H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2001
11/15/2001	US20010039715 Substrate manufacturing plant having minimum footprint skinned lines
11/15/2001	DE19939854C2 Stromdurchführungsfilter Current feedthrough filter
11/15/2001	DE10021859A1 Printed circuit board used in the semiconductor industry comprises a conductor layer containing a bond window with a conducting pathway
11/14/2001	EP1154524A1 Terminal connecting device for flexible substrate
11/14/2001	EP1154512A2 Radio frequency circuit module on multi-layer substrate
11/14/2001	EP1154481A2 Interposer and semiconductor device using it
11/14/2001	EP1154480A2 Wiring board and semiconductor device including it
11/14/2001	EP1154469A1 Transfer material, method for producing the same and wiring substrate produced by using the same
11/14/2001	EP1153985A1 Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module
11/14/2001	EP1153665A2 Device for surface treatment of sheet material
11/14/2001	EP1153532A1 Flexible printed circuit board arrangement
11/14/2001	EP1153531A1 Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
11/14/2001	EP1153460A1 Device for electrically and mechanically connecting two printed circuit boards
11/14/2001	EP1153360A1 In-line programming system and method
11/14/2001	EP1153309A1 Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuit board
11/14/2001	EP1153183A1 Key with integrated, electronic control circuit for a vehicle security system
11/14/2001	EP1152862A1 Compact reflow and cleaning apparatus
11/14/2001	EP0828580B1 Process and device for the wave or vapour-phase soldering of electronic units
11/14/2001	EP0797558B1 Electrically conductive connection
11/14/2001	CN1322367A Method for mfg. electronic device of ceramic
11/14/2001	CN1322349A Head suspension with flexible circuit interconnect for reduced moisture permeability
11/14/2001	CN1322259A Electrolytic copper foil with carrier foil and method for manufacturing same and copper-clad laminate using electrolytic copper foil with carrier foil
11/14/2001	CN1322229A Adhesive for bonding circuit members, circuit board, and method of producing same
11/14/2001	CN1322166A Electrically conductive adhesive transfers
11/14/2001	CN1322106A Solidified glue silk-screen printing screen frame for circuit board and its processing method
11/14/2001	CN1322105A Method for mfg. multilayer integrated substrate and multilayer ceramic element
11/14/2001	CN1321898A Three-D installed element, its mfg. method and optical transmission device
11/14/2001	CN1321784A High density rod grid array connection and method thereof
11/14/2001	CN1321715A Adhesive of fixing matrix for microelectronic device
11/14/2001	CN1321569A Location hole perforating machine
11/14/2001	CN1074824C Illuminating apparatus
11/13/2001	US6317864 System and method for graphic layout modification
11/13/2001	US6317513 Method and apparatus for inspecting solder paste using geometric constraints
11/13/2001	US6317248 Busbars for electrically powered cells
11/13/2001	US6317023 Method to embed passive components
11/13/2001	US6316952 Flexible conductive structures and method
11/13/2001	US6316944 Effective netlength calculation
11/13/2001	US6316824 Plastic leads frames for semiconductor devices
11/13/2001	US6316738 Printed wiring board and manufacturing method thereof
11/13/2001	US6316737 Making a connection between a component and a circuit board
11/13/2001	US6316736 Anti-bridging solder ball collection zones
11/13/2001	US6316735 Semiconductor chip mounting board and a semiconductor device using same board
11/13/2001	US6316734 Flexible circuits with static discharge protection and process for manufacture
11/13/2001	US6316733 Component for use in forming printed circuit boards
11/13/2001	US6316732 Printed circuit boards with cavity and method of producing the same
11/13/2001	US6316731 Method of forming a printed wiring board with compensation scales
11/13/2001	US6316583 Fluorescence, ultraviolet radiation absorbance and solubility in organic solvents, can be epoxidized to form epoxy products whicha are used in manufacture of laminates, coatings, and adhesives
11/13/2001	US6316291 Method of fabricating a non-laminate carrier substrate utilizing a mold
11/13/2001	US6316289 Method of forming fine-pitch interconnections employing a standoff mask
11/13/2001	US6316104 Based on polymer resins and containing a cationic scavenger (e.g., titanium phosphate) are provided for circuit materials and flat cables with metallic wiring.
