| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 12/04/2001 | US6326239 Mounting structure of electronic parts and mounting method of electronic parts |
| 12/04/2001 | US6326125 Photosensitive composition and calcined pattern obtained by use thereof |
| 12/04/2001 | US6326058 Device for patterning a substrate with patterning cavities |
| 12/04/2001 | US6325910 Palladium colloid solution and its utilization |
| 12/04/2001 | US6325903 Parallel action holding clamp for electroplating articles |
| 12/04/2001 | US6325853 Apparatus for applying a liquid coating with an improved spray nozzle |
| 12/04/2001 | US6325644 High density connector and method of manufacture |
| 12/04/2001 | US6325639 I/O connector for a portable communications device |
| 12/04/2001 | US6325638 Electrical assembly for coupling two circuit members |
| 12/04/2001 | US6325576 High throughput hole forming system with multiple spindles per station |
| 12/04/2001 | US6325552 Solderless optical transceiver interconnect |
| 12/04/2001 | US6325280 Solder ball terminal |
| 12/04/2001 | US6325279 Solder alloy of electrode for joining electronic parts and soldering method |
| 12/04/2001 | US6325272 Apparatus and method for filling a ball grid array |
| 12/04/2001 | US6325271 Continuous mode solder jet apparatus |
| 12/04/2001 | US6325270 Solder removing apparatus |
| 12/04/2001 | US6324973 Method and apparatus for dispensing material in a printer |
| 12/04/2001 | US6324756 Method and system for sealing the edge of a PBGA package |
| 12/04/2001 | US6324755 Solid interface module |
| 12/04/2001 | US6324754 Method for fabricating microelectronic assemblies |
| 12/04/2001 | CA2038723C Spray gun with five axis movement |
| 11/29/2001 | WO2001091525A2 High-speed fabrication of highly uniform ultra-small metallic microspheres |
| 11/29/2001 | WO2001091524A2 High-speed fabrication of highly uniform metallic microspheres__ |
| 11/29/2001 | WO2001091508A2 Telecommunications wiring device |
| 11/29/2001 | WO2001091241A1 Apparatus and method for configuring and inserting component leads into printed-circuit boards |
| 11/29/2001 | WO2001091184A2 Semiconductor component comprising a surface metallization |
| 11/29/2001 | WO2001091183A1 Solder bar for high power flip chips |
| 11/29/2001 | WO2001091182A1 Environmentally-sealed electronic assembly and method of making same |
| 11/29/2001 | WO2001091176A2 Trilayer/bilayer solder bumps and fabrication methods therefor |
| 11/29/2001 | WO2001091053A1 Method for examining a pre-determined area of a printed circuit board and device for carrying out said method |
| 11/29/2001 | WO2001090981A1 Information providing system, information providing method, information providing device, and recording medium |
| 11/29/2001 | WO2001090446A2 Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio |
| 11/29/2001 | WO2001090442A1 Cathode for electrochemical regeneration of permanganate etching solutions |
| 11/29/2001 | WO2001090212A1 Functionalised $g(p)-conjugated polymers, based on 3,4-alkylenedioxythiophene |
| 11/29/2001 | WO2001089757A1 Variable melting point solders and brazes |
| 11/29/2001 | WO2001089756A1 Laser drilling method |
| 11/29/2001 | WO2001034881A3 Device for electrolytically treating board-shaped workpieces, especially printed circuits |
| 11/29/2001 | US20010047044 Water-base ink, method of manufacturing the ink, and method of printing using the ink |
| 11/29/2001 | US20010046832 Apparatus and methods for substantial planarization of solder bumps |
| 11/29/2001 | US20010046796 Substrate having pins |
| 11/29/2001 | US20010046597 Materials handling; alternating layers exothermically react by self-propagating reduction/oxidation/formation reaction; ductility |
| 11/29/2001 | US20010046586 Stencil and method for depositing solder |
| 11/29/2001 | US20010046562 Applied to flexible printed circuits; high speed production/curing rates; electronics; automobile parts |
| 11/29/2001 | US20010046458 Controlling heating of copper foil with zinc and copper forming brass |
| 11/29/2001 | US20010046129 Interposer for connecting two substrates and resulting assembly |
| 11/29/2001 | US20010046126 Flip-chip RF-ID tag |
| 11/29/2001 | US20010046120 Chip scale packaging on cte matched printed wiring boards |
| 11/29/2001 | US20010046022 Tape carrier package with separated bonding parts, liquid crystal display employing the same and method of compensating misalignment thereof |
| 11/29/2001 | US20010046021 A conductive particle to conductively bond conductive members to each other, an anisotropic adhesive containing the conductive particle, a liquid crystal display device using the anisotropic conductive adhesive, a method for manufacturing the liquid crystal display device |
| 11/29/2001 | US20010045915 Antenna device |
| 11/29/2001 | US20010045874 System board and impedance control method thereof |
