| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/24/2002 | US20020008967 Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same |
| 01/24/2002 | US20020008966 Microelectronic contacts with asperities and methods of making same |
| 01/24/2002 | US20020008963 Inter-circuit encapsulated packaging |
| 01/24/2002 | US20020008681 Liquid crystal device, manufacturing method therefor, and electronic apparatus |
| 01/24/2002 | US20020008599 Multi-layer microwave circuits and methods of manufacture |
| 01/24/2002 | US20020008326 Electrode structure of a carrier substrate of a semiconductor device |
| 01/24/2002 | US20020008321 Connection structure |
| 01/24/2002 | US20020008313 Substrate mounting an integrated circuit pakage with a deformed lead |
| 01/24/2002 | US20020008310 Vertically mountable semiconductor device, assembly, and methods |
| 01/24/2002 | US20020008307 Substrate film structure |
| 01/24/2002 | US20020008238 Electronic circuit unit suitable for miniaturization |
| 01/24/2002 | US20020008228 Surface treatment of metal particles |
| 01/24/2002 | US20020008093 Laser processing method and equipment for printed circuit board |
| 01/24/2002 | US20020007967 Wiring unit |
| 01/24/2002 | US20020007966 Structure for high speed printed wiring boards with multiple differential impedance-controlled layer |
| 01/24/2002 | US20020007964 Printed circuit board and electronic package using same |
| 01/24/2002 | US20020007961 Wired circuit board |
| 01/24/2002 | US20020007789 Dual track stenciling system with solder gathering head |
| 01/24/2002 | US20020007782 Heater in a conveyor system |
| 01/24/2002 | US20020007750 Process for roughening support material for printing plates |
| 01/24/2002 | US20020007743 Apparatus and method of screen printing |
| 01/24/2002 | US20020007741 Method and apparatus for dispensing material in a printer |
| 01/24/2002 | US20020007714 Punch holder apparatus |
| 01/24/2002 | DE10132786A1 Schicht mit flexibler gedruckter Schaltung Layer of flexible printed circuit |
| 01/24/2002 | DE10033934A1 Galvanic formation of conducting structures of highly pure copper on semiconductor substrates used in the production of integrated circuits uses a copper bath contains a copper ion source, and an additive compound |
| 01/24/2002 | DE10023015A1 Verdahren zur Herstellung eines dreidimensionalen Sensorelementes Verdahren for producing a three-dimensional sensor element |
| 01/24/2002 | CA2416502A1 Method for making an integrated circuit capable of being surface-mounted and resulting circuit |
| 01/24/2002 | CA2415707A1 Radiation-curable compositions and cured articles |
| 01/23/2002 | EP1175138A2 Method for mounting semiconductor element to circuit board, and semiconductor device |
| 01/23/2002 | EP1175134A1 Heatsink apparatus for de-coupling clamping forces on an integrated circuit package |
| 01/23/2002 | EP1175132A1 Surface-treated copper foil and method for manufacturing the surface-treated copper foil |
| 01/23/2002 | EP1174973A1 Junction box |
| 01/23/2002 | EP1174951A2 System and method for providing high voltage withstand capability between pins of a high-density compliant pin connector |
| 01/23/2002 | EP1174912A1 Semiconductor wafer processing apparatus and processing method |
| 01/23/2002 | EP1174766A2 Process for patterning non-photoimagable ceramic tape |
| 01/23/2002 | EP1174709A2 Cream solder inspection |
| 01/23/2002 | EP1174530A2 Methods of producing conductor layers on dielectric surfaces |
| 01/23/2002 | EP1174311A1 Junction box |
| 01/23/2002 | EP1174008A1 Multi-layer laminate and method of producing same |
| 01/23/2002 | EP1174007A1 A method for making flexible circuits |
| 01/23/2002 | EP1174006A1 Method for drilling circuit boards |
| 01/23/2002 | EP1173303A1 A system and method for material processing using multiple laser beams |
| 01/23/2002 | EP1042946B1 Hybrid circuit with a heat dissipation system |
| 01/23/2002 | EP0954385A4 Fluid delivery apparatus and method |
| 01/23/2002 | EP0933010B1 Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards |
| 01/23/2002 | CN2473858Y Jet cleaning device for blind hole and small through hole |
| 01/23/2002 | CN1332704A Glass fiber-reinforced prepegs, laminates, electronic circuit boards and methods for assembling fabric |
| 01/23/2002 | CN1332601A Electronic circuit unit |
| 01/23/2002 | CN1332600A Plane mounted electronic circuit unit |
| 01/23/2002 | CN1332599A Plane mounted electronic circuit unit |
| 01/23/2002 | CN1332598A Printed-wiring board with cavity for mounting electronic component and manufacture thereof |
| 01/23/2002 | CN1332597A Electronic element apparatus and manufacture thereof |
| 01/23/2002 | CN1332265A Electronic line chip |
