| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/20/2001 | US20010053562 Process for producing a substrate and plating apparatus |
| 12/20/2001 | US20010053488 Automated, flow-through, dual side, laser direct imaging process and apparatus which provides capability to simultaneously register and image both sides of substrate in continuous flow-through process |
| 12/20/2001 | US20010053487 Automated, flow-through, dual side, laser direct imaging process and apparatus which provides capability to simultaneously register and image both sides of substrate in continuous flow-through process |
| 12/20/2001 | US20010053420 Such as solder flux onto a printed circuit board, where pressurized air from an orifice impinges on the drop of solder to flatten it and increase contact area with the substrate |
| 12/20/2001 | US20010053415 Stencil comprising a pattern and, a coating applied to a surface to retard spreading of printable material on the surface; adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip packaging |
| 12/20/2001 | US20010053187 Symbol-based signaling device for an elctromagnetically-coupled bus system |
| 12/20/2001 | US20010053068 Electronic circuit device |
| 12/20/2001 | US20010053063 Surface mounted conduction heat sink |
| 12/20/2001 | US20010053040 Index signal output device and floppy disk drive |
| 12/20/2001 | US20010052958 Electrode structure of display panel and electrode forming method |
| 12/20/2001 | US20010052659 Method and apparatus for laser drilling |
| 12/20/2001 | US20010052643 Semiconductor device and method for manufacturing same |
| 12/20/2001 | US20010052637 Memory modules including capacity for additional memory |
| 12/20/2001 | US20010052536 Method and apparatus for making an electrical device |
| 12/20/2001 | US20010052510 Contain a proton source, e.g., a mineral acid, an oxidizer agent, e.g., hydrogen peroxide, an azole compound, and a molybdenum source. |
| 12/20/2001 | US20010052467 Making thermally stable electromagnetic coil vanes, by photolithographically exposing high resolution, dense wire patterns in copper on both sides of ceramic substrate, plating additional copper and firing to eutectically bond |
| 12/20/2001 | US20010052465 Electrolyte cell configured to receive a substrate to have a metal film deposited thereon; a porous, rigid diffuser positioned between where the substrate is to be and the anode; uniform coating; pressure removes bubbles |
| 12/20/2001 | US20010052425 Printed circuit board and method of manufacturing the same |
| 12/20/2001 | US20010052424 Lead wire-processing structure |
| 12/20/2001 | US20010052423 Circuit board and a method for making the same |
| 12/20/2001 | US20010052422 Structure for supporting connecting member |
| 12/20/2001 | US20010052317 A board coating system |
| 12/20/2001 | US20010052278 Integrated circuit package separators |
| 12/20/2001 | US20010052183 Printed-wiring substrate and method for fabricating the same |
| 12/20/2001 | DE10120868A1 Connecting structure used in the production of a semiconductor chip support comprises a support material, a metallic through-hole arranged in the carrier material, a re-distributing layer, and a through-contact |
| 12/20/2001 | DE10120117A1 Rakelsystem zum Aufbringen eines druckbaren Materials auf eine Oberfläche A doctor blade system for applying material to a surface of a printable |
| 12/20/2001 | DE10051140A1 Method of forming cylindrical elevations on surface of substrate for integrated circuits, involves filling openings formed in screening material with pure copper or with high-melting point metal by galvanizing |
| 12/20/2001 | DE10046489C1 Lötbares elektrisches Anschlußelement mit Lotdepot und dessen Verwendung Solderable electrical connection element with solder deposit and its use |
| 12/20/2001 | DE10029094A1 SMD-cooler esp. for thermal LSI-circuits, has metal layers and sacrificial layer arranged alternatively over one another |
| 12/20/2001 | DE10028790A1 Laser lithographic manufacture of circuit board by direct marking by exposing photoresist at different wavelength than that used to expose latent mask |
| 12/20/2001 | DE10028561A1 Elastic pressure member for maintaining electrical connection e.g. in computer keyboard connector, has limbs extending from center |
| 12/20/2001 | DE10026270C1 Verfahren zum Laminieren einer Leiterplatte auf eine Grundplatte und Laminiervorrichtung A method for laminating a circuit board on a base plate and laminating |
| 12/20/2001 | DE10025279A1 Determining network conductor position while minimizing crosstalk radiation involves signal classification for conductor in noise inducing network according to relevance to radiation |
| 12/19/2001 | EP1164823A2 Printed circuit board and method of manufacturing the same |
| 12/19/2001 | EP1164661A2 Connecting structure of flat circuit member |
| 12/19/2001 | EP1164621A2 Electrode structure of display panel and electrode forming method |
| 12/19/2001 | EP1164113A1 Method of laser machining glass substrate and method of fabricating high-frequency circuit |
| 12/19/2001 | EP1164052A2 Connection structure for connecting an electrical part to a printed circuit board |
| 12/19/2001 | EP1163971A1 Electronic device and semiconductor device |
| 12/19/2001 | EP1163827A1 Method for producing solderable and functional surfaces on circuit carriers |
| 12/19/2001 | EP1163826A1 Circuit board printer |
| 12/19/2001 | EP1163825A1 Method for producing circuit arrangements |
| 12/19/2001 | EP1163552A1 Method of forming a masking pattern on a surface |
| 12/19/2001 | EP1163322A1 Method and cleaning fluid for the wet cleaning of objects |