| 11/29/2001 | US20010045777 Power distributor for vehicle |
| 11/29/2001 | US20010045686 Method for encasing plastic array packages |
| 11/29/2001 | US20010045668 Plug structure |
| 11/29/2001 | US20010045633 Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer |
| 11/29/2001 | US20010045611 Via plug adapter |
| 11/29/2001 | US20010045524 Process for precise arrangement of micro-bodies |
| 11/29/2001 | US20010045445 Method for producing a reliable solder joint interconnection |
| 11/29/2001 | US20010045444 Method and apparatus for soldering and soldering land of a printed circuit board |
| 11/29/2001 | US20010045419 Laser system and method for single pass micromachining of multilayer workpieces |
| 11/29/2001 | US20010045407 Circuit board and a method for making the same |
| 11/29/2001 | US20010045362 Fabrication of metallic microstructures via exposure of photosensitive composition |
| 11/29/2001 | US20010045361 Seeding; solvent selective removal |
| 11/29/2001 | US20010045244 Soldering flux for circuit board and circuit board |
| 11/29/2001 | US20010045011 Method of positioning a conductive element in a laminated electrical device |
| 11/29/2001 | US20010045009 Solder-bearing contacts and method of manufacture thereof and use in a solder ball grid array connector |
| 11/29/2001 | US20010045007 System and method for mounting integrated circuits onto printed circuit boards, and testing method |
| 11/29/2001 | US20010044999 Method for sealing and/or joining an end of a ceramic filter |
| 11/29/2001 | DE10121897A1 Systemplatine und Impedanzsteuerverfahren hierfür System board and impedance control method therefor |
| 11/29/2001 | DE10025551A1 Kathode für die elektrochemische Regenerierung von Permanganat-Ätzlösungen, Verfahren zu deren Herstellung sowie elektrochemische Regeneriervorrichtung Cathode for the electrochemical regeneration of permanganate etching solutions, processes for their preparation and electrochemical regenerating device |
| 11/29/2001 | DE10025309A1 Funktionalisierte PI-konjugierte Copolymere auf 3,4-Alkylendioxythiophen-Basis Functionalized PI-conjugated copolymers of 3,4-alkylenedioxythiophene base |
| 11/29/2001 | DE10023220A1 Connection arrangement e.g. for electronic component on PCB, has bearer with recess is at least partly formed near electrical connection contact and at least partly filled with electrically conductive adhesive |
| 11/29/2001 | DE10007642A1 Separating substrate with defined preferred break points involves applying separating blade to preferred break points with substrate held on rubber mat by suction |
| 11/29/2001 | CA2410636A1 Variable melting point solders and brazes |
| 11/29/2001 | CA2404378A1 Cathode for electrochemical regeneration of permanganate etching solutions |
| 11/28/2001 | EP1158844A2 Laminated ceramic electronic component, production method therefor, and electronic device |
| 11/28/2001 | EP1158843A1 Process for improving adhesion of polymeric materials to metal surfaces. |
| 11/28/2001 | EP1158643A2 Power distributor for vehicle |
| 11/28/2001 | EP1158615A2 Connector for a circuit board |
| 11/28/2001 | EP1158573A1 Method and apparatus for forming interconnection |
| 11/28/2001 | EP1158570A1 Vertical interconnect process for silicon segments |
| 11/28/2001 | EP1158294A1 A method and apparatus for inspecting printed wiring boards |
| 11/28/2001 | EP1157892A1 Wire harness joint |
| 11/28/2001 | EP1157853A2 Process for roughening support material for printing plates |
| 11/28/2001 | EP1157821A1 Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same |
| 11/28/2001 | EP1157459A1 Filter structures for integrated circuit interfaces |
| 11/28/2001 | EP1156928A1 Method of manufacturing printing plate, and printing plate |
| 11/28/2001 | EP1156886A1 Apparatus and method for applying flux to a substrate |
| 11/28/2001 | EP0981722B1 Measuring system |
| 11/28/2001 | EP0978225B1 Apparatus for the coating of flat-form substrates, especially of printed circuit boards |
| 11/28/2001 | EP0968631B1 Method for forming metal conductor models on electrically insulating supports |
| 11/28/2001 | EP0932880B1 Chip card with a contact zone and method of producing such a chip card |
| 11/28/2001 | EP0927502B1 Modularized hearing aid circuit structure |
| 11/28/2001 | EP0848656A4 Multi-spindle cnc lathe |
| 11/28/2001 | CN2462639Y Full automatic bever edge machine for output terminal of circuit board |
| 11/28/2001 | CN2461678Y Appts. for returning material of circuit board punch |
| 11/28/2001 | CN1324558A Electrical component and electrical circuit module having connected ground planes |
| 11/28/2001 | CN1324208A Combination circuit plate and its mfg. method |
| 11/28/2001 | CN1324109A Improved integrated circuit structure |
| 11/28/2001 | CN1324084A Stack-up type electronic component mfg. method, mfg. apparatus master mask stacking-up machine and back panel |