| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/01/2002 | CA2203034C Process for depositing a protective coating on the components of an electronic card |
| 12/27/2001 | WO2001099480A2 Printed circuit board having inductive vias |
| 12/27/2001 | WO2001099479A2 Bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure, and associated electrical power distribution structures |
| 12/27/2001 | WO2001099237A1 Power supply terminal and backboard |
| 12/27/2001 | WO2001099224A1 Electronically tunable dielectric composite thick films |
| 12/27/2001 | WO2001099212A1 Cylindrical battery clip for key fobs |
| 12/27/2001 | WO2001099189A1 Method and apparatus for edge connection between elements of an integrated circuit |
| 12/27/2001 | WO2001099187A1 Panel stacking of bga devices to form three-dimensional modules |
| 12/27/2001 | WO2001099124A1 Laminate and use thereof |
| 12/27/2001 | WO2001098838A2 Method of forming optical images, mask for use in this method, method of manufacturing a device using this method, and apparatus for carrying out this method |
| 12/27/2001 | WO2001098829A1 A method for individualised marking of circuit boards |
| 12/27/2001 | WO2001098423A1 Polymeric materials to metal surfaces adhesion process |
| 12/27/2001 | WO2001098022A1 Rotary drilling and cutting tools for manufacturing printed circuit boards |
| 12/27/2001 | WO2001097911A1 Microcurrent therapy device |
| 12/27/2001 | WO2001035708A3 Method and apparatus for holding a printed circuit board in a precise position during processing |
| 12/27/2001 | US20010056292 Microcurrent therapy device components stack and conductive pad |
| 12/27/2001 | US20010056174 Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming |
| 12/27/2001 | US20010056147 Flame retardant adhesive composition and laminates |
| 12/27/2001 | US20010055904 Wire holding structure |
| 12/27/2001 | US20010055835 Flip chip interconnection structure |
| 12/27/2001 | US20010055676 Very ultra thin conductor layers for printed wiring boards |
| 12/27/2001 | US20010055605 Printed circuits; containing cockroach repellent |
| 12/27/2001 | US20010055203 Package substrate |
| 12/27/2001 | US20010055191 Multilayer capacitor |
| 12/27/2001 | US20010054950 Termination resistor in printed circuit board |
| 12/27/2001 | US20010054939 High-frequency multilayer circuit substrate |
| 12/27/2001 | US20010054938 Filter structures for integrated circuit interfaces |
| 12/27/2001 | US20010054907 High density cantilevered probe for electronic devices |
| 12/27/2001 | US20010054906 Probe card and a method of manufacturing the same |
| 12/27/2001 | US20010054905 Probe card assembly and kit |
| 12/27/2001 | US20010054771 Method for making projected contact structures for engaging bumped semiconductor devices |
| 12/27/2001 | US20010054770 Panel stacking of BGA devices to form three-dimensional modules |
| 12/27/2001 | US20010054758 Three-dimensional memory stacking using anisotropic epoxy interconnections |
| 12/27/2001 | US20010054757 Multi-layer wiring board substrate and semiconductor device using the multi-layer wiring substrate |
| 12/27/2001 | US20010054754 Surface-mounting type electronic circuit unit suitable for miniaturization and easy to manufacture |
| 12/27/2001 | US20010054753 Semiconductor package and mount board, and mounting method using the same |
| 12/27/2001 | US20010054750 Semiconductor leadframes plated with lead-free solder and minimum palladium |
| 12/27/2001 | US20010054641 Machine for wave soldering of tinning |
| 12/27/2001 | US20010054637 Laser soldering method and apparatus |
| 12/27/2001 | US20010054627 Method and apparatus for dispensing viscous material |
| 12/27/2001 | US20010054556 Metal plating apparatus and process |
| 12/27/2001 | US20010054513 Package substrate |
| 12/27/2001 | US20010054512 Printed circuit board configuration with a multipole plug-in connector |
| 12/27/2001 | US20010054511 High-insulated stud and printed circuit board therewith |
| 12/27/2001 | US20010054481 Method for making multilayer board having a cavity |
| 12/27/2001 | US20010054230 Method and device for bonding a wire conductor |
| 12/26/2001 | CN1328716A Controlling heat expansion of electrical couplings |
| 12/26/2001 | CN1328713A High density electrical connector |
| 12/26/2001 | CN1328709A Wideband RF port structure using coplanar waveguide and BGA I/O |
| 12/26/2001 | CN1328644A Probe card for probing wafers with raised contact elements |
| 12/26/2001 | CN1328413A Electronic ballast for discharging lamp |
