| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/17/2002 | US20020006033 Method of extending life expectancy of surface mount components |
| 01/17/2002 | US20020006032 Low-profile registered DIMM |
| 01/17/2002 | US20020005805 Method of machining glass substrate and method of fabricating high-frequency circuit |
| 01/17/2002 | US20020005588 Chip type electronic part |
| 01/17/2002 | US20020005571 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
| 01/17/2002 | US20020005570 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
| 01/17/2002 | US20020005567 Electronic component, manufacturing method therefor, aggregate electronic component, mounting structure of electronic component, and electronic device |
| 01/17/2002 | US20020005498 Cream solder inspection method and apparatus therefor |
| 01/17/2002 | US20020005391 Methods and apparatus for forming submicron patterns on films |
| 01/17/2002 | US20020005376 Method for separating oxide from dross, device for separating oxide from dross, and jet solder tank |
| 01/17/2002 | US20020005296 Surface mount package for long lead devices |
| 01/17/2002 | US20020005295 Multilayered circuit board and method for producing the same |
| 01/17/2002 | US20020005292 Bump-attached wiring circuit board and method for manufacturing same |
| 01/17/2002 | US20020005249 Method for producing copper-clad laminate |
| 01/17/2002 | US20020005247 Electrically conductive paste materials and applications |
| 01/17/2002 | US20020005091 Method and equipment for removing insulation from a flat cable |
| 01/17/2002 | US20020004982 Method for producing a doublesided wiring board |
| 01/17/2002 | US20020004981 Method and apparatus for forming metal contacts on a substrate |
| 01/17/2002 | DE10033352A1 Method of manufacturing electronic module or subassembly, has second conductor path connected via thermally plated-through regions to first conductor path |
| 01/17/2002 | DE10024676A1 Verfahren zum Bestimmen von Strömungsverhältnissen sowie Festplatine A method for determining flow conditions and hard board |
| 01/17/2002 | DE10007967C2 Mehrschichtige Anordnung elektrischer Leiter mit integrierter Stromerfassung Multi-layered arrangement of electrical conductors with integrated current detection |
| 01/17/2002 | CA2415781A1 Electroless rhodium plating |
| 01/17/2002 | CA2415780A1 Electroless platinum-rhodium alloy plating |
| 01/17/2002 | CA2407532A1 Acidic treatment liquid and method of treating copper surfaces |
| 01/16/2002 | EP1173051A1 Flexible printed wiring board and its production method |
| 01/16/2002 | EP1172902A1 Joint connector |
| 01/16/2002 | EP1172901A1 Vehicle having an electrical connection box and electrical connection box for use in the vehicle |
| 01/16/2002 | EP1172826A2 Flat cable and its manufacturing method |
| 01/16/2002 | EP1172760A1 Antenna coil for IC card and manufacturing method thereof |
| 01/16/2002 | EP1172423A1 Water-based ink, process for producing the same, and method of printing with the same |
| 01/16/2002 | EP1172401A2 Thin copper film directly bonded polyimide film and method of manufacturing the same |
| 01/16/2002 | EP1172025A1 Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
| 01/16/2002 | EP1171915A1 Electrical conductor system of a semiconductor device and manufacturing method thereof |
| 01/16/2002 | EP1171301A1 Flexible laminate for flexible circuit |
| 01/16/2002 | EP1171292A1 Process for direct digital printing of circuit boards |
| 01/16/2002 | EP1139104A9 Electrical conductor multilayer arrangement with integrated current detection |
| 01/16/2002 | EP1082884B1 Method for producing wirings having solder bumps |
| 01/16/2002 | EP1027753B1 Edge Interface electrical connector and radiotelephone |
| 01/16/2002 | EP1005509B1 Conductive epoxy resin compositions, anisotropically conductive adhesive films and electrical connecting methods |
| 01/16/2002 | EP1000529B1 Process and device for generating test patterns when applying solder paste by a screen printing process on printed circuit boards |
| 01/16/2002 | EP0980322B1 Sensor circuit for automobiles |
| 01/16/2002 | EP0966777B1 Electric subassembly |
| 01/16/2002 | CN1331820A Method for making contactless chip card |
| 01/16/2002 | CN1331802A Improving multi-chip module testability using poled-polymer interlayer dielectrics |
| 01/16/2002 | CN1331512A Mfg. method of electronic components |
| 01/16/2002 | CN1331490A Substrate, displaying device, mounting of substrate and IC chip and mounting bonding method |
| 01/16/2002 | CN1330996A Laser processing appts. and its method |
| 01/16/2002 | CN1077845C Appts. for dispensing viscous material |
| 01/15/2002 | US6339534 Compliant leads for area array surface mounted components |
