| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/07/2002 | US20020014683 BGA type semiconductor device having a solder-flow damping/stopping pattern |
| 02/07/2002 | US20020014615 For electrically connecting a liquid crystal display (LCD) to a circuit board |
| 02/07/2002 | US20020014602 Method and apparatus for providing a substrate with viscous medium |
| 02/07/2002 | US20020014518 Connecting method and connecting structure of printed circuit boards |
| 02/07/2002 | US20020014513 Soldering apparatus for through holes on surface mount printed circuit boards |
| 02/07/2002 | US20020014469 Method and apparatus for surface processing of printed wiring board |
| 02/07/2002 | US20020014351 Module-mounting motherboard device |
| 02/07/2002 | US20020014346 Mounting structure of semiconductor package |
| 02/07/2002 | US20020014084 Substrate-processing apparatus |
| 02/07/2002 | US20020013997 Method of manufacture of integral low and high value resistors on a printed circuit board |
| 02/07/2002 | DE19931004C2 Chipmodul, insbesondere BGA-Package, mit einem Interconnect zur stressfreien Lötverbindung mit einer Leiterplatte Chip module, in particular BGA package, with an interconnect for stress-free soldered to a circuit board |
| 02/07/2002 | DE10052517A1 Transpondemodul und Verfahren zum Herstellen eines Transponders Transpondemodul and method for producing a transponder |
| 02/07/2002 | DE10000414C2 Verfahren zur stiftlosen versatzfreien Montage von Multilayer-Innenanlagen Method for pinless offset-free assembly of multilayer indoor plants |
| 02/07/2002 | CA2417159A1 Method for making a circuitry comprising conductive tracks, chips and micro-vias and use of same for producing printed circuits and multilayer modules with high density of integration |
| 02/06/2002 | EP1178714A2 Multilayer board and method for making the same |
| 02/06/2002 | EP1178713A2 Multilayered board and method for fabricating the same |
| 02/06/2002 | EP1178712A2 Structure with blended polymer conformal coating of controlled electrical resistivity |
| 02/06/2002 | EP1178594A2 Electronic apparatus provided with an electronic circuit substrate |
| 02/06/2002 | EP1178406A1 Automatic concealment of product serialization information |
| 02/06/2002 | EP1178128A1 Method of forming chromium coated copper for printed circuit boards |
| 02/06/2002 | EP1178072A2 Aromatic liquid-crystalline polyester solution composition |
| 02/06/2002 | EP1177870A2 A cutter wheel for forming scribe lines on brittle materials |
| 02/06/2002 | EP1177641A1 Energy conditioning circuit assembly |
| 02/06/2002 | EP1177586A1 Light-emitting diode arrangement |
| 02/06/2002 | EP1177478A1 Photosensitive composition |
| 02/06/2002 | EP1001852A4 Polymerizable fluxing agents and fluxing adhesive compositions therefrom |
| 02/06/2002 | EP0994778B1 Doctor blade for applying products with high degree of viscosity and thixotropic properties on a substrate varying in height, through a stencil, applied to said substrate |
| 02/06/2002 | EP0953186B1 Chip card module |
| 02/06/2002 | EP0807190B1 Process for producing metal-coated materials |
| 02/06/2002 | EP0758282B1 Process for wave-soldering printed circuit boards |
| 02/06/2002 | CN2476157Y Material-lifting mechanism of surface stick-mounting machine |
| 02/06/2002 | CN2475501Y Solder tin furnace device for soldering machine |
| 02/06/2002 | CN1335045A Process for depositing conducting layer on substrate |
| 02/06/2002 | CN1334696A 电子电路组件 Electronic circuit assembly |
| 02/06/2002 | CN1334695A 电子电路组件 Electronic circuit assembly |
| 02/06/2002 | CN1334624A HF signal conversion apparatus |
| 02/06/2002 | CN1334619A I/O connector for portable communication equiment |
| 02/06/2002 | CN1334491A Method for forming pattern of non-photo-imaging ceramic strip |
| 02/06/2002 | CN1334256A Insulation ceramic press block, ceramic laminal substrate and ceramic electronic device |
| 02/06/2002 | CN1334255A Insulation ceramic press block |
| 02/05/2002 | US6344975 Modular backplane |
| 02/05/2002 | US6344974 Printed circuit board and method of producing same |
| 02/05/2002 | US6344973 Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same |
| 02/05/2002 | US6344792 Method of manufacturing and testing an electronic device, and a electronic device |
| 02/05/2002 | US6344787 Transformer bobbin |
| 02/05/2002 | US6344785 Electronic surface mount package |
| 02/05/2002 | US6344781 Broadband microwave choke and a non-conductive carrier therefor |
| 02/05/2002 | US6344695 Semiconductor device to be mounted on main circuit board and process for manufacturing same device |
| 02/05/2002 | US6344690 Semiconductor device with gold bumps, and method and apparatus of producing the same |
| 02/05/2002 | US6344689 Optical semiconductor device for surface mounting |
| 02/05/2002 | US6344684 Multi-layered pin grid array interposer apparatus and method for testing semiconductor devices having a non-pin grid array footprint |