11/13/2001	US6316059 Modifying the substrate with a silane layer, locally removing said layer with uv-ozone treatment and selectively nucleating the remaining silane layer in a polymer-stabilized pd sol.
11/13/2001	US6316056 Procedure for producing isolation copper facing membrane
11/13/2001	US6315856 Method of mounting electronic component
11/13/2001	US6315577 Electronic component with lead and lead terminal
11/13/2001	US6315185 Ball mount apparatus
11/13/2001	US6315024 Manual electronic-part mounting apparatus and method
11/13/2001	US6314852 Gang punch tool assembly
11/13/2001	US6314785 Apparatus for producing a plated product having recesses
11/13/2001	US6314660 Cascaded tensioning tangential drive for THA handling
11/13/2001	US6314641 Interconnect for testing semiconductor components and method of fabrication
11/13/2001	CA2145991C A screen printing stencil
11/08/2001	WO2001084900A1 Connector apparatus
11/08/2001	WO2001084896A1 Printed circuit boards
11/08/2001	WO2001084895A1 System for mounting electronic device
11/08/2001	WO2001084674A1 Connection device and method for the production thereof
11/08/2001	WO2001084584A1 Electroluminescent lamp devices and their manufacture
11/08/2001	WO2001084581A2 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
11/08/2001	WO2001084575A1 Printed circuit variable impedance transmission line antenna
11/08/2001	WO2001083844A2 Method for depositing metal and metal oxide films and patterned films
11/08/2001	WO2001083623A2 Method of making reactive multilayer foil and resulting product
11/08/2001	WO2001083230A1 Method for improving the print quality when using printing screens
11/08/2001	WO2001083205A2 Reactive multilayer structures for ease of processing and enhanced ductility
11/08/2001	WO2001083182A1 Freestanding reactive multilayer foils
11/08/2001	WO2001083146A1 Method for mounting, on a circuit board, a motor powering a support shaft
11/08/2001	US20010039646 Structure having multiple levels of programmable integrated circuits for interconnecting electronic components
11/08/2001	US20010039300 Photo-curable resin composition, process for producing the same and products using the same
11/08/2001	US20010039251 For semiconductor packaging products
11/08/2001	US20010039165 Apparatus and methods for substantial planarization of solder bumps
11/08/2001	US20010039164 Apparatus and methods for substantial planarization of solder bumps
11/08/2001	US20010039109 Lithographic contact elements
11/08/2001	US20010038906 Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
11/08/2001	US20010038905 Printed wiring board and method of manufacturing the same
11/08/2001	US20010038882 Apparatus and method for printing solder paste
11/08/2001	US20010038531 Package substrate
11/08/2001	US20010038527 Inter-circuit encapsulated packaging
11/08/2001	US20010038310 Power transistor module, power amplifier and methods in the fabrication thereof
11/08/2001	US20010038293 Projection electrode, its forming method and apparatus for testing an electronic component
11/08/2001	US20010038150 Semiconductor device manufactured by package group molding and dicing method
11/08/2001	US20010038149 Multilayered wiring structure and method of manufacturing the same
11/08/2001	US20010038145 Multilayer wiring board, semiconductor device and methods for manufacturing such multilayer wiring board and semiconductor device
11/08/2001	US20010038089 Process for ashing organic materials from substrates
11/08/2001	US20010038068 Device for treating a substrate by laser radiation
11/08/2001	US20010038029 Method of making reactive multilayer foil and resulting product
11/08/2001	US20010037993 Etching method and wiring board manufactured by the method
11/08/2001	US20010037898 Circuit board and a method for making the same
11/08/2001	US20010037897 Wiring board comprising granular magnetic film
11/08/2001	US20010037896 Package substrate
11/08/2001	US20010037895 Electronic component and manufacturing method thereof
11/08/2001	US20010037893 Method and an arrangement relating to the encapsulation of a component
11/08/2001	US20010037673 Solder paste tester

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