| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/31/2002 | US20020011857 Test coupon in printed wiring board |
| 01/31/2002 | US20020011666 Selectively coating bond pads |
| 01/31/2002 | US20020011662 Packaging substrate and semiconductor device |
| 01/31/2002 | US20020011659 Insulating thick film composition, ceramic electronic device using the same, and electronic apparatus |
| 01/31/2002 | US20020011658 Surface-mounting type electronic circuit unit suitable for miniaturization |
| 01/31/2002 | US20020011657 Semiconductor device, an interposer for the semiconductor device, and a method of manufacturing the same |
| 01/31/2002 | US20020011596 Electronic circuit unit that is suitable for miniaturization and suitable for simple output adjustment |
| 01/31/2002 | US20020011511 Apparatus and method for soldering electronic components to printed circuit boards |
| 01/31/2002 | US20020011421 Reactive ion etching of an article having polymeric surface layer and metallic features by exposing to plasma reactive with the polymer while applying voltage adjacent to metallic features; semiconductors |
| 01/31/2002 | US20020011418 Method for surface treatment of copper foil |
| 01/31/2002 | US20020011415 Positioning electroconductive substrate in a chamber containing electrochemical bath, applying a plating bias to the substrate while immersing into bath, and depositing third conductive material in situ to fill; pulsation |
| 01/31/2002 | US20020011352 Electronic circuit unit that is suitable for miniaturization and excellent in high frequency characteristic |
| 01/31/2002 | US20020011351 Printed-wiring substrate and method for fabricating the same |
| 01/31/2002 | US20020011349 Circuit board and method of manufacturing a circuit board |
| 01/31/2002 | US20020011348 Flexible wiring boards and processes for producing flexible wiring board |
| 01/31/2002 | US20020011308 7575654 not granted per USPTO |
| 01/31/2002 | US20020010999 Junction box |
| 01/31/2002 | DE10126002A1 Multilayered circuit board composite body used in the production of planar transformers and coils comprises two circuit boards joined by a composite foil |
| 01/31/2002 | DE10044540C1 Forming conducting coatings on substrate through hole walls involves applying covering coating on one side, coating with electrically conducting material, removing covering coating |
| 01/31/2002 | DE10034648A1 Manufacture procedure for stencil for circuit board assembly by welding metal stencil to pretensioned frame to tension stencil |
| 01/31/2002 | DE10034614A1 Electrical connecting element has contact element of lamella form with two contact surfaces as part of plug connector part for contacting by other electrically conducting arrangements |
| 01/31/2002 | DE10034022A1 Acidic treatment liquid for treating and forming copper surfaces on printed circuit boards comprises hydrogen peroxide, five-membered heterocyclic compound(s), and microstructure modifying agent(s) |
| 01/31/2002 | DE10033507A1 Producing conducting patterns on bearers involves transferring pattern to flexible bearer by hot embossing from foil with plastic bearer strip, conducting material, wax layer, adhesive coating |
| 01/31/2002 | CA2385253A1 Resist ink composition |
| 01/30/2002 | EP1176683A2 Vehicle power distributor and method of connecting control circuit board to vehicle power distributor |
| 01/30/2002 | EP1176641A2 Front-and-back electrically conductive substrate and method for manufacturing same |
| 01/30/2002 | EP1176635A2 Spring structure and method |
| 01/30/2002 | EP1176629A2 Method of and apparatus for heating a substrate |
| 01/30/2002 | EP1176159A1 Thermosetting resin composition and flexible-circuit overcoating material comprising the same |
| 01/30/2002 | EP1176000A1 Carrier foil-pasted metal foil and production method thereof |
| 01/30/2002 | EP1175978A2 Method for fabrication of industrial parts having high-aspect-ratio through-hole sections |
| 01/30/2002 | EP1175710A1 Wireless article including a plural-turn loop antenna |
| 01/30/2002 | EP1175275A1 Method for producing weld points on a substrate and guide for implementing said method |
| 01/30/2002 | EP1078012A4 Composition and method for producing polythioethers having pendent methyl chains |
| 01/30/2002 | EP0974249B1 Process for producing printed circuits and printed circuits thus obtained |
| 01/30/2002 | EP0968629B1 Flat assembly and method for post-assembling additional components on a printed circuit board |
| 01/30/2002 | EP0760164B1 A high density integrated circuit assembly combining leadframe leads with conductive traces |
| 01/30/2002 | CN1333999A Method of manufacturing an interlayer and a laminate precursor useful for same |
| 01/30/2002 | CN1333998A Multi-layer laminate and method of producing same |
| 01/30/2002 | CN1333997A Printed circuit assembly having locally enhanced wiring density |
| 01/30/2002 | CN1333996A Production of photoresist coatings |
| 01/30/2002 | CN1333920A Liimnate for multi-layer printed circuit |
| 01/30/2002 | CN1333791A Polyoxazolidone adhesive resin compoistion prepared from polyepoxides and polyisocyanates |
| 01/30/2002 | CN1333649A Duplicated material and making method thereof, and distribution substrate made of same |
| 01/30/2002 | CN1333648A System and method for supplying anti-high voltage ability in contact pin of high density flexible pin connector |
| 01/30/2002 | CN1333562A Semiconductor module and making method thereof |
| 01/30/2002 | CN1333130A Screen plate printing method, screen printer and container for storage for paste agent thereof |
