Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/2002
01/03/2002US20020000430 Laser processing apparatus and method
01/03/2002US20020000427 Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding
01/03/2002US20020000426 Use of multiple laser sources for rapid, flexible machining and production of vias in multi-layered substrates
01/03/2002US20020000370 Ion processing of a substrate
01/03/2002US20020000331 Method for making an electronic circuit assembly
01/03/2002US20020000330 Intaglio printing method, intaglio printer, method of formation of bumps, or wiring pattern, apparatus therefor, bump electrode and printed circuit board
01/03/2002US20020000329 Processing of circuit boards with protective, adhesive-less covers on area array bonding sites
01/03/2002US20020000328 Printed wiring board and manufacturing method thereof
01/03/2002US20020000037 Method of fabricating a substrate with a via connection
01/03/2002DE10102848A1 Adhesion of electronic circuit carriers e.g. circuit boards to heat sink using double-sided adhesive film, by applying isostatic pressure via fluid in pressure chamber
01/03/2002DE10061304A1 Quick mounting frame for receiving and tensioning printing screen e.g. for manufacture of PCBs, has central force storing device which distributes tension via cable or chain
01/03/2002DE10035175C1 Making electrical/mechanical connection between flexible thin film substrates involves positioning substrates so openings coincide, positioning bonding elements, pressing together
01/03/2002DE10034616C1 Arrangement for making joint between electrical contact part and conductor has pressing element and counter element associated with side of associated part heated by powerful beam
01/03/2002DE10030921A1 Verfahren zur Erzeugung gedruckter Strukturen, Siebdruckmaschine, Siebdruckrakel sowie mit Strukturen bedruckte Oberfläche Process for the production of printed structures, screen printing machine, screen printing squeegee and printed with surface structures
01/03/2002DE10030086A1 Mounting programmable circuits on circuit board using automatic mounting machine, by mounting additional components on circuit board during programming
01/03/2002DE10029289A1 Verbindungsanordnung aus elektrischen/elektronischen Bauelementeträgern Joint assembly of electrical / electronic components makers
01/03/2002DE10026743C1 Substrat zur Aufnahme einer Schaltungsanordnung Substrate for receiving a circuit arrangement
01/02/2002EP1168901A2 Multilayer printed circuit board laminate and process for manufacturing the same
01/02/2002EP1168900A1 Method of manufacturing multilayer wiring board
01/02/2002EP1168899A1 Apparatus for manufacturing printed wiring board and method for manufacturing printed wiring board using the same
01/02/2002EP1168897A2 Foil printed circuit board and process for manufacturing and mounting the same
01/02/2002EP1168511A2 Electrical circuit connector with support
01/02/2002EP1168481A2 High frequency signal switching unit
01/02/2002EP1168445A1 Integrated circuit
01/02/2002EP1168441A2 Multi-layer wiring substrate and semiconductor device using the multi-layer wiring substrate
01/02/2002EP1168436A2 Polymer and ceramic composite electronic substrates
01/02/2002EP1168429A1 Integrated circuit chip and method for mounting an integrated circuit chip to a circuit board
01/02/2002EP1168404A2 Method and apparatus for forming pattern onto panel substrate
01/02/2002EP1168387A2 Isolated converter
01/02/2002EP1168376A1 Method for forming transparent conductive film by using chemically amplified resist
01/02/2002EP1168373A1 Anisotropically conductive film
01/02/2002EP1168240A2 Connection by depositing a viscous material following the relief shape
01/02/2002EP1168208A2 Printed circuit board wiring structure checkup system
01/02/2002EP1168082A2 Device for exposure of the peripheral area of a film circuit board
01/02/2002EP1168053A1 Liquid crystal display and its inspecting method
01/02/2002EP1167585A2 Method and apparatus for forming interconnects, and polishing liquid and polishing method
01/02/2002EP1167582A1 Metal alloy compositions and plating method related thereto
01/02/2002EP1167423A2 Polyimide silicone resin, solution containing it, and polyimide silicone resin film
01/02/2002EP1167029A1 Printing plate, and printing method using the same
01/02/2002EP1166948A2 Laser processing apparatus and method
01/02/2002EP1166889A2 Coating device for applying a liquid on panel-shaped work pieces
01/02/2002EP1166888A2 Coating device for applying a liquid on panel-shaped work pieces
01/02/2002EP1166609A2 Multifunctional laminate structure and process
01/02/2002EP1166404A1 Fourth harmonic generation apparatus
01/02/2002EP1166361A1 Apparatus and method for an integrated circuit having high q reactive components
01/02/2002EP1166353A1 Laminate for multi-layer printed circuit
