 C-shaped compliant contact |
| 10/30/2001 | US6309224 High density wirebond connector assembly |
| 10/30/2001 | US6309151 Device and method for controlling the machining depth of a machine for machining multilayer printed circuit boards |
| 10/30/2001 | US6308406 Method for forming an electrical conductive circuit on a substrate |
| 10/30/2001 | CA2200122C Uni-pad surface mount component package |
| 10/30/2001 | CA2068726C Novel bistriazene compounds and polymeric compositions crosslinked therewith |
| 10/25/2001 | WO2001080613A1 Process for stacking layers that form a multilayer printed circuit |
| 10/25/2001 | WO2001080612A1 Method for fabricating electrical connecting element, and electrical connecting element |
| 10/25/2001 | WO2001080611A1 Method for soldering and soldered joint |
| 10/25/2001 | WO2001080610A1 A method for mounting at least one electronic or mechanical component, a guide element and an electronic or mechanical component |
| 10/25/2001 | WO2001080609A1 Double-sided wiring board and its manufacture method |
| 10/25/2001 | WO2001080207A1 Led switch control imaging device |
| 10/25/2001 | WO2001079867A1 Method of making a probe test board |
| 10/25/2001 | WO2001079691A1 Integrated powertrain control system for large engines |
| 10/25/2001 | WO2001079374A2 Stabilized cationically polymerizable composition, and adhesive film and conductor circuit comprising the same |
| 10/25/2001 | WO2001079371A2 Method for improving bonding of rigid, thermosetting compositions to hydrophilic surfaces, and the articles formed thereby |
| 10/25/2001 | WO2001078931A1 Solder joining |
| 10/25/2001 | WO2001078908A1 High speed flip chip assembly process |
| 10/25/2001 | WO2001033301B1 Printing method |
| 10/25/2001 | WO2000055909A9 Extreme density packaging for electronic assemblies |
| 10/25/2001 | US20010034875 Computer aided design apparatus for aiding design of a printed wiring board to effectively reduce noise |
| 10/25/2001 | US20010034587 Method for determining the desired decoupling components for power distribution systems |
| 10/25/2001 | US20010034144 Electrical conductor |
| 10/25/2001 | US20010034142 Signal transmission connector and cable employing same |
| 10/25/2001 | US20010033963 Layered substrate with battery |
| 10/25/2001 | US20010033891 Blending copper powder with a high-polymer organic substance, adding alumina in cellulose derivative vehicle, and sintering to smaller particles |
| 10/25/2001 | US20010033889 Manufacturing computer systems with fine line circuitized substrates |
| 10/25/2001 | US20010033476 Thermal/mechanical springbeam mechanism for heat transfer from heat source to heat dissipating device |
| 10/25/2001 | US20010033474 Monolithic ceramic electronic component, method for manufacturing the same, and electronic device |
| 10/25/2001 | US20010033355 Mounting structure for semiconductor device, electro-optical device, and electronic apparatus |
| 10/25/2001 | US20010033310 Ink-jet printer having carriage and flexible circuit movably connected, method and apparatus |
| 10/25/2001 | US20010033127 Display panel module with improved bonding structure and method of forming the same |
| 10/25/2001 | US20010033019 Header for electronic components board in surface mount and through-hole assemble |
| 10/25/2001 | US20010032869 Wave soldering method and system used for the method |
| 10/25/2001 | US20010032828 Manufacturing methods for printed circuit boards |
| 10/25/2001 | US20010032740 Microwave package |
| 10/25/2001 | US20010032738 Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
| 10/25/2001 | US20010032700 Printed wiring board |
| 10/25/2001 | US20010032698 Touch screen with an applied edge electrode pattern |
| 10/25/2001 | US20010032556 Screen printing method and screen printing apparatus |
| 10/25/2001 | US20010032388 Structure and method for multiple diameter via |
| 10/25/2001 | US20010032387 Electric wiring forming system |