Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2001
11/21/2001CN1323506A Fabrication process for flex circuit application
11/21/2001CN1323505A Article having an embedded electronic device, and method of making same
11/21/2001CN1323504A Electromechanical component
11/21/2001CN1323407A Device and method for the optical inspection of concealed soldered connections
11/21/2001CN1323155A Circuit board resin material laminating method
11/21/2001CN1075339C Electromagnetic interference suppressing body with low electromagnetic penetrability and reflectivity, and its electronic device
11/21/2001CN1075338C Electric circuit substrate connecting member and method for producing multilayer circuit substrates using the same
11/21/2001CN1075263C 电击保护器 Electric shock protection
11/21/2001CN1075256C Connector mounted on electric circuit board
11/21/2001CN1075126C Activating catalytic solution for chemical sedimentation and chemical sedimentation method
11/20/2001US6320762 Fixed conductive pin for printed wiring substrate electronics case and method of manufacture therefor
11/20/2001US6320758 Integrated circuit mounting board with bypass capacitors
11/20/2001US6320755 Retention mechanism for tall PCB components
11/20/2001US6320750 Sub-modular configurable avionics
11/20/2001US6320738 Monolithic ceramic electronic component and method for making the same
11/20/2001US6320691 Electrode connection method
11/20/2001US6320556 RFID foil or film antennas
11/20/2001US6320489 Electronic surface mount package with extended side retaining wall
11/20/2001US6320397 Molded plastic carrier for testing semiconductor dice
11/20/2001US6320254 Plug structure
11/20/2001US6320249 Multiple line grids incorporating therein circuit elements
11/20/2001US6320247 Unit type clip lead terminal, clip lead terminal connecting method, lead terminal connecting board, and method of producing board with lead terminals
11/20/2001US6320158 Method and apparatus of fabricating perforated plate
11/20/2001US6320140 One-sided circuit board for multi-layer printed wiring board, multi-layer printed wiring board, and method of its production
11/20/2001US6320139 Reflow selective shorting
11/20/2001US6320137 Flexible circuit with coverplate layer and overlapping protective layer
11/20/2001US6320136 Layered printed-circuit-board and module using the same
11/20/2001US6320135 Flexible wiring substrate and its manufacturing method
11/20/2001US6320128 Environmentally-sealed electronic assembly and method of making same
11/20/2001US6320126 Vertical ball grid array integrated circuit package
11/20/2001US6319829 Enhanced interconnection to ceramic substrates
11/20/2001US6319811 Bond ply structure and associated process for interconnection of circuit layer pairs with conductive inks
11/20/2001US6319810 Method for forming solder bumps
11/20/2001US6319750 Layout method for thin and fine ball grid array package substrate with plating bus
11/20/2001US6319741 Method for fabricating metal interconnections and wiring board having the metal interconnections
11/20/2001US6319621 Copper foil having glossy surface with excellent oxidation resistance and method of manufacturing the same
11/20/2001US6319620 Making and using an ultra-thin copper foil
11/20/2001US6319596 Barrier laminate
11/20/2001US6319564 Multilayer element with coating a nonconductive organic heavy metal complex to a microporous surface, breaking up the complex and metallization the conductor tracks
11/20/2001US6319554 Method and apparatus for surface metallization
11/20/2001US6319543 Process for silver plating in printed circuit board manufacture
11/20/2001US6319418 Zig-zagged plating bus lines
11/20/2001US6319384 Immersion substrate and counterelectrode in electroplating bath; electrolysis with modulated reversing electric current of cathodic pulses; free of brighteners; filling, leveling
11/20/2001US6319383 Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated
11/20/2001US6319030 Switching receptacle connector
11/20/2001US6319024 Strain relief mechanism for a plug-in protector panel
11/20/2001US6319018 Circuit board electrical and physical connection system and method
11/20/2001US6318624 Solder balltape and method for making electrical connection between a head transducer and an electrical lead
11/20/2001US6317974 Methods for creating wear resistant contact edges
11/20/2001US6317948 Embedded thin film passive components
11/20/2001CA2058716C Printed circuit board assembly handle/stiffener