| 12/26/2001 | CN1328342A Process for preparing diode with ceramic substrate and crystal grain structure |
| 12/26/2001 | CN1328268A Liquid crystal apparatus, its making method and electronic apparatus |
| 12/26/2001 | CN1327898A Laser processor |
| 12/26/2001 | CN1076872C Chip carrier and method of maufacturing and mounting the same |
| 12/26/2001 | CN1076638C Grafted thermoplastic elastomer barrier layer |
| 12/25/2001 | US6333856 Arrangement for mounting chips in multilayer printed circuit boards |
| 12/25/2001 | US6333837 Flexible circuit suspension |
| 12/25/2001 | US6333721 Identification element and method of manufacturing an identification element |
| 12/25/2001 | US6333633 Method for inspecting a flexible printed circuit |
| 12/25/2001 | US6333603 Organic light emission device display module |
| 12/25/2001 | US6333563 Electrical interconnection package and method thereof |
| 12/25/2001 | US6333561 Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate |
| 12/25/2001 | US6333554 Semiconductor device with gold bumps, and method and apparatus of producing the same |
| 12/25/2001 | US6333483 Method of manufacturing circuit modules |
| 12/25/2001 | US6333471 Sheet metal component for double pattern conduction and printed circuit board |
| 12/25/2001 | US6333470 Assembly for chip(s) with magnetic head(s) and method for making same |
| 12/25/2001 | US6333469 Wafer-scale package structure and circuit board attached thereto |
| 12/25/2001 | US6333468 Flexible multi-layered printed circuit cable |
| 12/25/2001 | US6333466 Flexible wiring board |
| 12/25/2001 | US6333253 Pattern-block flux deposition |
| 12/25/2001 | US6333210 Process of ensuring detect free placement by solder coating on package pads |
| 12/25/2001 | US6333136 Carrier film and process for producing the same |
| 12/25/2001 | US6333135 Comprising a photosensitive layer and a first film having a 5% elongation and a breaking elongation of 50-1000% where the photosensitive layer is in contact with the substrate; conforming to surface uneveness; resolution; photosensitivity |
| 12/25/2001 | US6333120 Plating copper underlayer which comprises layer of electroplated copper onto substrate; subjecting copper coated substrate to oxygen-containing gaseous ambient to roughen surface of copper; electroplating second layer of copper |
| 12/25/2001 | US6333104 For coupling of integrated circuit chips to electronic cards using interconnections comprising conductive polymers |
| 12/25/2001 | US6332786 Electrical connection device employing an anisotropic electrically conductive film |
| 12/25/2001 | US6332782 Spatial transformation interposer for electronic packaging |
| 12/25/2001 | US6332766 Apparatus for encasing array packages |
| 12/25/2001 | US6332569 Etched glass solder bump transfer for flip chip integrated circuit devices |
| 12/25/2001 | US6332269 Component alignment methods |
| 12/25/2001 | US6332267 Process of manufacturing a removably interlockable assembly |
| 12/20/2001 | WO2001097583A2 Molded electronic assembly |
| 12/20/2001 | WO2001097582A1 Adhesive film and method for manufacturing multilayer printed wiring board comprising the same |
| 12/20/2001 | WO2001097581A1 Connector arrangement made from electrical/electronic component supports |
| 12/20/2001 | WO2001097580A1 Electronic device and method of manufacturing the electronic device |
| 12/20/2001 | WO2001097579A1 Method of mounting electronic part |
| 12/20/2001 | WO2001097577A1 Printed circuit board |
| 12/20/2001 | WO2001097572A1 Electronic ballast for a discharge lamp |
| 12/20/2001 | WO2001097276A1 Microparticle arrangement film, electrical connection film, electrical connection structure, and microparticle arrangement method |
| 12/20/2001 | WO2001097235A1 Photolithographically-patterned out-of-plane coil structures |
| 12/20/2001 | WO2001096891A1 Device and method for inspecting circuit board |
| 12/20/2001 | WO2001096890A1 Device and method for inspection |
| 12/20/2001 | WO2001096781A1 Small portable flashlight |
| 12/20/2001 | WO2001096440A1 Epoxy resin composition and laminate using the same |
| 12/20/2001 | WO2001022489A3 Control device, particularly for use in automotive engineering |
| 12/20/2001 | US20010053657 Apparatus and methods fo substantial planarization of solder bumps |
| 12/20/2001 | US20010053620 Method and apparatus for interconnecting devices using an adhesive |
| 12/20/2001 | US20010053616 Method and an apparatus for manufacturing multilayer electronic part |
| 12/20/2001 | US20010053565 Method and apparatus for edge connection between elements of an integrated circuit |