| 01/30/2002 | CN1078805C Solder pad for printed circuit boards |
| 01/30/2002 | CN1078629C Liquid for corroding copper and copper alloy |
| 01/30/2002 | CN1078532C Inverted stamping process |
| 01/30/2002 | CN1078510C Laser working method and device |
| 01/29/2002 | US6343001 Multilayer capacitance structure and circuit board containing the same |
| 01/29/2002 | US6342932 Liquid crystal display |
| 01/29/2002 | US6342827 Thermal fuse for fixing on a circuit substrate |
| 01/29/2002 | US6342789 Universal wafer carrier for wafer level die burn-in |
| 01/29/2002 | US6342731 Vertically mountable semiconductor device, assembly, and methods |
| 01/29/2002 | US6342682 Printed wiring board and manufacturing method thereof |
| 01/29/2002 | US6342680 Plastic formed of conductive resin comprising thermoplastic resin, lead-free solder that melts during plasticization, metal powder or mixture of metal powder and metal short fibers that assists fine dispersion of solder particles in resin |
| 01/29/2002 | US6342539 Non-metallic constituent components of printed wiring assemblies and printed wiring boards |
| 01/29/2002 | US6342471 Electrical contact cleaner |
| 01/29/2002 | US6342455 Process for forming an integrated circuit |
| 01/29/2002 | US6342454 Forming integrated circuits, applying metal films to substrates, lithographically patterns of circuits on substrates, heat resistant dielectric polymer, heating, coupling |
| 01/29/2002 | US6342443 Method and structure for forming flip chip with collapse-controlled solder bumps on a substrate |
| 01/29/2002 | US6342442 Kinetically controlled solder bonding |
| 01/29/2002 | US6342400 Dye penetrant test for semiconductor package assembly solder joints |
| 01/29/2002 | US6342332 Acrylic binder, multifunctional unsaturated polymerizable monomer, photoinitiator in an amount greater than 10%; ether solvent; resistant to blocking; negative photoresist |
| 01/29/2002 | US6342308 Copper foil bonding for printed circuits |
| 01/29/2002 | US6342307 Microstructure, interfaces between metal and polymer such as polyamide |
| 01/29/2002 | US6342276 Method for making a field emission display |
| 01/29/2002 | US6342266 Method for monitoring solder paste printing process |
| 01/29/2002 | US6342164 Pinhole-free dielectric films |
| 01/29/2002 | US6341976 Method and device for the attachment of electrical components to a circuit board |
| 01/29/2002 | CA2184373C Fabrication multilayer combined rigid/flex printed circuit board |
| 01/29/2002 | CA2169236C Device for cleaning screen plate used in screen printing |
| 01/29/2002 | CA2096426C Process and composition for cleaning contaminants with terpene and monobasic ester |
| 01/24/2002 | WO2002007487A1 Production method for copper-clad laminated sheet |
| 01/24/2002 | WO2002007486A1 Method for producing an electrical and/or mechanical connection between flexible thin-film substrates |
| 01/24/2002 | WO2002007485A1 Circuit board and method for manufacturing the same, and electronic apparatus comprising it |
| 01/24/2002 | WO2002007208A1 Method for making an integrated circuit capable of being surface-mounted and resulting circuit |
| 01/24/2002 | WO2002006898A2 Material and method for making an electroconductive pattern |
| 01/24/2002 | WO2002006561A2 Process for deposition of metal on a surface |
| 01/24/2002 | WO2002006423A1 Liquid crystal polymers for flexible circuits |
| 01/24/2002 | WO2002006399A1 Halogen-free flame-retardant epoxy resin compoisition, halogen-free flame-retardant epoxy resin composition for build-up type multilayer boards, prepregs, copper-clad laminates, printed wiring boards, resin films with copper foil or carriers, and build-up type laminates and multilayer boards |
| 01/24/2002 | WO2002006371A2 Radiation-curable compositions and cured articles |
| 01/24/2002 | WO2001082663A3 Removing inherent stress via high temperature annealing |
| 01/24/2002 | WO2001056771A3 Method for fabricating micro-structures with various surface properties in multilayer body by plasma etching |
| 01/24/2002 | WO2001047329A3 High speed electronic assembly system and method |
| 01/24/2002 | US20020010898 System and method for designing a printed board adopted to suppress electromagnetic interference |
| 01/24/2002 | US20020010263 Curable resin composition for overcoat of flexible circuit |
| 01/24/2002 | US20020010247 Adhesive is composed of a thermoset or photosetting resin composition including a base resin (especially a polyvinyl acetal), a polymerization inhibitor, and electroconductive particles. |
| 01/24/2002 | US20020010245 Thermally conductive filler surface treated with a silalkylene oligosiloxane |
| 01/24/2002 | US20020010116 Azeotropes |
| 01/24/2002 | US20020009919 Wiring unit |
| 01/24/2002 | US20020009908 Wire-to-board connector |
| 01/24/2002 | US20020009907 Junction box |
| 01/24/2002 | US20020009869 Reflow of low melt solder tip C4's |
| 01/24/2002 | US20020009610 An electronic device comprising a substrate and a semiconductor device connected by means of a lead-free solder comprising bismuth; lead of semiconductor having a tin-bismuth alloy layer; pollution control; nontoxic; stability |
| 01/24/2002 | US20020009578 Flexible multilayer wiring board |
| 01/24/2002 | US20020009539 Process for screening features on an electronic substrate with a low viscosity paste |
| 01/24/2002 | US20020009207 Connection method for microphone of mobile radio communication unit and connection structure thereof |