11/20/2001CA2025831C Radiation-polymerizable mixture and process for producing a solder resist mask
11/15/2001WO2001087024A1 Method of producing multilayer circuit boards
11/15/2001WO2001087023A1 Multilayer circuit board and method of producing the same
11/15/2001WO2001086774A1 Passive electrostatic shielding structure for electrical circuitry and energy conditioning with outer partial-shielded energy pathways
11/15/2001WO2001086716A1 Semiconductor device mounting circuit board, method of producing the same, and method of producing mounting structure using the same
11/15/2001WO2001086641A1 Hard disk drive suspension with integral flexible circuit
11/15/2001WO2001086276A1 Method for the production of a three-dimensional sensor element
11/15/2001WO2001085362A1 Component of printed circuit board
11/15/2001WO2001039922B1 Soldering flux
11/15/2001WO2001009952A3 Interconnect assemblies and methods
11/15/2001US20010041582 Cellular telephone with a changeable key arrangement
11/15/2001US20010041518 Apparatus and methods for substantial planarization of solder bumps
11/15/2001US20010041516 Apparatus and methods for substantial planarization of solder bumps
11/15/2001US20010041515 Apparatus and methods for substantial planarization of solder bumps
11/15/2001US20010041506 Apparatus and methods for substantial planarization of solder bumps
11/15/2001US20010041505 Apparatus and methods for substantial planarization of solder bumps
11/15/2001US20010041504 Apparatus and methods for substantial planarization of solder bumps
11/15/2001US20010041503 Apparatus and methods for substantial planarization of solder bumps
11/15/2001US20010041481 Solder-holding clips for applying solder to connectors or the like
11/15/2001US20010041465 Z-axis electrical interconnect
11/15/2001US20010041464 Terminal connecting device for flexible substrate
11/15/2001US20010041437 Method of locating conductive spheres utilizing screen and hopper of solder balls
11/15/2001US20010041389 Smiconductor device having a thermoset- containing dielectric material and methods for fabricating the same
11/15/2001US20010041385 Plated leadframes with cantilevered leads
11/15/2001US20010041370 Semiconductor package with heat sink and method of fabrication
11/15/2001US20010041308 Integrated circuits
11/15/2001US20010041267 Multilayer; nickel phosphide aand nickel boride
11/15/2001US20010040794 Printed wiring board and method for producing the same
11/15/2001US20010040664 Tape carrier package and display device using the same
11/15/2001US20010040299 Flip chip adaptor package for bare die
11/15/2001US20010040296 Printed-circuit board and method of mounting electric components thereon
11/15/2001US20010040294 Porous dielectric material and electronic devices fabricated therewith
11/15/2001US20010040287 Surface mount package including terminal on its side
11/15/2001US20010040272 Interposer for semiconductor, method for manufacturing the same and semiconductor device using such interposer
11/15/2001US20010040239 Chip-type semiconductor light-emitting device
11/15/2001US20010040217 Connection inspecting apparatus, connection inspecting method, and recording medium for recording programs executing the method
11/15/2001US20010040151 Laser machining method, laser machining apparatus, and its control method
11/15/2001US20010040145 Step and flash imprint lithography
11/15/2001US20010040132 Treating fluids by exposure to line of magnetic force to facilitate removal of contaminants such as scale forming substances used in production of circuit boards
11/15/2001US20010040051 Coaxial cable, method for manufacturing a coaxial cable, and wireless communication device
11/15/2001US20010040048 Circuit board and a method for making the same
11/15/2001US20010040047 Process for reducing extraneous metal plating
11/15/2001US20010039891 Mask for screen printing, the method for producing same and circuit board produced by screen printing with such mask
11/15/2001US20010039729 Method of aligning features in a multi-layer electrical connective device
11/15/2001US20010039728 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
11/15/2001US20010039727 Manufacturing method for multilayer printed circuit board
11/15/2001US20010039725 Process for manufacturing electronic circuits
11/15/2001US20010039724 Method and apparatus for mounting circuit elements on a printed wiring board
11/15/2001US20010039720 Apparatus for manufacturing a wiring board and method for manufacturing a wiring board