| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/14/2002 | US20020017366 Flat cable and a manufacturing method therefor |
| 02/14/2002 | US20020017346 Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same |
| 02/14/2002 | US20020017177 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 02/14/2002 | DE10134944A1 Elektrische Anschlußklemme The electrical terminal |
| 02/14/2002 | DE10044541C1 Producing electrically conducting layers on through hole walls in substrate involves deep drawing plastic foil with metal layer in substrate, removing foil from metal layer with conical tools |
| 02/14/2002 | DE10037819A1 Circuit board manufacture especially for 3-dimensional semiconductor circuits, has circuit boards supported by flush-jointing of first metallic plane, insulating material plane and second metallic plane |
| 02/14/2002 | DE10018020C2 Gehäuse und Verfahren zu dessen Herstellung Housing and method for its production |
| 02/13/2002 | EP1179973A2 Composition for circuit board manufacture |
| 02/13/2002 | EP1179972A2 Hole filling method for a printed wiring board |
| 02/13/2002 | EP1179971A2 Printed circuit board with pins for being connected to electronic part mounted thereon |
| 02/13/2002 | EP1179878A2 Fixing member for fixing and object to be attached to a plate and clamp with the fixing member |
| 02/13/2002 | EP1179875A2 Electrical connector housing |
| 02/13/2002 | EP1179791A2 Check system for wiring structure of printed circuit board |
| 02/13/2002 | EP1179617A1 Apparatus for plating substrate, method for plating substrate, electrolytic processing method, and apparatus thereof |
| 02/13/2002 | EP1179453A2 Junction box |
| 02/13/2002 | EP1179288A1 Manufacturing electronic components in a direct-write process using precision spraying and laser irradiation |
| 02/13/2002 | EP1080615B1 Multiple printed panel for electronics components, and method for constructing bumps, soldering frames, spacers and similar on said multiple printed panel. |
| 02/13/2002 | EP0948815B1 Chip module and manufacturing process |
| 02/13/2002 | CN2476916Y Mechanism for sticking printed circuit |
| 02/13/2002 | CN1336095A Electronic control device |
| 02/13/2002 | CN1336021A A method and a device for manufacturing a roll of items |
| 02/13/2002 | CN1335899A Aqueous dispersion for forming conductive layer, conductive layer, electronic component, circuit board and method for manufacturing the same, and multilayer wiring board and method for manufacturing |
| 02/13/2002 | CN1335898A Electrolytic copper foil with carrier foil and method for manufacturing the same |
| 02/13/2002 | CN1335897A Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil |
| 02/13/2002 | CN1335790A Methods of manufacturing void free resin impregnated webs |
| 02/13/2002 | CN1335745A Multilayer plate and its producing method |
| 02/13/2002 | CN1335744A Modular card and its making process |
| 02/13/2002 | CN1335743A Technological process of making printed circuit board |
| 02/13/2002 | CN1335742A Method for producing severe tolerance imbedded elements for printing circuit board |
| 02/13/2002 | CN1335740A Wiring circuit board with projecture and its producing method |
| 02/13/2002 | CN1335641A Glass substrate processing method and method for producing high frequency circuit |
| 02/13/2002 | CN1335631A Method for producing packed electronic assembly and producing apparatus |
| 02/13/2002 | CN1335530A Liquid crystal display device with flexible circuit board |
| 02/13/2002 | CN1335418A Electronic element, method for producing electronic element and circuit board |
| 02/13/2002 | CN1079174C Electric circuit protective device |
| 02/12/2002 | US6347038 Electronic assemblies with a heat sink, especially for a control module of a motor-vehicle headlight discharge lamp |
| 02/12/2002 | US6346842 Variable delay path circuit |
| 02/12/2002 | US6346772 Wiring substrate and gas discharge display device that includes a dry etched layer wet-etched first or second electrodes |
| 02/12/2002 | US6346750 Resistance-reducing conductive adhesives for attachment of electronic components |
| 02/12/2002 | US6346679 Substrate on which ball grid array type electrical part is mounted and method for mounting ball grid array type electrical part on substrate |
| 02/12/2002 | US6346678 Circuit board and method of manufacturing a circuit board |
| 02/12/2002 | US6346598 Siloxane modified polyimides with methallyl groups |
| 02/12/2002 | US6346505 Cleaning solution for electromaterials and method for using same |
| 02/12/2002 | US6346335 Release layer of nickel or chromium and of nonmetal of chromium oxide, nickel oxide, chromium phosphate or nickel phosphate; peel strength; prevents premature separation; easy removal; printed circuits |
| 02/12/2002 | US6346317 Substrate for ceramic sheets |
| 02/12/2002 | US6346164 Method of vacuum-laminating adhesive film |
| 02/12/2002 | US6346154 Suction plate for holding and supporting electronic circuit boards during printing operation |
| 02/12/2002 | US6345997 CRT receiving socket having insulation rib and monitor having the same |
| 02/12/2002 | US6345991 Printed wiring board for connecting to pins |
