Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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11/21/2001 | CN1323506A Fabrication process for flex circuit application |
11/21/2001 | CN1323505A Article having an embedded electronic device, and method of making same |
11/21/2001 | CN1323504A Electromechanical component |
11/21/2001 | CN1323407A Device and method for the optical inspection of concealed soldered connections |
11/21/2001 | CN1323155A Circuit board resin material laminating method |
11/21/2001 | CN1075339C Electromagnetic interference suppressing body with low electromagnetic penetrability and reflectivity, and its electronic device |
11/21/2001 | CN1075338C Electric circuit substrate connecting member and method for producing multilayer circuit substrates using the same |
11/21/2001 | CN1075263C 电击保护器 Electric shock protection |
11/21/2001 | CN1075256C Connector mounted on electric circuit board |
11/21/2001 | CN1075126C Activating catalytic solution for chemical sedimentation and chemical sedimentation method |
11/20/2001 | US6320762 Fixed conductive pin for printed wiring substrate electronics case and method of manufacture therefor |
11/20/2001 | US6320758 Integrated circuit mounting board with bypass capacitors |
11/20/2001 | US6320755 Retention mechanism for tall PCB components |
11/20/2001 | US6320750 Sub-modular configurable avionics |
11/20/2001 | US6320738 Monolithic ceramic electronic component and method for making the same |
11/20/2001 | US6320691 Electrode connection method |
11/20/2001 | US6320556 RFID foil or film antennas |
11/20/2001 | US6320489 Electronic surface mount package with extended side retaining wall |
11/20/2001 | US6320397 Molded plastic carrier for testing semiconductor dice |
11/20/2001 | US6320254 Plug structure |
11/20/2001 | US6320249 Multiple line grids incorporating therein circuit elements |
11/20/2001 | US6320247 Unit type clip lead terminal, clip lead terminal connecting method, lead terminal connecting board, and method of producing board with lead terminals |
11/20/2001 | US6320158 Method and apparatus of fabricating perforated plate |
11/20/2001 | US6320140 One-sided circuit board for multi-layer printed wiring board, multi-layer printed wiring board, and method of its production |
11/20/2001 | US6320139 Reflow selective shorting |
11/20/2001 | US6320137 Flexible circuit with coverplate layer and overlapping protective layer |
11/20/2001 | US6320136 Layered printed-circuit-board and module using the same |
11/20/2001 | US6320135 Flexible wiring substrate and its manufacturing method |
11/20/2001 | US6320128 Environmentally-sealed electronic assembly and method of making same |
11/20/2001 | US6320126 Vertical ball grid array integrated circuit package |
11/20/2001 | US6319829 Enhanced interconnection to ceramic substrates |
11/20/2001 | US6319811 Bond ply structure and associated process for interconnection of circuit layer pairs with conductive inks |
11/20/2001 | US6319810 Method for forming solder bumps |
11/20/2001 | US6319750 Layout method for thin and fine ball grid array package substrate with plating bus |
11/20/2001 | US6319741 Method for fabricating metal interconnections and wiring board having the metal interconnections |
11/20/2001 | US6319621 Copper foil having glossy surface with excellent oxidation resistance and method of manufacturing the same |
11/20/2001 | US6319620 Making and using an ultra-thin copper foil |
11/20/2001 | US6319596 Barrier laminate |
11/20/2001 | US6319564 Multilayer element with coating a nonconductive organic heavy metal complex to a microporous surface, breaking up the complex and metallization the conductor tracks |
11/20/2001 | US6319554 Method and apparatus for surface metallization |
11/20/2001 | US6319543 Process for silver plating in printed circuit board manufacture |
11/20/2001 | US6319418 Zig-zagged plating bus lines |
11/20/2001 | US6319384 Immersion substrate and counterelectrode in electroplating bath; electrolysis with modulated reversing electric current of cathodic pulses; free of brighteners; filling, leveling |
11/20/2001 | US6319383 Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated |
11/20/2001 | US6319030 Switching receptacle connector |
11/20/2001 | US6319024 Strain relief mechanism for a plug-in protector panel |
11/20/2001 | US6319018 Circuit board electrical and physical connection system and method |
11/20/2001 | US6318624 Solder balltape and method for making electrical connection between a head transducer and an electrical lead |
11/20/2001 | US6317974 Methods for creating wear resistant contact edges |
11/20/2001 | US6317948 Embedded thin film passive components |
11/20/2001 | CA2058716C Printed circuit board assembly handle/stiffener |