| 01/15/2002 | US6339197 Multilayer printed circuit board and the manufacturing method |
| 01/15/2002 | US6339191 Prefabricated semiconductor chip carrier |
| 01/15/2002 | US6338973 Semiconductor device and method of fabrication |
| 01/15/2002 | US6338937 Lithography method and method for producing a wiring board |
| 01/15/2002 | US6338936 Resin with ester group, unsaturated bond, generation of acid by exposure to acid and catalysis |
| 01/15/2002 | US6338906 Sintering ceramic matrices and interconnecting pore structure |
| 01/15/2002 | US6338893 Conductive paste and ceramic printed circuit substrate using the same |
| 01/15/2002 | US6338804 Method for removing conductive portions |
| 01/15/2002 | US6338776 In regard to temperature and humidity/water content prior to precision operations so as to minimize any problems resulting from dimensional changes; integrated circuit substrate manufacturing and printed circuit board manufacturing; |
| 01/15/2002 | US6338767 Circuit component built-in module and method for producing the same |
| 01/15/2002 | US6338634 Surface mount electrical connector with anti-wicking terminals |
| 01/15/2002 | US6338633 Electrical connector with improved contacts |
| 01/15/2002 | US6338630 Board-to-board connector with improved contacts |
| 01/15/2002 | US6338297 Precise and rapid positioning mechanism for stencil printing |
| 01/15/2002 | US6338195 Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet |
| 01/15/2002 | US6338194 Method of making a circuitized substrate assembly with carrier having substrates therein |
| 01/15/2002 | CA2244868C Grafted thermoplastic elastomer barrier layer |
| 01/15/2002 | CA2233481C Integrated circuit device cooling structure |
| 01/15/2002 | CA2060672C Contact for an electrical connector protected by a polymer film and its production process |
| 01/13/2002 | CA2343440A1 Ultrasonic process for autocatalytic deposition of metal |
| 01/10/2002 | WO2002003767A1 Multi-metal layer circuit |
| 01/10/2002 | WO2002003766A2 Process for thick film circuit patterning |
| 01/10/2002 | WO2002003765A2 Method and apparatus for locating and securing a printed wire board on a screen printer |
| 01/10/2002 | WO2002003462A2 Self retained pressure connection |
| 01/10/2002 | WO2002003447A1 Device and method for forming bump |
| 01/10/2002 | WO2002003446A1 Method and apparatus for applying a protective over-coating to a ball-grid-array (bga) structure |
| 01/10/2002 | WO2002003322A1 Method for producing a card-type data carrier and a device for carrying out said method |
| 01/10/2002 | WO2002002304A1 Press pad |
| 01/10/2002 | WO2001038603A3 Metallizing method for dielectrics |
| 01/10/2002 | WO2001032958A3 Multilayer metal composite structures for semiconductor circuitry and method of manufacture |
| 01/10/2002 | WO2001017011A3 Conductor track supporting layer for laminating inside a chip card, chip card comprising a conductor track supporting layer, and method for producing a chip card |
| 01/10/2002 | US20020004352 Lasable bond-ply materials for high density printed wiring boards |
| 01/10/2002 | US20020004341 Board-cable connection structure |
| 01/10/2002 | US20020004324 Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin |
| 01/10/2002 | US20020004322 Joint connector |
| 01/10/2002 | US20020004321 High frequency signal switching unit |
| 01/10/2002 | US20020004320 Attaratus for socketably receiving interconnection elements of an electronic component |
| 01/10/2002 | US20020004180 Electroconductive zones on dielectric |
| 01/10/2002 | US20020004145 Crown compounds |
| 01/10/2002 | US20020004132 Contact printable adhesive composition and methods of making thereof |
| 01/10/2002 | US20020004125 Low loss material for the manufacture of PCB'S and antenna boards and a method for producing same |
| 01/10/2002 | US20020004124 Copper foil circuit with a carrier, method for manufacturing printed wiring board using the same, and printed wiring board |
| 01/10/2002 | US20020004123 Having diarylamino substituted diaryl, triaryl or tetraaryl light emitting, electron transporting material; high performance and luminance |
| 01/10/2002 | US20020003991 Entry board for drilling |
| 01/10/2002 | US20020003715 Isolated converter |
| 01/10/2002 | US20020003694 Vertical surface mount apparatus with thermal carrier |
| 01/10/2002 | US20020003595 Backlighted liquid crystal display assembly mounted on circuit substrate |
| 01/10/2002 | US20020003459 Surface acoustic wave device and method of producing the same |
| 01/10/2002 | US20020003377 Vehicle having an electrical connection box and electrical connection box for use in the vehicle |
| 01/10/2002 | US20020003304 Semiconductor device having multilevel interconnection |
| 01/10/2002 | US20020003303 Multi-layer interconnect |