| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/06/2001 | WO2001093280A1 Halogen-free film composite, method for producing the same and its use |
| 12/06/2001 | WO2001092958A1 Photosensitive resin composition, photosensitive element, production method for resist pattern and production method for printed circuit board |
| 12/06/2001 | WO2001092596A2 Method for producing three-dimensional, selectively metallized parts and a three-dimensional, selectively metallized part |
| 12/06/2001 | WO2001092380A1 Flexible, insulating and heat-stable composite materials |
| 12/06/2001 | WO2001091919A1 Doctor system for coating a printable material onto a surface |
| 12/06/2001 | WO2001063996A3 Electronic printed-circuit board for electronic devices, especially communications terminals |
| 12/06/2001 | WO2001036199A3 Printing device for simultaneously imprinting both sides of arc-shaped rigid or flexible substrates or substrate webs |
| 12/06/2001 | WO2001029878A3 Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes |
| 12/06/2001 | WO2001020619A3 Electrical devices and process for making such devices |
| 12/06/2001 | WO2001004641A3 Wafer level burn-in and electrical test system and method |
| 12/06/2001 | US20010049229 Printed circuit board connector |
| 12/06/2001 | US20010049211 Electrical junction box |
| 12/06/2001 | US20010049207 Electrical connector |
| 12/06/2001 | US20010049027 Copper foil overcoated with nickel, cobalt and molybdenum alloy; tape automatic bonding |
| 12/06/2001 | US20010049009 Halogen-free, flame-retardant insulating epoxy resin composition and circuit board comprising insulation layer formed thereof |
| 12/06/2001 | US20010048999 Reinforced flexible substrates and method therefor |
| 12/06/2001 | US20010048979 Electroless plating a substrate using argon laser beams |
| 12/06/2001 | US20010048701 Laser processing apparatus |
| 12/06/2001 | US20010048592 Printed circuit board and electronic equipment using the board |
| 12/06/2001 | US20010048591 Microelectronics component with rigid interposer |
| 12/06/2001 | US20010048581 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning |
| 12/06/2001 | US20010048573 Magnetic head device and method of manufacturing same |
| 12/06/2001 | US20010048550 Apparatus for observing interior from an ultramicropore space |
| 12/06/2001 | US20010048492 Liquid crystal display device and a method thereof |
| 12/06/2001 | US20010048287 Compact fast battery charger |
| 12/06/2001 | US20010048164 High-frequency signal amplification device and method for manufacturing the same |
| 12/06/2001 | US20010048160 Semiconductor device having reinforced coupling between solder balls and substrate |
| 12/06/2001 | US20010048158 Solder balls and columns with stratified underfills on substrate for flip chip joining |
| 12/06/2001 | US20010048153 Method and apparatus for testing bumped die |
| 12/06/2001 | US20010048150 Compact, surface-mounting-type, electronic-circuit unit |
| 12/06/2001 | US20010048017 Continuous mode solder jet apparatus |
| 12/06/2001 | US20010048014 Method of producing a semiconductor device |
| 12/06/2001 | US20010047985 Device and method for making copper-clad laminates |
| 12/06/2001 | US20010047943 Soluble copper salt, electrolyte, one or more brightener compounds that are present in a concentration of at least about 1.5 mg per liter of electroplating composition; increased brightener levels |
| 12/06/2001 | US20010047882 Multi-chip land grid array carrier |
| 12/06/2001 | US20010047881 Printed-wiring substrate and method for fabricating the printed-wiring substrate |
| 12/06/2001 | US20010047880 Double sided flexible circuit for integrated circuit packages and method of manufacture |
| 12/06/2001 | US20010047587 Circuit board manufacturing method, components mounting method and circuit board manufacturing device |
| 12/06/2001 | DE19942054A1 Printing agent comprises a two component toner made of charge controlling particles and support materials |
| 12/06/2001 | DE19907276C2 Verfahren zur Herstellung einer Lötverbindung zwischen einem elektrischen Bauelement und einem Trägersubstrat A process for producing a solder connection between an electrical component and a carrier substrate |
| 12/06/2001 | DE10121296A1 Mobiltelefon Mobile phone |
| 12/06/2001 | DE10027732A1 Multiple use circuit board provided on both sides with rupture lines using displacement of circuit board relative to opposing laser beam elements |
| 12/06/2001 | DE10027236A1 Verfahren und Testflüssigkeit zum Nachweisen von sauren Flußmittelrückständen an elektronischen Baugruppen Procedures and test liquid for detecting acidic flux residues with electronic modules |
| 12/06/2001 | DE10026499A1 Vorrichtung und Verfahren zur Beschriftung von kupferkaschierten Laminaten Apparatus and method for labeling copper-clad laminates |
| 12/06/2001 | DE10025774A1 Halbleiterbauelement mit Oberflächenmetallisierung Semiconductor component with surface metallization |