| 01/23/2002 | CN1332054A Laser process device and method |
| 01/23/2002 | CN1078439C Chip element assembly |
| 01/23/2002 | CN1078357C Waterborne photoresists having associate thickeners |
| 01/22/2002 | US6341071 Stress relieved ball grid array package |
| 01/22/2002 | US6340896 Test socket and methods |
| 01/22/2002 | US6340894 Semiconductor testing apparatus including substrate with contact members and conductive polymer interconnect |
| 01/22/2002 | US6340893 Printed circuit board test apparatus and method |
| 01/22/2002 | US6340841 Build-up board package for semiconductor devices |
| 01/22/2002 | US6340798 Printed circuit board with reduced crosstalk noise and method of forming wiring lines on a board to form such a printed circuit board |
| 01/22/2002 | US6340797 Printed circuit board having signal patterns of varying widths |
| 01/22/2002 | US6340791 Means and process for encapsulating electric circuits by means of injection molding |
| 01/22/2002 | US6340635 Resist pattern, process for the formation of the same, and process for the formation of wiring pattern |
| 01/22/2002 | US6340630 Method for making interconnect for low temperature chip attachment |
| 01/22/2002 | US6340626 Method for making a metallic pattern by photolithography |
| 01/22/2002 | US6340546 Which, on heating, become heat-resistant polyimide polymers suitable for surface-protecting films, interlayer insulating films |
| 01/22/2002 | US6340525 For ropes, nets, artificial gut, tarpaulins, tents, screens, paragliders and sailcloths, for producing mesh woven fabrics for screen-printing, especially high-mesh high-modulus plain gauzes for screen printing, plates for printed circuits |
| 01/22/2002 | US6340518 Flexible metal-clad laminates and preparation of the same |
| 01/22/2002 | US6340318 Metal terminal |
| 01/22/2002 | US6340113 Soldering methods and compositions |
| 01/22/2002 | US6340111 Micro grid array solder interconnection structure for second level packaging joining a module and a printed circuit board |
| 01/22/2002 | US6340110 Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus |
| 01/22/2002 | CA2199796C An electronic-circuit assembly and its manufacturing method |
| 01/22/2002 | CA2077720C Process of forming electrical connections between conductive layers using thermosonic wire bonded bump vias and thick film techniques |
| 01/17/2002 | WO2002005609A1 Structure for interconnecting conductors and connecting method |
| 01/17/2002 | WO2002005608A1 Method, apparatus and use of applying viscous medium on a substrate |
| 01/17/2002 | WO2002005607A1 Method and apparatus for providing a substrate with viscous medium and use of jetting means for the correction of application errors |
| 01/17/2002 | WO2002005605A1 Carrier-foiled copper foil circuit, printed circuit board manufacturing method using the circuit, and printed circuit board |
| 01/17/2002 | WO2002005604A1 Carrier-foiled composite copper foil, method for manufacturing printed circuit board with resistance circuit, and printed circuit board having resistance circuit |
| 01/17/2002 | WO2002005346A1 Electronic device with heat conductive encasing device |
| 01/17/2002 | WO2002004715A2 Deposition uniformity control for electroplating apparatus, and associated method |
| 01/17/2002 | WO2002004712A2 Flow diffuser to be used in electro-chemical plating system |
| 01/17/2002 | WO2002004711A2 Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 01/17/2002 | WO2002004706A1 Acidic treatment liquid and method of treating copper surfaces |
| 01/17/2002 | WO2002004703A2 Electroless rhodium plating |
| 01/17/2002 | WO2002004702A2 Electroless platinum-rhodium alloy plating |
| 01/17/2002 | WO2002004549A1 Heat-resistant formulation and method for using same |
| 01/17/2002 | WO2002003777A1 Method of producing plants, plant cultivating device, and light-emitting panel |
| 01/17/2002 | WO2001068193A3 Multilayer golf ball with filled inner layer having dual core, liquid core, or wound core |
| 01/17/2002 | WO2001058639A9 Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method |
| 01/17/2002 | WO2001050198A3 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows |
| 01/17/2002 | US20020007260 Check system for wiring structure of printed circuit board |
| 01/17/2002 | US20020007042 Die attach adhesives for use in microelectronic devices |
| 01/17/2002 | US20020006749 Resin shield circuit device |
| 01/17/2002 | US20020006503 Composite wiring board and manufacturing method thereof |
| 01/17/2002 | US20020006453 Printed circuit board edge shaping tool |
| 01/17/2002 | US20020006358 Detector |
| 01/17/2002 | US20020006035 Compact electronic circuit unit having circulator, manufactured with high productivity |