| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/21/2002 | US20020020057 Process for producing an industrial member having throughholes of high aspect ration |
| 02/21/2002 | DE10121774A1 Material for ball-grid arrays comprises a plating layer formed from two metals which are mixed together on a metal material as the base material and a covering layer formed from the metal on the plating layer |
| 02/21/2002 | DE10038508A1 Elektrische Baugruppe und Verfahren zur Herstellung der elektrischen Baugruppe An electrical assembly and methods for making the electrical assembly |
| 02/21/2002 | DE10038313A1 Verfahren und Vorrichtung zur Prüfung von Leiterplatten auf Funktionsfähigkeit Method and apparatus for testing printed circuit boards for functionality |
| 02/21/2002 | DE10037292A1 Verfahren zur Herstellung von Anschlußsubstraten für Halbleiterkomponenten A process for the production of substrates for semiconductor connection components |
| 02/20/2002 | EP1180921A2 Multi-layer circuit board and method of manufacturing the same |
| 02/20/2002 | EP1180920A2 Circuit board and method of manufacturing same |
| 02/20/2002 | EP1180919A2 Method for producing a conductive pattern and method for producing a greensheet lamination body including the same |
| 02/20/2002 | EP1180918A1 Method for dispensing adhesive on a circuit-board carrier member and circuit-board provided thereby |
| 02/20/2002 | EP1180917A2 Copper-alloy foil to be used for laminate sheet |
| 02/20/2002 | EP1180411A1 Lead-free paste for reflow soldering |
| 02/20/2002 | EP1088121B1 Method for metal coating of substrates |
| 02/20/2002 | CN2478313Y Low noise electromagnetic pump soft soldered single/double peak generator |
| 02/20/2002 | CN2478312Y Surface packed electrical connector |
| 02/20/2002 | CN2477301Y Printed circuit board hobbing device able to be re-utilized |
| 02/20/2002 | CN1337145A Multi-layered printed wiring board and prodn. method thereof |
| 02/20/2002 | CN1337144A Article having a circuit soldered with parts and method for recycling wastes of the same |
| 02/20/2002 | CN1336795A Apparatus and method for mounting of components |
| 02/20/2002 | CN1336792A Electronic arrangement equiped with electronic circuit substrate |
| 02/20/2002 | CN1336790A Multi-layer circuit plate and its mfg. method |
| 02/20/2002 | CN1336789A Printed circuit plate and its mfg. method |
| 02/20/2002 | CN1336788A Electrode joint structure and its manufacture |
| 02/20/2002 | CN1336787A Ceramic laminated device |
| 02/20/2002 | CN1336725A Electronic element and its mfg. method |
| 02/20/2002 | CN1336449A Etching agent for copper or copper alloy, micro-etching method with same, and method for mfg. printed circuit plate |
| 02/20/2002 | CN1336394A Aromatic liquid crystal polyester liquid composite |
| 02/20/2002 | CN1336260A Method for working industrial parts having holes with large height/broad ratio |
| 02/20/2002 | CN1079632C Circuit board leveling apparatus |
| 02/20/2002 | CN1079630C Woven glass cloth for printed wiring board, and products made thereby |
| 02/20/2002 | CN1079582C Electronic package with multilever connections |
| 02/20/2002 | CN1079571C Variable voltage protection structures and method for making same |
| 02/19/2002 | US6348844 Transition between symmetric stripline and asymmetric stripline |
| 02/19/2002 | US6348740 Bump structure with dopants |
| 02/19/2002 | US6348737 Metallic interlocking structure |
| 02/19/2002 | US6348662 Circuit board assembly |
| 02/19/2002 | US6348661 Corrosion protection for wireless flexure |
| 02/19/2002 | US6348659 Resilient electrical interconnects having non-uniform cross-section |
| 02/19/2002 | US6348523 Curable composition |
| 02/19/2002 | US6348404 Wiring forming method |
| 02/19/2002 | US6348401 Method of fabricating solder bumps with high coplanarity for flip-chip application |
| 02/19/2002 | US6348295 Methods for manufacturing electronic and electromechanical elements and devices by thin-film deposition and imaging |
| 02/19/2002 | US6348240 Methods for and products of modification and metallization of oxidizable surfaces, including diamond surfaces, by plasma oxidation |
| 02/19/2002 | US6348239 Depositing amorphous film of metal precursor complex on substrate, irradiating film to cause metal complex to undergo reaction which transforms metal complex into metal containing material adherent to substrate |
| 02/19/2002 | US6348233 Minimizing formation of cracks at junctions between vias and lines in line-to-via connections on a substrate; each line has a base section and a cap, each cap is positioned over a via in the substrate, cap's diameter is greater than via's |
| 02/19/2002 | US6348142 While minimizing the amount of surface area of the substrate which is occupied by tie bars and associated conductive elements, particular utility in the fabrication of ball grid array (bga) semiconductor device packages |
| 02/19/2002 | US6348125 Removal of copper oxides from integrated interconnects |
| 02/19/2002 | US6347947 Method and apparatus for protecting and strengthening electrical contact interfaces |
| 02/19/2002 | US6347946 Pin grid array socket |
| 02/19/2002 | US6347945 Method and device for improving electrical contact of spring connectors |
| 02/19/2002 | US6347901 Solder interconnect techniques |