| 12/19/2001 | EP1163080A1 Filling device and method for filling balls in the apertures of a ball-receiving element |
| 12/19/2001 | EP1049819B1 Device for electroplating on translating metal sheets, especially for printed circuits, by closure of an electric circuit between the sheets and a liquid reactant product |
| 12/19/2001 | EP0935526A4 Metal ceramic composites with improved interfacial properties |
| 12/19/2001 | EP0808508B1 Methods of mechanical and electrical substrate connection |
| 12/19/2001 | EP0766909B1 Vertical interconnect process for silicon segments |
| 12/19/2001 | CN1327710A Multilayer printed wiring board and method of producing multilayer printed wiring board |
| 12/19/2001 | CN1327570A Electrooptic device, method for manufacturing electrooptic device, and electronic apparatus |
| 12/19/2001 | CN1327489A Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil |
| 12/19/2001 | CN1327399A Roll coater for coating and method of manufacturing printed wiring board empolying the roll coater |
| 12/19/2001 | CN1327361A Copper coated polymer element with improved adhesive property |
| 12/19/2001 | CN1327234A Address changing signal input device and soft disc driver |
| 12/19/2001 | CN1326853A Laminated board |
| 12/19/2001 | CN1326837A Laser preocessing method and processing device |
| 12/19/2001 | CN1076576C Integrated circuit chip aligement/feed apparatus |
| 12/19/2001 | CN1076287C Thermal print head |
| 12/19/2001 | CN1076272C Multi-layer structure containing adhesion promoting layer |
| 12/19/2001 | CN1076240C Gas injection apparatus and process to form a controlled atmosphere in a confined space |
| 12/18/2001 | US6331926 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 12/18/2001 | US6331883 Flat panel display device and manufacturing method thereof |
| 12/18/2001 | US6331811 Thin-film resistor, wiring substrate, and method for manufacturing the same |
| 12/18/2001 | US6331681 Electrical connection device for forming and semiconductor device having metal bump electrical connection |
| 12/18/2001 | US6331680 Multilayer electrical interconnection device and method of making same |
| 12/18/2001 | US6331679 Multi-layer circuit board using anisotropic electro-conductive adhesive layer |
| 12/18/2001 | US6331678 Reduction of blistering and delamination of high-temperature devices with metal film |
| 12/18/2001 | US6331447 High density flip chip BGA |
| 12/18/2001 | US6331376 For use in the preparation of a printed circuit boards |
| 12/18/2001 | US6331348 Substrate having repaired metallic pattern and method and device for repairing metallic pattern on substrate |
| 12/18/2001 | US6331347 Method for forming a gold plating electrode a substrate based on the electrode forming method, and a wire bonding method utilizing this electrode forming method |
| 12/18/2001 | US6331201 Acidic mixture containing dissolved bismuth, halide ion, and a sulfur-containing ligand as a complexing agent. |
| 12/18/2001 | US6331119 Conductive adhesive having a palladium matrix interface between two metal surfaces |
| 12/18/2001 | US6331076 Solder paste with a time-temperature indicator |
| 12/18/2001 | US6330967 Process to produce a high temperature interconnection |
| 12/18/2001 | CA2210738C Upgradeable voltage regulator modules |
| 12/18/2001 | CA2209660C Electrical circuit suspension system |
| 12/13/2001 | WO2001095683A1 Method of manufacturing circuit laminates |
| 12/13/2001 | WO2001095682A1 Method and device for drying materials and method of producing circuit boards using the same |
| 12/13/2001 | WO2001095681A1 Method for producing ceramic substrate |
| 12/13/2001 | WO2001095680A1 Multiple use printed circuit board comprising grooves on both sides which are produced by means of laser beams, and device for the production thereof |
| 12/13/2001 | WO2001095678A1 Method for manufacturing printed-circuit board |
| 12/13/2001 | WO2001095499A1 Apparatus and method for reducing electromigration |
| 12/13/2001 | WO2001095425A1 Multi-layer microwave circuits and methods of manufacture |
| 12/13/2001 | WO2001095343A1 Conductive composition, method for manufacturing electrode or printed board comprising the same, method for connecting electrode comprising the same, and electrode or printed board using the same |
| 12/13/2001 | WO2001094273A1 Method for manufacturing aluminum nitride sintered body in which via hole is made |
| 12/13/2001 | WO2001094033A1 Process for improving the adhesion of polymeric materials to metal surfaces |
| 12/13/2001 | WO2001063001A3 Laser deposition process |
| 12/13/2001 | WO2001051243A3 Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulsewidths |
| 12/13/2001 | WO2001041212A3 Integrated circuit package |
| 12/13/2001 | WO2001035051A3 X-ray tomography bga (ball grid array) inspections |
| 12/13/2001 | US20010051840 Mounting apparatus and mounting method |
| 12/13/2001 | US20010051689 Polymeric films having controlled viscosity response to temperature and shear |
| 12/13/2001 | US20010051682 Treating the surface of a molded article of thermoplastic resin of given impact strength and hardness, and an inorganic filler with blast to roughen surface, then catalyst coating, activation treatment and electroless plating |
| 12/13/2001 | US20010051461 Connection system |
| 12/13/2001 | US20010051458 Metal component carrier |
| 12/13/2001 | US20010051451 Connector for a circuit board |
| 12/13/2001 | US20010051397 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
| 12/13/2001 | US20010051396 Method for fabricating electronic circuit device, semiconductor device and electronic circuit device |