| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/10/2002 | US20020003299 Chip carrier and method of manufacturing and mounting the same |
| 01/10/2002 | US20020003298 High frequency package, wiring board, and high frequency module |
| 01/10/2002 | US20020003293 Semiconductor device and method for fabricating same |
| 01/10/2002 | US20020003261 Thin-film capacitor element and electronic circuit board on which thin-film capacitor element is formed |
| 01/10/2002 | US20020003227 Nickel alloy particles for an anisotropic conductive film comprises intermetallics Ni3B (nickel-boron) or Ni3P (nickel-phosphorus) and are coated with gold |
| 01/10/2002 | US20020003160 Components with conductive solder mask layers |
| 01/10/2002 | US20020003130 Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulse widths |
| 01/10/2002 | US20020003127 Method of manufacturing wireless suspension blank |
| 01/10/2002 | US20020003048 Metal interconnections and active matrix substrate using the same |
| 01/10/2002 | US20020002887 Press punching method and apparatus for forming a plurality of through holes by changing a travel distance of a punching mold |
| 01/10/2002 | US20020002771 Method for making a planar inductor/transformer in a laminated printed circuit board |
| 01/10/2002 | DE10129032A1 HF-Modul RF module |
| 01/10/2002 | DE10061305A1 Position detection system for semi-automatic machines for screen and template printing, has only one fixed camera and image processing system |
| 01/10/2002 | DE10031940A1 Conductive foil circuit board for flexible circuit board in motor vehicles, has electric conductor tracks and covering layers |
| 01/10/2002 | DE10031762A1 Elektronisches Bauelement Electronic component |
| 01/10/2002 | DE10031428A1 Electrical terminal has solder pin longitudinal axis orthogonal to through opening longitudinal axial direction with terminal mounted, and contact flap joined to solder pin via z/s-section |
| 01/10/2002 | DE10030316A1 Auftragsvorrichtung zum Aufbringen von Flüssigkeiten auf plattförmige Werkstücke Applicator for applying liquids on flat shaped workpieces |
| 01/10/2002 | DE10030310A1 Auftragsvorrichtung zum Aufbringen von Flüssigkeiten auf plattenförmige Werkstücke Applicator device for applying liquids on plate-shaped workpieces, |
| 01/10/2002 | DE10029630A1 Device for protection of electronic modules from electrostatic discharge by provision of leads with stepped surge impedances |
| 01/09/2002 | EP1170983A1 Circuit forming board and method of manufacturing circuit forming board |
| 01/09/2002 | EP1170797A2 Thin-film capacitor element and electronic circuit board on which thin-film capacitor element is formed |
| 01/09/2002 | EP1170796A2 High frequency carrier with an adapted interconnect structure |
| 01/09/2002 | EP1170795A2 Electronic component with side contacts and associated method of fabrication |
| 01/09/2002 | EP1170400A1 Electrolytic copper foil with carrier foil and method for manufacturing the same |
| 01/09/2002 | EP1170315A1 Urethane oligomer, resin compositions thereof, and cured article thereof |
| 01/09/2002 | EP1170275A2 Omega-hydrofluoroalkyl ethers, precursor carboxylic acids and derivatives thereof, and their preparation and application |
| 01/09/2002 | EP1170110A1 Method for fabricating a plastic coated conductive structure of an electrical circuit unit as well as an electrical circuit unit comprising a plastic coated conductive structure |
| 01/09/2002 | EP1169895A1 Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards |
| 01/09/2002 | EP1169894A1 Dispensing assembly |
| 01/09/2002 | EP1169893A1 Method for introducing plated-through holes in an electrically insulating base material that is provided with metal layers on both sides |
| 01/09/2002 | EP1169891A1 Flexible microsystem and building techniques |
| 01/09/2002 | EP1169775A1 Predistortion generator coupled with an rf amplifier |
| 01/09/2002 | EP1169736A1 Power semiconductor module |
| 01/09/2002 | EP1169718A1 An arrangement for enabling trimming on a substrate and a method of producing a substrate that enables trimming |
| 01/09/2002 | EP1169135A1 Electrically operated liquid dispensing apparatus and method for dispensing viscous liquid |
| 01/09/2002 | EP0827632B1 Semiconductor device having a semiconductor chip electrically connected to a wiring substrate |
| 01/09/2002 | CN2471059Y Base plate adhered to surface jointed with passive assembly |
| 01/09/2002 | CN1330857A Improved methods for wire-scribing flament circuit patterns with planar and non-planar portions, improved wire-scribed boards, interconnection cards, and smart cards made by these methods |
| 01/09/2002 | CN1330509A Copper foil for printed circuit board and its surface treatment method |
| 01/09/2002 | CN1330403A Polymer-ceramic composite electronic substrate |
| 01/09/2002 | CN1330398A Tube core level encapsulation and manufacturing method thereof |
| 01/09/2002 | CN1330356A Method and device for forming picture on base plate |
| 01/09/2002 | CN1330269A Investigation apparatus |
| 01/09/2002 | CN1329963A Laser hole processing method and device |
| 01/09/2002 | CN1077476C Colling system of back-flow solder equipment and method for cooling soldered product |