| 12/06/2001 | DE10025751A1 Verfahren zum Untersuchen einer leiterplatte an einem vorbestimmten Bereich der Leiterplatte und Vorrichtung zum Durchführen des Verfahrens A method of inspecting a circuit board in a predetermined area of the printed circuit board and device for carrying out the method |
| 12/06/2001 | DE10024439A1 Verguss- oder Einbettmasse mit elektromagnetischen Abschirmeigenschaften zur Herstellung elektronischer Bauteile Casting or embedding compound having electromagnetic shielding for the production of electronic components |
| 12/05/2001 | EP1161126A2 Laser processing method and equipment for printed circuit board |
| 12/05/2001 | EP1161125A2 Electronic circuit unit that is suitable for miniaturization and suitable for simple output adjustment |
| 12/05/2001 | EP1161124A2 Surface-mounting type electronic circuit unit suitable for miniaturization |
| 12/05/2001 | EP1161123A2 Process to manufacture tight tolerance embedded elements for printed circuit boards |
| 12/05/2001 | EP1160937A1 Electrical solderable connection element with solder deposition |
| 12/05/2001 | EP1160923A2 Header for electronic components board in surface mount and through-hole assembly |
| 12/05/2001 | EP1160922A2 Printed board connector |
| 12/05/2001 | EP1160869A2 SMD with passive components formed by thin film technology |
| 12/05/2001 | EP1160868A2 Electronic circuit unit suitable for miniaturization |
| 12/05/2001 | EP1160867A2 Electronic circuit unit that is suitable for miniaturization and excellent in high frequency charateristic |
| 12/05/2001 | EP1160861A2 Thermally conductive substrate with leadframe and heat radiation plate and manufacturing method thereof |
| 12/05/2001 | EP1160859A2 Surface-mounting type electronic circuit unit suitable for miniaturization and easy to manufacture |
| 12/05/2001 | EP1160853A2 Method of producing a semiconductor device |
| 12/05/2001 | EP1160696A2 System for checking wiring configuration of printed circuit board |
| 12/05/2001 | EP1160568A1 Method and composition for detecting acid residues on electronic components |
| 12/05/2001 | EP1160077A2 Low loss material for the manufacture of PCB'S and antenna boards and a method for producing same |
| 12/05/2001 | EP1160075A2 Halogen-free composite film, process for its manufacture and its use |
| 12/05/2001 | EP1160045A2 Apparatus and method for marking copper clad laminates |
| 12/05/2001 | EP1159725A2 Display and backlighting assembly |
| 12/05/2001 | EP1159467A1 Process for the recovery of tin, tin alloys or lead alloys from printed circuit boards |
| 12/05/2001 | EP1080244B1 Anti-adherent coating and method for the production thereof |
| 12/05/2001 | EP1055355B1 Process for the preliminary treatment of copper surfaces |
| 12/05/2001 | EP1021593B1 Method and solution for producing gold coatings |
| 12/05/2001 | EP0914757B1 Z-axis interconnect method and circuit |
| 12/05/2001 | EP0913076B1 Method for making printed circuits and resulting printed circuit |
| 12/05/2001 | EP0870418B1 Electronic assembly with semi-crystalline copolymer adhesive |
| 12/05/2001 | EP0776262B1 Rosin-free, low voc, no-clean soldering flux and method using the same |
| 12/05/2001 | EP0771181B1 Sheets with high temperature stable protective coating |
| 12/05/2001 | CN2464040Y Fixing clamp for circuit board |
| 12/05/2001 | CN2463103Y Tin ball welded jointing device |
| 12/05/2001 | CN1325332A Solder paste with time/temp. indicator |
| 12/05/2001 | CN1325262A Printed circuit board and its mfg. method |
| 12/05/2001 | CN1325160A Receptacle seat of cathode-ray tube and monitor containing same |
| 12/05/2001 | CN1324959A Supplement method for bath |
| 12/05/2001 | CN1324904A Isolator or filler having electromagnetic shielding characteristic for producing electronic device |
| 12/05/2001 | CN1324722A Screen-board printing device |
| 12/04/2001 | US6327146 Pick and place assembly and reflow soldering for high power active devices with a flange |
| 12/04/2001 | US6326698 Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices |
| 12/04/2001 | US6326694 Printed circuit board |
| 12/04/2001 | US6326683 Carrier element for a semiconductor chip |
| 12/04/2001 | US6326681 Semiconductor device |
| 12/04/2001 | US6326647 Packaging and mounting of spherical semiconductor devices |
| 12/04/2001 | US6326561 Thin-film multilayer wiring board with wiring and via holes in a thickness of an insulating layer |
| 12/04/2001 | US6326560 Adapter for a ball grid array device |
| 12/04/2001 | US6326559 Multilayer printed wiring board and method for manufacturing same |
| 12/04/2001 | US6326558 Part holder and electronic equipment using same |
| 12/04/2001 | US6326557 Multi-layer circuit board |
| 12/04/2001 | US6326556 Multilayered printed wiring board |
| 12/04/2001 | US6326555 Method and structure of z-connected laminated substrate for high density electronic packaging |
| 12/04/2001 | US6326554 Surface mount flexible interconnect and component carrier |
| 12/04/2001 | US6326553 Scheme to avoid electrostatic discharge damage to MR/GMR head gimbal/stack assembly in hard disk applications |
| 12/04/2001 | US6326544 Polymer based circuit |
| 12/04/2001 | US6326242 Semiconductor package with heat sink and method of fabrication |