| 02/19/2002 | US6347735 Method of manufacture for embedded processing subsystem module |
| 02/19/2002 | US6347734 Methods and apparatus for installing a module on a circuit board using heating and cooling techniques |
| 02/19/2002 | US6347732 Circuit board component retention |
| 02/19/2002 | US6347584 Method of manufacturing electronic components using intaglio plate having dual releasing layers |
| 02/19/2002 | US6347583 Screen inspecting apparatus, and screen printing machine having device for judging if openings are clogged |
| 02/19/2002 | CA2097410C Recording medium cassette and a recording/reproducing apparatus |
| 02/19/2002 | CA2051266C Metal-film laminate resistant to delamination |
| 02/19/2002 | CA1341340C Electromagnetic radiation absorptive coating composition containing metal coated microspheres |
| 02/14/2002 | WO2002013586A1 Adhesive bonding of printed circuit boards to heat sinks |
| 02/14/2002 | WO2002013585A2 Electrical assembly and method for producing said electrical assembly |
| 02/14/2002 | WO2002013267A1 Power module and power module with heat sink |
| 02/14/2002 | WO2002013256A1 Method of securing solder balls and any components fixed to one and the same side of a substrate |
| 02/14/2002 | WO2002013254A2 Electroplating multi-trace circuit board substrates using single tie bar |
| 02/14/2002 | WO2002013205A1 Conductive fine particles, method for plating fine particles, and substrate structural body |
| 02/14/2002 | WO2002013189A1 Bonding pad of suspension circuit |
| 02/14/2002 | WO2002012911A1 Method and device for testing the operativeness of printed circuit boards |
| 02/14/2002 | WO2002012114A2 Ceramic microelectromechanical structure |
| 02/14/2002 | WO2002011938A1 Method for contacting electronic circuits, and electronic circuit |
| 02/14/2002 | WO2002011902A1 Platable dielectric materials for microvia technology |
| 02/14/2002 | WO2001078132A3 Method for transferring semiconductor device layers to different substrates |
| 02/14/2002 | WO2001058765A3 Method and apparatus of immobilizing solder spheres |
| 02/14/2002 | US20020019970 System for checking wiring configuration of printed circuit board |
| 02/14/2002 | US20020019680 Method for controlling screen printer |
| 02/14/2002 | US20020019155 Printed circuit board with pins for being connected to electronic part mounted thereon |
| 02/14/2002 | US20020019154 Portable electronic apparatus having external connector fixed at internal circuit board |
| 02/14/2002 | US20020019153 Connecting devices and method for interconnecting circuit components |
| 02/14/2002 | US20020019080 Method and apparatus for reducing BGA warpage caused by encapsulation |
| 02/14/2002 | US20020019077 Lead-free (Pb-free); forming an electrical device by connecting a substrate with a semiconductor device having a lead on which an tin-bismuth alloy layer is formed using bismuth silver tin alloy solder |
| 02/14/2002 | US20020018896 Composite metallic ultrafine particles and process for producing the same |
| 02/14/2002 | US20020018880 Stamping foils for use in making printed circuits and radio frequency antennas |
| 02/14/2002 | US20020018861 Methods for the lithographic deposition of materials containing nanoparticles |
| 02/14/2002 | US20020018859 Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas |
| 02/14/2002 | US20020018844 Soldering method and soldered joint |
| 02/14/2002 | US20020018635 Opto-electronic device having staked connection between parts to prevent differential thermal expansion |
| 02/14/2002 | US20020018625 Optical wavelength division multiplexer and/or demultiplexer mounted in a pluggable module |
| 02/14/2002 | US20020018495 Laser device and method of controlling Q-switched frequency converted laser, process and system using laser device |
| 02/14/2002 | US20020018274 Optical scanning device |
| 02/14/2002 | US20020018169 Connection structure of display device with a plurality of IC chips mounted thereon and wiring board |
| 02/14/2002 | US20020017963 Multilayer wiring board embedded with transmission line conductor |
| 02/14/2002 | US20020017915 Probe card, probe card restoring method, and probe card manufacturing method |
| 02/14/2002 | US20020017907 Printed circuit board wiring structure checkup system |
| 02/14/2002 | US20020017739 Hole filling method for a printed wiring board |
| 02/14/2002 | US20020017721 Array structure of solder balls able to control collapse |
| 02/14/2002 | US20020017553 Structure of solder bumps with improved coplanarity and method of forming solder bumps with improved coplanarity |
| 02/14/2002 | US20020017511 Configured-hole high-speed drilling system for micro-via pattern formation, and resulting structure |
| 02/14/2002 | US20020017399 Coaxial via hole and process of fabricating the same |
| 02/14/2002 | US20020017398 Method for transforming a substrate with edge contacts into a ball grid array, ball grid array manufactured according to this method, and flexible wiring for the transformation of a substrate with edge contacts into a ball grid array |
| 02/14/2002 | US20020017397 Vialess printed circuit board |
| 02/14/2002 | US20020017396 Method of forming a non-continuous conductive layer for laminated substrates |
| 02/14/2002 | US20020017395 Copper foil for printed circuit boards and its surface treatment method |