| 02/12/2002 | US6345989 Circuit board side interconnect |
| 02/12/2002 | US6345988 Inter-card connection between adjacently positioned expansion cards |
| 02/12/2002 | US6345757 Reflow soldering method |
| 02/12/2002 | US6345718 Method and apparatus for immobilizing solder spheres |
| 02/12/2002 | US6345437 Placing an oxidized copper foil one surface side of the ceramic plate and fixing said oxidized copper foil to the plate by heating the plate and the foil; and heating to 1065-108 degrees c. and then cooling to room temperature. |
| 02/12/2002 | CA2231825C Printed circuit transformer hybrids for rf mixers |
| 02/12/2002 | CA2222703C Process for assembling electronics using microwave irradiation |
| 02/12/2002 | CA2049272C Multiple lamination high density interconnect process and structure employing a variable crosslinking adhesive |
| 02/07/2002 | WO2002011506A2 Vapor chamber with integrated pin array |
| 02/07/2002 | WO2002011505A2 Circuit board protection method and apparatus |
| 02/07/2002 | WO2002011503A1 Method for making a circuitry comprising conductive tracks, chips and micro-vias and use of same for producing printed circuits and multilayer modules with high density of integration |
| 02/07/2002 | WO2002011502A1 Method for contacting a flexible circuit board with a contact partner and arrangement comprising flexible circuit board and contact partner |
| 02/07/2002 | WO2002011500A2 Printed circuit board comprising embedded capacitor and method of forming same |
| 02/07/2002 | WO2002011245A1 System comprising at least two printed circuit boards |
| 02/07/2002 | WO2002011207A2 Electronic assembly comprising substrate with embedded capacitors and methods of manufacture |
| 02/07/2002 | WO2002011202A2 Method and device for producing connection substrates for electronic components |
| 02/07/2002 | WO2002011201A2 Method and device for producing connection substrates for electronic components |
| 02/07/2002 | WO2002011159A1 Pinhole-free dielectric films |
| 02/07/2002 | WO2002010779A1 Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card |
| 02/07/2002 | WO2002009936A1 Lead-free alloys with improved wetting properties |
| 02/07/2002 | WO2002009884A2 Methods for the lithographic deposition of materials containing nanoparticles |
| 02/07/2002 | WO2001084575A8 Printed circuit variable impedance transmission line antenna |
| 02/07/2002 | WO2001081088A3 Apparatus for aligning a flexible circuit on an ink jet printer carriage |
| 02/07/2002 | WO2001079371A3 Method for improving bonding of rigid, thermosetting compositions to hydrophilic surfaces, and the articles formed thereby |
| 02/07/2002 | WO2001078140A3 Chip carrier, relative manufacturing process, and electronic component incorporating such a carrier |
| 02/07/2002 | WO2001041969A3 Switchable wavelength laser-based etched circuit board processing system |
| 02/07/2002 | WO2001029288A3 Conveyorized electroplating device |
| 02/07/2002 | US20020016408 Polyimide silicone resin, its solution composition, and polyimide silicone resin film |
| 02/07/2002 | US20020016096 Method for assembling a circuit board apparatus with pin connectors |
| 02/07/2002 | US20020016095 Spring structure with self-aligned release material |
| 02/07/2002 | US20020016092 High speed and density circular connector for board-to-board interconnection systems |
| 02/07/2002 | US20020016091 Chip socket assembly and chip file assembly for semiconductor chips |
| 02/07/2002 | US20020016090 Method of making a connection to a microelectronic element |
| 02/07/2002 | US20020016064 Method of manufactuing a semiconductor device |
| 02/07/2002 | US20020016018 Method of manufacturing multi-layer printed wiring board |
| 02/07/2002 | US20020015907 Solvent patterning coating layers |
| 02/07/2002 | US20020015832 Composite substance containing metal particles, conductive paste and manufacturing method thereof |
| 02/07/2002 | US20020015800 Production processes of printed substrate, electron-emitting element, electron source and image-forming apparatus |
| 02/07/2002 | US20020015782 Multi-purpose finish for printed wiring boards and method of manufacture of such boards |
| 02/07/2002 | US20020015780 Screen printing; jetting |
| 02/07/2002 | US20020015340 Method and apparatus for memory module circuit interconnection |
| 02/07/2002 | US20020015293 Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board |
| 02/07/2002 | US20020015291 Semiconductor device |
| 02/07/2002 | US20020015290 System comprising at least two printed circuit boards |
| 02/07/2002 | US20020015288 High performance thermal/mechanical interface for fixed-gap references for high heat flux and power semiconductor applications |
| 02/07/2002 | US20020015129 Flat panel display device and manufacturing method thereof |
| 02/07/2002 | US20020015002 Antenna coil for IC card and manufacturing method thereof |
| 02/07/2002 | US20020014949 Chip component |
| 02/07/2002 | US20020014841 Wiring substrate and gas discharge display device |
| 02/07/2002 | US20020014703 Semiconductor flip-chip package and method for the fabrication thereof |
| 02/07/2002 | US20020014691 Multiple line grid array package |