H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2001
11/08/2001	US20010037568 Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods
11/08/2001	US20010037565 Process for forming a multi-level thin-film electronic packaging structure
11/08/2001	US20010037561 Contacting-making system for two printed circuit boards
11/08/2001	DE10050487A1 Method for structuring wafers or substrates using UBM layer technology, involves adhering plastics strip to surface of wafer and punching holes using laser through plastic band, above UBM layer
11/08/2001	DE10041764A1 Semiconductor component, uses contact forming process based on filling a cavity with an electrical contact material formed from a conductive metallic paste
11/08/2001	DE10021635A1 Verbindungsanordnung und Verfahren zu deren Herstellung Connection arrangement and procedure for their preparation
11/08/2001	DE10020761A1 Foil conductor e.g. for cable harnesses used in motor vehicle, includes a carrier material containing at least one conductor path as well as a covering foil joined to it via an adhesive layer
11/08/2001	CA2413222A1 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
11/08/2001	CA2407190A1 Freestanding reactive multilayer foils
11/08/2001	CA2314036A1 Inert atmosphere soldering apparatus
11/07/2001	EP1152648A2 Housing and method of making
11/07/2001	EP1152647A1 Power supply with no potential ignition source
11/07/2001	EP1152071A1 Copper plating method
11/07/2001	EP1152070A1 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil
11/07/2001	EP1152069A1 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil
11/07/2001	EP1151646A1 Article having a circuit soldered with parts and method for recycling wastes of the same
11/07/2001	EP1150947A1 Method for producing alkanesulfonic acids
11/07/2001	EP0888227B1 Ignition device for release of restraining means in a motor vehicle
11/07/2001	CN2458840Y Carving device for circuit board
11/07/2001	CN2458839Y Oven uniform pressure plate using electric heating to reduce solvent sticking
11/07/2001	CN2458760Y 板对板电连接器 Board-to-board connectors
11/07/2001	CN2458116Y V-slot cutting machine for printed circuit board
11/07/2001	CN1321411A Printed wiring board and method of producing same
11/07/2001	CN1321410A Printed wiring board and method of producing same
11/07/2001	CN1321408A Copper-clad plate and laser machining for copper-clad plate
11/07/2001	CN1321206A Non-crimping polyester monofilament and process for producing same
11/07/2001	CN1321121A Electrolytic copper foil with carrier foil and copper-clad laminate using electrolytic copper foil
11/07/2001	CN1321061A Method for surface treatment of copper foil
11/07/2001	CN1321060A Laser imaging of thin film circuit material
11/07/2001	CN1321059A Circuit board consisting of grain structure magnetic film
11/07/2001	CN1320961A Anisotropic electrically conductive binding material and connecting method
11/07/2001	CN1320957A Method for installing semiconductor chip
11/07/2001	CN1320956A Electronic device without wiring
11/07/2001	CN1074583C Drycorrosion apparatus
11/07/2001	CN1074381C Improved feeding machine for providing electronic component for pickup position
11/06/2001	US6313999 Self alignment device for ball grid array devices
11/06/2001	US6313998 Circuit board assembly having a three dimensional array of integrated circuit packages
11/06/2001	US6313598 Power semiconductor module and motor drive system
11/06/2001	US6313541 Bone-pad with pad edge strengthening structure
11/06/2001	US6313526 Semiconductor apparatus, Including thin film belt-like insulating tape
11/06/2001	US6313524 Chip module with a plurality of flat contact elements mountable on either an external printed circuit board or an external circuit board substrate
11/06/2001	US6313412 Method of assembling substrates and electronic components
11/06/2001	US6313402 Stress relief bend useful in an integrated circuit redistribution patch
11/06/2001	US6313258 Heat resistance, fireproofing, dimensional stability, flexibility; adhesives, moldings
11/06/2001	US6312864 Covering patterned film with a coating film of a heat decomposable resin composition capable of hardening or drying at a temperature lower than the decomposition temperature
11/06/2001	US6312791 Multilayer ceramic substrate with anchored pad
11/06/2001	US6312621 Bis/3,4-epoxycyclohexyl/methyl adipate, 3,4-epoxycyclohexyl methyl 3,4-epoxycyclohexane/carboxylate, bis/4-cyanatophenyl/ ethane, epoxidized polybutadiene, titanium-and/or zirconium-based lewis acid catalyst, dibenzylidene sorbitol.
