H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2001
11/28/2001	CN1323998A Electrooptical device assembling basic parts and its mfg. method, terminal connection method
11/28/2001	CN1323695A Copper foil having low surface outline adhering enhancer
11/28/2001	CN1323660A Sheat meterial surface treatment device
11/27/2001	US6324428 Implantable medical device having an improved electronic assembly for increasing packaging density and enhancing component protection
11/27/2001	US6324068 Electronic component device, and main board for circuit boards
11/27/2001	US6324067 Printed wiring board and assembly of the same
11/27/2001	US6324066 Surface mountable electronic device
11/27/2001	US6324053 Wearable data processing system and apparel
11/27/2001	US6323989 Electrophoretic displays using nanoparticles
11/27/2001	US6323936 Machine for exposing a panel to laser radiation
11/27/2001	US6323551 Resin sealed-type semiconductor device and method of manufacturing the same
11/27/2001	US6323549 Ceramic composite wiring structures for semiconductor devices and method of manufacture
11/27/2001	US6323544 Plated leadframes with cantilevered leads
11/27/2001	US6323543 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
11/27/2001	US6323440 Part holder, substrate having same, and method of manufacturing same
11/27/2001	US6323439 Metal core multilayer resin wiring board with thin portion and method for manufacturing the same
11/27/2001	US6323437 Spring clamp adapted for coupling with a circuit board
11/27/2001	US6323436 High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer
11/27/2001	US6323435 Low-impedance high-density deposited-on-laminate structures having reduced stress
11/27/2001	US6323434 Circuit board and production method thereof
11/27/2001	US6323432 Manufacture of dendrites and their use
11/27/2001	US6323096 Method for fabricating a flexible interconnect film with resistor and capacitor layers
11/27/2001	US6323064 Method for fabricating a memory card
11/27/2001	US6323045 Method and structure for top-to-bottom I/O nets repair in a thin film transfer and join process
11/27/2001	US6322955 Etching method
11/27/2001	US6322952 Photosensitive resin composition and photoresist ink for manufacturing printed wiring boards
11/27/2001	US6322904 Copper foil for printed circuit boards
11/27/2001	US6322848 Flexible epoxy encapsulating material
11/27/2001	US6322736 Method for fabricating molded microstructures on substrates
11/27/2001	US6322687 Electrolytic process for forming a mineral
11/27/2001	US6322685 Apparatus and method for plating coatings on to fine powder materials and use of the powder therefrom
11/27/2001	US6322684 Apparatus and method for electroplating or electroetching a substrate
11/27/2001	US6322656 Method and composition for amine borane reduction of copper oxide to metallic copper
11/27/2001	US6322373 Contact structure of electrical connector and inspecting device therefor
11/27/2001	US6321994 Contactless communication data carrier with fully enclosed holding means for holding a chip and a passive component
11/27/2001	US6321972 Apparatus and method for filling a ball grid array
11/27/2001	US6321444 Method of making surface acoustic wave device
11/27/2001	US6321443 Connection substrate
11/27/2001	CA2171458C Multi-chip module
11/26/2001	CA2348581A1 Low loss material for the manufacture of pcb's and antenna boards and a method for producing same
11/22/2001	WO2001089277A1 Method for repairing circuit connecton part, and structure and method for connecting circuit terminal of circuit repaired by the method
11/22/2001	WO2001089276A1 Method for manufacturing printed wiring board
11/22/2001	WO2001088958A2 Spontaneous pattern formation of functional materials
11/22/2001	WO2001087503A1 Additive electronic circuits on thermally unstable substrates
11/22/2001	WO2001059185A8 Pre-plate treating system
11/22/2001	US20010044262 Apparatus and methods for substantial planarization of solder bumps
11/22/2001	US20010044259 Ultra fine particle film forming method and apparatus
11/22/2001	US20010044225 Method for forming microelectronic spring structures on a substrate
11/22/2001	US20010044211 Removal of copper oxides from integrated interconnects
11/22/2001	US20010044198 Repairable flip chip semiconductor device with excellent packaging reliability and method of manufacturing same
11/22/2001	US20010044013 Thin film transferrable electric components
11/22/2001	US20010043778 Optical wavelength division multiplexer and/or demultiplexer with mechanical strain relief
