| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/13/2001 | US20010051395 Tape stiffener, semiconductor device assemblies including same, and stereolithographic methods for fabricating same |
| 12/13/2001 | US20010051392 Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices |
| 12/13/2001 | US20010051391 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
| 12/13/2001 | US20010051385 Method of manufacturing semiconductor device |
| 12/13/2001 | US20010051282 Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same |
| 12/13/2001 | US20010051276 Using zinc (meth)acrylate as adhesion promoter |
| 12/13/2001 | US20010051223 Polymer-coated metal composites by dip autopolymerization |
| 12/13/2001 | US20010051210 Minimizing formation of cracks at junctions between vias and lines in line-to-via connections on a substrate; each line has a base section and a cap, each cap is positioned over a via in the substrate, cap's diameter is greater than via's |
| 12/13/2001 | US20010051029 Three-dimensional mounted assembly, method of manufacturing the same, and optical transmission device |
| 12/13/2001 | US20010050931 Laser processing apparatus and method |
| 12/13/2001 | US20010050846 Reel-deployed printed circuit board and method for manufacturing chip-on-board packages |
| 12/13/2001 | US20010050647 Antenna device and its assembly method and wireless communication terminal and their assembly method |
| 12/13/2001 | US20010050600 Isolating energy conditioning shield assembly |
| 12/13/2001 | US20010050574 Interconnect for testing semiconductor dice having raised bond pads |
| 12/13/2001 | US20010050570 Method of forming an apparatus configured to engage an electrically conductive pad on a semiconductive substrate and a method of engaging electrically conductive pads on a semiconductive substrate |
| 12/13/2001 | US20010050568 Flexible conductive structures and method |
| 12/13/2001 | US20010050566 Printed circuit board for use in the testing of electrical components and method for producing it |
| 12/13/2001 | US20010050434 Flexible printed wiring boards |
| 12/13/2001 | US20010050426 LSI package and internal connecting method used therefor |
| 12/13/2001 | US20010050357 Ultraviolet curable silver composition and related method |
| 12/13/2001 | US20010050231 Aqueous electrolytic medium |
| 12/13/2001 | US20010050184 Connecting structure of flat circuit member |
| 12/13/2001 | US20010050183 Fine pitch circuitization with filled plated through holes |
| 12/13/2001 | US20010050181 Semiconductor module and circuit substrate |
| 12/13/2001 | US20010050180 Method for preparing side attach pad traces through buried conductive material |
| 12/13/2001 | US20010050179 Single bath electrodeposition |
| 12/13/2001 | US20010050138 Thin electronic circuit component and method and apparatus for producing the same |
| 12/13/2001 | US20010050100 Semiconductors |
| 12/13/2001 | DE10125323A1 Electronic component, such as ceramic capacitor, has outer electrode layer containing polycrystalline tin and tin crystal grains with boundaries and atoms of another metal than tin at tin crystal grain boundaries |
| 12/13/2001 | DE10055147A1 Verfahren zur Verbesserung der Druckqualität beim Einsatz von Druckschablonen A method for improving print quality with the use of stencils |
| 12/13/2001 | DE10027961A1 Device for electrically conducting connection of connector pins, has heated, pot-shaped vessel that can be filled with liquid solder until protruding top formed, aligned, and moved axially |
| 12/13/2001 | DE10026756A1 Electric circuit e.g. for car indicator, comprises air volume enclosed between cover and circuit board |
| 12/13/2001 | DE10026714A1 Verbundfolie, Verfahren zu ihrer Herstellung und ihre Verwendung Composite film, process for their preparation and their use |
| 12/13/2001 | DE10025449A1 Fastening strip e.g. for SMD LEDs, has electrical junction in interlocking position between contact elements of SMD components and respective fastening component |
| 12/13/2001 | CA2407280A1 Process for improving the adhesion of polymeric materials to metal surfaces |
| 12/12/2001 | EP1162867A1 Multilayer printed wiring board and method of producing multilayer printed wiring board |
| 12/12/2001 | EP1162866A2 Laminate |
| 12/12/2001 | EP1162706A2 Q-switched frequency converted laser |
| 12/12/2001 | EP1162694A2 Apparatus for connecting electrical wires |
| 12/12/2001 | EP1162656A2 Filling holes and the like in substrates |
| 12/12/2001 | EP1162569A2 Method of producing a data carrier |
| 12/12/2001 | EP1162509A2 A system, method and article of manufacture for improved laser direct imaging a printed circuit board utilizing a mode locked laser and scophony operation |
| 12/12/2001 | EP1162239A2 Thermally conductive silicone rubber composition |
| 12/12/2001 | EP1162238A2 Compositions containing polythiophene and solvent |