| 02/05/2002 | US6344613 Automobile electrical circuit assembly with transparent protective cover |
| 02/05/2002 | US6344609 Electronic unit effectively utilizing circuit board surface |
| 02/05/2002 | US6344407 Method of manufacturing solder bumps and solder joints using formic acid |
| 02/05/2002 | US6344371 Dimensionally stable core for use in high density chip packages and a method of fabricating same |
| 02/05/2002 | US6344309 Polysilane composition for forming a coating suitable for bearing a metal pattern, metal pattern forming method, wiring board preparing method |
| 02/05/2002 | US6344308 Method of manufacturing a flexible circuit board |
| 02/05/2002 | US6344248 Carbon and inorganic filler such as silica, alumina |
| 02/05/2002 | US6344234 Method for forming reflowed solder ball with low melting point metal cap |
| 02/05/2002 | US6344157 Polymeric resin, conductive filler, 8-hydroxyquinoline corrosion inhibitor |
| 02/05/2002 | US6344156 Anisotropic conductive adhesive film |
| 02/05/2002 | US6344129 Method for plating copper conductors and devices formed |
| 02/05/2002 | US6344106 Apparatus, and corresponding method, for chemically etching substrates |
| 02/05/2002 | US6344087 Board coating system |
| 02/05/2002 | US6343732 Passive and active heat retention device for solder fountain rework |
| 01/31/2002 | WO2002009485A2 Flip chip package, circuit board thereof and packaging method thereof |
| 01/31/2002 | WO2002009484A2 Electrical component assembly and method of fabrication |
| 01/31/2002 | WO2002009237A1 Method and apparatus for protecting and strengthening electrical contact interfaces |
| 01/31/2002 | WO2002009194A1 Method and system for bonding a semiconductor chip onto a carrier using micro-pins |
| 01/31/2002 | WO2002009124A1 Circuit board protection system and method |
| 01/31/2002 | WO2002008491A1 Palladium removing solution and method for removing palladium |
| 01/31/2002 | WO2002008347A2 Resist ink composition |
| 01/31/2002 | WO2002008338A1 Insulating resin composition for multilayer printed wiring boards, multilayer printed wiring boards made by using the composition and process for the production thereof |
| 01/31/2002 | WO2002007952A2 Method and apparatus for fine feature spray deposition |
| 01/31/2002 | WO2001072919A3 Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
| 01/31/2002 | WO2001070867A3 Flame retardant epoxy molding compositions |
| 01/31/2002 | WO2001047003A3 Methods and apparatus for forming submicron patterns on films |
| 01/31/2002 | WO2001033630A3 Methods and compositions for detection and treatment of breast cancer, based on breast cancer-associated polypeptides |
| 01/31/2002 | US20020013443 Polybenzoxazole and crosslinking agent |
| 01/31/2002 | US20020013098 Display device having a conductor pattern for connecting pixels in an electrically conducting manner |
| 01/31/2002 | US20020013084 Terminal crimping method and terminal crimping apparatus |
| 01/31/2002 | US20020013083 Electric connecting terminal |
| 01/31/2002 | US20020013082 Electric connecting terminal |
| 01/31/2002 | US20020013071 Final testing of IC die in wafer form |
| 01/31/2002 | US20020013070 Spring structure with self-aligned release material |
| 01/31/2002 | US20020013017 Multilayer circuit component and method for manufacturing the same |
| 01/31/2002 | US20020012868 Composition for forming electroconductive film such as electrode or wiring, method for forming electroconductive film such as electrode or wiring, and method for producing electron emitting device, electron source and image forming apparatus |
| 01/31/2002 | US20020012857 Method of manufacturing printing plate, and printing plate |
| 01/31/2002 | US20020012804 Protective coatings; by electrolysis |
| 01/31/2002 | US20020012780 Multilayer lamination |
| 01/31/2002 | US20020012762 Double-side thermally conductive adhesive tape for plastic-packaged electronic components |
| 01/31/2002 | US20020012743 Generating a stream from a spray source, passing stream through a collimator, then through an opening in an aperture member spaced from the collimator and supported above substrate, moving to define feature; electronics, fine lines |
| 01/31/2002 | US20020012608 Pb-free solder composition and soldered article |
| 01/31/2002 | US20020012607 Variable melting point solders and brazes |
| 01/31/2002 | US20020012239 Board-to-board electrical coupling with conductive band |
| 01/31/2002 | US20020012229 Plated through-holes for signal interconnections in an electronic component assembly |
| 01/31/2002 | US20020012096 Manufacturing method for manufacturing electro-optical device, connection method for connecting terminals, electro-optical device, and electronic equipment |
| 01/31/2002 | US20020011918 Mounting structure for thermistor with positive resistance-to-temperature characteristic |
| 01/31/2002 | US20020011907 Multilayer ceramic device |
| 01/31/2002 | US20020011905 Surface mount RC devices |