01/02/2002EP1166351A2 Compensation model and registration simulator apparatus and method for manufacturing of printed circuit boards
01/02/2002EP1166273A1 Disposable sound recording and reproduction device
01/02/2002EP1165311A1 Multilayer ceramic circuit boards with embedded resistors
01/02/2002EP1165250A1 Dispensing assembly
01/02/2002EP1115916A4 Electrolytic cleaning of conductive bodies
01/02/2002EP1042092A4 Component of printed circuit boards
01/02/2002EP1023821B1 Method for connecting surface mount components to a substrate
01/02/2002EP0978224B1 Device for electrolytic treatment of plate-shaped articles and method for electronic shielding of edge areas of articles during electrolytic treatment
01/02/2002EP0885551A4 Printed circuit board fabrication apparatus
01/02/2002CN1329812A Printed circuit board and method for fabricating such board
01/02/2002CN1329752A Semiconductor copper bond pad surface protection
01/02/2002CN1329749A A method and apparatus for transport and tracking of electronic component
01/02/2002CN1329721A Photoetching contact elements
01/02/2002CN1329580A Impregnated glass fiber stands and products including the same
01/02/2002CN1329378A 印刷电路板连接器 Printed circuit board connectors
01/02/2002CN1329376A Assembly unit for mounting electric element of flexible cable
01/02/2002CN1329362A Mixed IC device
01/02/2002CN1329341A Silk-screen printing board, ceramic laminated electronic equipment and its producing method
01/02/2002CN1328898A Non-Pb flux composition and welding product
01/02/2002CN1077040C Squeegee for screen printing and its production method
01/02/2002CN1077038C Process for making plastic insulating layer for printed circuits
01/02/2002CN1076998C Soft solder and electronic component using the same
01/01/2002US6335866 Printed wiring board unit for use with electronic apparatus
01/01/2002US6335865 Printed wiring board
01/01/2002US6335864 Indicator module
01/01/2002US6335862 Multilayer printed wiring board provided with injection hole for thermally conductive filler
01/01/2002US6335671 Surface mount circuit assembly
01/01/2002US6335664 Branch circuit and its designing method, waveguide-microstrip transition, and application to HF circuit, antenna and communication system
01/01/2002US6335626 Method and device for determining a parameter for a metallization bath
01/01/2002US6335571 Semiconductor flip-chip package and method for the fabrication thereof
01/01/2002US6335567 Semiconductor device having stress reducing laminate and method for manufacturing the same
01/01/2002US6335495 Patterning a layered chrome-copper structure disposed on a dielectric substrate
01/01/2002US6335493 Multilayer wiring board
01/01/2002US6335492 Tape carrier package with improved connecting terminals and a method of electrically interconnecting the tape carrier package to external circuitry
01/01/2002US6335491 Interposer for semiconductor package assembly
01/01/2002US6335487 Method for connecting a cable to a printed circuit board, and a housing having a cable connected to the printed circuit board in accordance with the method
01/01/2002US6335417 Modified polyimide resin and thermosetting resin composition containing the same
01/01/2002US6335298 Insulating glass paste and thick-film circuit component
01/01/2002US6335271 Method of forming semiconductor device bump electrodes
01/01/2002US6335222 Microelectronic packages with solder interconnections
01/01/2002US6335104 Providing a copper pad surface; selectively depositing a protection layer of phosphorus or boron-containing metal alloy on the copper pad surface; depositing adhesion layer of noble metal
01/01/2002US6335077 For filling a via-hole formed in a green ceramic sheet
01/01/2002US6335076 Multi-layer wiring board and method for manufacturing the same
01/01/2002US6335055 Putting substrate at a lower side of a mask plate having a pattern hole, supplying paste on mask plate, and sliding a squeegee to a running direction side while contacting with mask plate, and scraping and collecting paste
01/01/2002US6334965 Electron acceptor comprising dopant anion and metal cation, polymerizable component comprising pyrrole and aniline, solvent
01/01/2002US6334960 Polymerization and solidification of fluid on transfer layer
01/01/2002US6334942 Providing resist on support so as to leave openings where metallic features are to be formed, depositing principal metal in openings, removing resist immediately adjacent metal, forming gaps, depositing cover metal
01/01/2002US6334922 Coating method utilizing a polymer film and method of making metal-polymer laminates
01/01/2002US6334905 Unleaded solder powder and production method therefor
01/01/2002US6334789 Surface-mount connector
01/01/2002US6334782 Printed-circuit board
01/01/2002US6334745 Apparatus and method for working double sided workpiece
01/01/2002US6334570 Soldering method
01/01/2002US6334569 Reflow soldering apparatus and reflow soldering method