11/22/2001	US20010043464 Attachment structure of electronic component to circuit board and clip used in attachment of the electronic component
11/22/2001	US20010043197 Electronic apparatus
11/22/2001	US20010042907 Radio frequency circuit module on multi-layer substrate
11/22/2001	US20010042780 Method of connecting circuit boards
11/22/2001	US20010042778 Flux cleaning method and method of manufacturing semiconductor device
11/22/2001	US20010042775 Soldering flux
11/22/2001	US20010042734 Methods of planarizing structures on wafers and substrates by polishing
11/22/2001	US20010042733 Process for manufacturing a multi-layer circuit board
11/22/2001	US20010042732 Method for manufacturing printed wiring board
11/22/2001	US20010042689 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
11/22/2001	US20010042640 Printed wiring board having cavity for mounting electronic parts therein and method for manufacturing thereof
11/22/2001	US20010042637 Multilayered printed circuit board and manufacturing method therefor
11/22/2001	US20010042636 Printed circuit board electrical interconnects
11/22/2001	US20010042506 Method and apparatus for applying a liquid coating with an improved spray nozzle
11/22/2001	US20010042304 Thin-film structure having reliably removable oxide layer formed on bump exposed at surface of insulating layer and manufacturing method therefor
11/22/2001	DE10024689A1 Stacking machine for screen printed panels comprises first lift which raises panels, second lift which lowers them for further processing, transfer conveyor between them and support bars which can be raised and lowered by their own drives
11/22/2001	DE10024688A1 Thermally-insulated stacking racks for screen printed panels minimizes drying energy requirement
11/22/2001	DE10023736A1 Leiterplatte sowie Verfahren zur Herstellung einer Leiterplatte Printed circuit board and method of manufacturing a printed circuit board
11/21/2001	EP1156711A1 Potting or moulding material with electromagnetic properties for building electronic component
11/21/2001	EP1156710A2 Attachment structure of electronic component to circuit board and clip used in attachment of the electronic component
11/21/2001	EP1156709A1 Method of forming transferable printed pattern, and glass with printed pattern
11/21/2001	EP1156708A2 Circuit board and method for manufacturing a circuit board
11/21/2001	EP1156707A1 Wiring board and production method thereof
11/21/2001	EP1156706A1 Article having a circuit soldered with parts and method for recycling wastes of the same
11/21/2001	EP1156644A1 Electronic device having a simplified keyboard, in particular a mobile phone
11/21/2001	EP1156525A1 Multilayer circuit board and semiconductor device
11/21/2001	EP1156520A1 Electronic parts mounting method and device therefor
11/21/2001	EP1155981A2 Device for stacking sheet material
11/21/2001	EP1155798A1 Adhesive bonding using variable frequency microwave energy
11/21/2001	EP1155767A2 Method for determining flow conditions in reflow soldering devices and test board
11/21/2001	EP1155603A1 Method for making electronic modules with ball connector or with integrated preforms capable of being soldered on a printed circuit and implementing device
11/21/2001	EP1155602A1 Electrical connection method and connection site
11/21/2001	EP1155601A1 An environmentally desirable method of manufacturing printed circuits
11/21/2001	EP1155449A1 Semiconductor component with a chip carrier with openings for contacting
11/21/2001	EP1155445A1 Method for producing electrically conductive connections
11/21/2001	EP1155420A1 Bus bar assembly
11/21/2001	EP1154914A1 Control apparatus for an automobile
11/21/2001	EP1154866A1 Polymer-coated metal composites by dip autopolymerization
11/21/2001	EP0920676B1 Method for manufacturing an electric and mechanical connexion of a chip card module placed in a recess of a card body
11/21/2001	EP0660805B1 Method of cleaning waste water and recovery of contaminants therefrom
11/21/2001	CN2461241Y Stacked structure of integrated circuit device
11/21/2001	CN2461240Y Stacked structure of integrated circuit
11/21/2001	CN2461239Y Stacking device of integrated circuit
11/21/2001	CN2461238Y Stacked integrated circuit device
11/21/2001	CN2460256Y Multi-station precision thermal compression welder
11/21/2001	CN2460253Y Light modulator for automatic recognition system of press welder
11/21/2001	CN1323508A Heating device and heating method
11/21/2001	CN1323507A Component for multilayer printed circuit board, method of production thereof and associated multilayer printed circuit board

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