11/20/2001 | CA2025831C Radiation-polymerizable mixture and process for producing a solder resist mask |
11/15/2001 | WO2001087024A1 Method of producing multilayer circuit boards |
11/15/2001 | WO2001087023A1 Multilayer circuit board and method of producing the same |
11/15/2001 | WO2001086774A1 Passive electrostatic shielding structure for electrical circuitry and energy conditioning with outer partial-shielded energy pathways |
11/15/2001 | WO2001086716A1 Semiconductor device mounting circuit board, method of producing the same, and method of producing mounting structure using the same |
11/15/2001 | WO2001086641A1 Hard disk drive suspension with integral flexible circuit |
11/15/2001 | WO2001086276A1 Method for the production of a three-dimensional sensor element |
11/15/2001 | WO2001085362A1 Component of printed circuit board |
11/15/2001 | WO2001039922B1 Soldering flux |
11/15/2001 | WO2001009952A3 Interconnect assemblies and methods |
11/15/2001 | US20010041582 Cellular telephone with a changeable key arrangement |
11/15/2001 | US20010041518 Apparatus and methods for substantial planarization of solder bumps |
11/15/2001 | US20010041516 Apparatus and methods for substantial planarization of solder bumps |
11/15/2001 | US20010041515 Apparatus and methods for substantial planarization of solder bumps |
11/15/2001 | US20010041506 Apparatus and methods for substantial planarization of solder bumps |
11/15/2001 | US20010041505 Apparatus and methods for substantial planarization of solder bumps |
11/15/2001 | US20010041504 Apparatus and methods for substantial planarization of solder bumps |
11/15/2001 | US20010041503 Apparatus and methods for substantial planarization of solder bumps |
11/15/2001 | US20010041481 Solder-holding clips for applying solder to connectors or the like |
11/15/2001 | US20010041465 Z-axis electrical interconnect |
11/15/2001 | US20010041464 Terminal connecting device for flexible substrate |
11/15/2001 | US20010041437 Method of locating conductive spheres utilizing screen and hopper of solder balls |
11/15/2001 | US20010041389 Smiconductor device having a thermoset- containing dielectric material and methods for fabricating the same |
11/15/2001 | US20010041385 Plated leadframes with cantilevered leads |
11/15/2001 | US20010041370 Semiconductor package with heat sink and method of fabrication |
11/15/2001 | US20010041308 Integrated circuits |
11/15/2001 | US20010041267 Multilayer; nickel phosphide aand nickel boride |
11/15/2001 | US20010040794 Printed wiring board and method for producing the same |
11/15/2001 | US20010040664 Tape carrier package and display device using the same |
11/15/2001 | US20010040299 Flip chip adaptor package for bare die |
11/15/2001 | US20010040296 Printed-circuit board and method of mounting electric components thereon |
11/15/2001 | US20010040294 Porous dielectric material and electronic devices fabricated therewith |
11/15/2001 | US20010040287 Surface mount package including terminal on its side |
11/15/2001 | US20010040272 Interposer for semiconductor, method for manufacturing the same and semiconductor device using such interposer |
11/15/2001 | US20010040239 Chip-type semiconductor light-emitting device |
11/15/2001 | US20010040217 Connection inspecting apparatus, connection inspecting method, and recording medium for recording programs executing the method |
11/15/2001 | US20010040151 Laser machining method, laser machining apparatus, and its control method |
11/15/2001 | US20010040145 Step and flash imprint lithography |
11/15/2001 | US20010040132 Treating fluids by exposure to line of magnetic force to facilitate removal of contaminants such as scale forming substances used in production of circuit boards |
11/15/2001 | US20010040051 Coaxial cable, method for manufacturing a coaxial cable, and wireless communication device |
11/15/2001 | US20010040048 Circuit board and a method for making the same |
11/15/2001 | US20010040047 Process for reducing extraneous metal plating |
11/15/2001 | US20010039891 Mask for screen printing, the method for producing same and circuit board produced by screen printing with such mask |
11/15/2001 | US20010039729 Method of aligning features in a multi-layer electrical connective device |
11/15/2001 | US20010039728 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
11/15/2001 | US20010039727 Manufacturing method for multilayer printed circuit board |
11/15/2001 | US20010039725 Process for manufacturing electronic circuits |
11/15/2001 | US20010039724 Method and apparatus for mounting circuit elements on a printed wiring board |
11/15/2001 | US20010039720 Apparatus for manufacturing a wiring board and method for manufacturing a wiring board |