11/06/2001	US6312614 Method for production of interposer for mounting semiconductor element
11/06/2001	US6312551 Method for mounting semiconductor chip onto circuit board
11/06/2001	US6312287 Coaxial plug connector
11/06/2001	US6312269 Card connector circuit board
11/06/2001	US6312265 Double-sided single-print straddle mount assembly
11/06/2001	US6312264 Connecting device
11/06/2001	US6311888 Resin film and a method for connecting electronic parts by the use thereof
11/06/2001	CA2150353C Detection tag
11/01/2001	WO2001082671A1 Method for shielding at least the upper part of a radiocommunication module, and corresponding radiocommunication module
11/01/2001	WO2001082666A1 Circuit board and production method therefor
11/01/2001	WO2001082665A1 Laminate with inside layer circuit used for multilayer printed circuit board for high frequency circuit, and method and device for measuring circuit impedance of the laminate with inside layer circuit
11/01/2001	WO2001082663A2 Removing inherent stress via high temperature annealing
11/01/2001	WO2001082662A1 Single-sided wiring substrate, display module comprising the same and method of connecting the same
11/01/2001	WO2001082372A1 Polymer stud grid array having feedthroughs and method for producing a substrate for a polymer stud grid array of this type
11/01/2001	WO2001082363A1 Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure
11/01/2001	WO2001082362A2 Process for forming electrical/mechanical connections
11/01/2001	WO2001081659A1 Electrical contacting element made of an elastic material
11/01/2001	WO2001081657A2 Elastic contact element
11/01/2001	WO2001081652A1 Pretreating agent for metal plating
11/01/2001	WO2001081088A2 Apparatus for aligning a flexible circuit on an ink jet printer carriage
11/01/2001	WO2001081043A1 Process to minimize and/or eliminate conductive material coating over the top surface of a patterned substrate and layer structure made thereby
11/01/2001	WO2001043269A3 Method and apparatus for making an electrical device
11/01/2001	US20010036718 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
11/01/2001	US20010036684 Electronic component and manufacturing method therefor
11/01/2001	US20010036561 Device on a receptor substrate two active layers formed by transferring a multicomponent transfer unit from a thermal transfer element comprising the transfer unit and a substrate; organic electroluminescent device
11/01/2001	US20010036514 Partial plating system
11/01/2001	US20010036506 Substrate and process for producing the same
11/01/2001	US20010036066 Method and apparatus for delivering power to high performance electronic assemblies
11/01/2001	US20010036065 Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein
11/01/2001	US20010036064 Circuit board and a method for making the same
11/01/2001	US20010036063 Electronic part module mounted on
11/01/2001	US20010036052 Dielectric material including particulate filler
11/01/2001	US20010035799 Circuit board device and design support device
11/01/2001	US20010035760 Test socket and methods
11/01/2001	US20010035759 Method and device for semiconductor testing using electrically conductive adhesives
11/01/2001	US20010035687 Vibration motor holding apparatus and portable electronic equipment having the same
11/01/2001	US20010035585 Semiconductor device having stress reducing laminate and method for manufacturing the same
11/01/2001	US20010035570 Package for semiconductor devices
11/01/2001	US20010035346 Apparatus and method for electroplating
11/01/2001	US20010035343 Fine pattern forming method, developing/washing device used for the same, plating method using the same, and manufacturing method of thin film magnetic head using the same
11/01/2001	US20010035301 Method and article for the connection and repair of flex and other circuits
11/01/2001	US20010035300 Printed circuit variable impedance transmission line antenna
11/01/2001	US20010035299 Circuit board and method for making the same
11/01/2001	US20010035298 Circuit board and a method for making the same
11/01/2001	US20010035297 Wiring material and connecting structure of said wiring material
11/01/2001	US20010034937 Conductor interconnect with dendrites through film and method for producing same
11/01/2001	CA2405573A1 Electrical contact element made of an elastic material
11/01/2001	CA2402805A1 Elastic contact element
10/2001
10/31/2001	EP1150551A1 Conductive connecting pin and package board
10/31/2001	EP1150343A2 Aperture fill
10/31/2001	EP1149936A2 Plating system
10/31/2001	EP1149698A2 Screen printing method and screen printing apparatus
10/31/2001	EP1149661A2 Soldering flux for circuit board and circuit board

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