| 01/08/2002 | US6337663 Built-in dual frequency antenna |
| 01/08/2002 | US6337607 Surface mountable low IMD ferrite isolator/circulator structure |
| 01/08/2002 | US6337575 Methods of testing integrated circuitry, methods of forming tester substrates, and circuitry testing substrates |
| 01/08/2002 | US6337574 Method and apparatus for testing bumped die |
| 01/08/2002 | US6337565 Electro-optic probe |
| 01/08/2002 | US6337522 Structure employing electrically conductive adhesives |
| 01/08/2002 | US6337463 Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole |
| 01/08/2002 | US6337445 Composite connection structure and method of manufacturing |
| 01/08/2002 | US6337384 Mixing bismaleimide with furan compound with oxirane group to form diepoxy compound, adding amine curing agent |
| 01/08/2002 | US6337375 High optical contrast resin composition and electronic package utilizing same |
| 01/08/2002 | US6337228 Low-cost printed circuit board with integral heat sink for semiconductor package |
| 01/08/2002 | US6337123 Multilayered ceramic substrate and method of producing the same |
| 01/08/2002 | US6337037 Printed wiring board conductive via hole filler having metal oxide reducing capability |
| 01/08/2002 | US6337028 Process of forming a pattern on a substrate |
| 01/08/2002 | US6337004 High adhesion performance roll sputtered strike layer |
| 01/08/2002 | US6336990 Thermocompression bonding method for electrically and mechanically connecting conductors |
| 01/08/2002 | US6336962 Making aqueous solution of gold, formic acid and aromatic carboxylic acid derivatives, adjusting ph between 1-6, plating on palladium surface |
| 01/08/2002 | US6336818 Electrical connector for connection between coil and printed circuit board in automotive anti-lock braking system |
| 01/08/2002 | US6336816 Electrical circuit connector with support |
| 01/08/2002 | US6336815 Connector for sending power to an IC-chip thru two pressed joints in series |
| 01/08/2002 | US6336601 Method for separating metallic material from waste printed circuit boards, and dry distillation apparatus used for waste treatment |
| 01/08/2002 | US6336581 Solder ball connection device and capillary tube thereof |
| 01/08/2002 | US6336402 Screen printing method and apparatus having an air blower |
| 01/08/2002 | US6336269 Method of fabricating an interconnection element |
| 01/08/2002 | US6336262 Process of forming a capacitor with multi-level interconnection technology |
| 01/08/2002 | CA2241530C Conductive elastomers and methods for fabricating the same |
| 01/08/2002 | CA2230256C Method for producing electrodeposited copper foil and copper foil obtained by same |
| 01/03/2002 | WO2002001930A2 Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas |
| 01/03/2002 | WO2002001929A2 Jet print apparatus and method for printed circuit board manufacturing |
| 01/03/2002 | WO2002001928A1 Vialess printed circuit board |
| 01/03/2002 | WO2002001636A1 Process for the manufacture of printed circuit boards with plated resistors |
| 01/03/2002 | WO2002001635A2 Electronic component |
| 01/03/2002 | WO2002001193A2 Optical system |
| 01/03/2002 | WO2002001190A2 Method and apparatus for improved process control in combustion applications |
| 01/03/2002 | WO2002000437A1 Method for the production of printed structures, screen printing machine, screen printing doctor blade and surface printed with structures |
| 01/03/2002 | WO2001065595A3 A method of forming an opening or cavity in a substrate for receiving an electronic component |
| 01/03/2002 | WO2001051276A3 Fabrication of metallic microstructures via exposure of photosensitive composition |
| 01/03/2002 | US20020001997 Solderable electrical connection element with a solder deposit |
| 01/03/2002 | US20020001984 Electrical connection method and connection site |
| 01/03/2002 | US20020001981 Method and apparatus for protecting and strengthening electrical contact interfaces |
| 01/03/2002 | US20020001937 Semiconductor package board using a metal base |
| 01/03/2002 | US20020001880 High-frequency module, method of manufacturing thereof and method of molding resin |
| 01/03/2002 | US20020001879 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components |
| 01/03/2002 | US20020001771 Heat sensitive elements; lithography printing plates |
| 01/03/2002 | US20020001720 Adhesives; coatings; encapsulation |
| 01/03/2002 | US20020001719 Laminated sheet and method of manufaturing the same |
| 01/03/2002 | US20020001712 Electronic component, method for producing electronic component, and circuit board |
| 01/03/2002 | US20020001699 Manufacturing method of printed circuit board |
| 01/03/2002 | US20020001216 Semiconductor device and process for manufacturing the same |
| 01/03/2002 | US20020001179 Standardized test board for testing custom chips |
| 01/03/2002 | US20020000906 Resistor array board |
| 01/03/2002 | US20020000901 Multilayer type printed-wiring board and method of manufacturing multilayer type printed-wiring board |
| 01/03/2002 | US20020000895 Electronic component utilizing face-down mounting |
| 01/03/2002 | US20020000651 Semiconductor device and method of fabricating the same |
| 01/03/2002 | US20020000462 Method of making electrically conductive contacts on substrates |