| 12/12/2001 | EP1162025A2 Laser processing apparatus |
| 12/12/2001 | EP1161469A1 Thermally reactive near infrared absorption polymer coatings, method of preparing and methods of use |
| 12/12/2001 | EP0970594B1 Moulded sockets for electronic component attachment |
| 12/12/2001 | EP0953277B1 Optimized solder joints for surface mount chips |
| 12/12/2001 | CN2464495Y Feeder of fusion bonding machine for laminated substrate |
| 12/12/2001 | CN1326313A Multi-layer printed circuit board and manufacture thereof |
| 12/12/2001 | CN1326312A Printed circuit board and electronic device therewith |
| 12/12/2001 | CN1326263A 电子电路组件 Electronic circuit assembly |
| 12/12/2001 | CN1326242A Integrated film antenna and its preparing process |
| 12/12/2001 | CN1326227A Metal inter-connector and active matrix bottom therewith |
| 12/12/2001 | CN1326226A Electrode structure on carrier bottom of semiconductor device |
| 12/12/2001 | CN1326220A Connecting construction body |
| 12/12/2001 | CN1326016A Local electroplating system |
| 12/12/2001 | CN1325790A Copper film for TAB band carrier and TAB carried band and TAB band carrier |
| 12/12/2001 | CN1325784A Boring device |
| 12/12/2001 | CN1325780A Device and method for priting marks on copper coated laminating boards |
| 12/12/2001 | CN1076154C Copper foil and high-density multi-layered printed circuit board using the copper foil for inner layer circuit |
| 12/12/2001 | CN1076148C 双超外差调谐器 Double superheterodyne tuner |
| 12/11/2001 | US6330705 Method and system for remodeling, designing, and editing a printed wiring board using a computer aided design system |
| 12/11/2001 | US6330166 Electronic-component mounting structure |
| 12/11/2001 | US6330165 Semiconductor device |
| 12/11/2001 | US6330164 Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device |
| 12/11/2001 | US6330159 Vertical surface mount apparatus with thermal carrier |
| 12/11/2001 | US6330132 Magnetic head with high bonding strength of member for bonding head element and conductive pattern connected to external circuit |
| 12/11/2001 | US6329899 Formation of thin film resistors |
| 12/11/2001 | US6329829 Interconnect and system for making temporary electrical connections to semiconductor components |
| 12/11/2001 | US6329827 High density cantilevered probe for electronic devices |
| 12/11/2001 | US6329721 Pb-In-Sn tall C-4 for fatigue enhancement |
| 12/11/2001 | US6329711 Semiconductor device and mounting structure |
| 12/11/2001 | US6329702 High frequency carrier |
| 12/11/2001 | US6329637 Method and process of contract to a heat softened solder ball array |
| 12/11/2001 | US6329631 Solder strip exclusively for semiconductor packaging |
| 12/11/2001 | US6329610 Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring board |
| 12/11/2001 | US6329609 Method and structure to prevent distortion and expansion of organic spacer layer for thin film transfer-join technology |
| 12/11/2001 | US6329605 Components with conductive solder mask layers |
| 12/11/2001 | US6329604 Multilayer printed circuit board |
| 12/11/2001 | US6329603 Low CTE power and ground planes |
| 12/11/2001 | US6329300 Method for manufacturing conductive pattern layer by two-step wet etching process |
| 12/11/2001 | US6329289 Method and apparatus for forming copper wiring |
| 12/11/2001 | US6329220 Packages for semiconductor die |
| 12/11/2001 | US6329077 Plate-shaped compression mold, process for producing the same and process for making laminate therewith |
| 12/11/2001 | US6329074 Alloy layer comprising copper, zinc, tin and nickel, chromate layer |
| 12/11/2001 | US6329050 Adhesive for electronic parts and adhesive tape for electronic parts |
| 12/11/2001 | US6329045 Substrates with inorganic powders |
| 12/11/2001 | US6328844 Heat-active adhesive for a connecting circuit which is used for electrically connecting circuit electrodes facing each other in pressing direction |
| 12/11/2001 | US6328598 Printed circuit board supporting different types of chassis connector panels |
| 12/11/2001 | US6328575 Method and device for connecting an EL lamp to a printed circuit board |
| 12/11/2001 | US6328572 Motherboard with board having terminating resistance |
| 12/11/2001 | US6328427 Method of producing a wiring substrate |
| 12/11/2001 | US6328201 Multilayer wiring substrate and method for producing the same |
| 12/11/2001 | US6328200 Process for selective soldering |
| 12/06/2001 | WO2001093649A1 System for welding a package of layers and sheets of pre-preg, in a hot press, to form an electronic multi-layer printed circuit |
| 12/06/2001 | WO2001093648A2 Filling device |
| 12/06/2001 | WO2001093647A2 Filling method |
| 12/06/2001 | WO2001093324A2 Substrate adapted to accommodate a circuit configuration and method for producing the same |
| 12/06/2001 | WO2001093296A1 Multilayer electrode structure and method for forming |