| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/27/2002 | CN2479710Y Packaging device of card |
| 02/27/2002 | CN2479709Y Multi-layer circuit board |
| 02/27/2002 | CN1338195A Flexible microsystem and building techniques |
| 02/27/2002 | CN1338119A Apparatus and method for an integrated circuit having high Q reactive components |
| 02/27/2002 | CN1338117A Multilayer circuit board and semiconductor device |
| 02/27/2002 | CN1337975A Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 02/27/2002 | CN1337905A Thermal transfer element for forming multi-layer devices |
| 02/27/2002 | CN1337845A Printed circuit board forming and hole drilling process |
| 02/27/2002 | CN1337844A Surface treatment method and apparatus for printed circuit board |
| 02/27/2002 | CN1337843A Master-board device for module mounting |
| 02/27/2002 | CN1337475A Method for making electrodeposited cooper foil and electrodeposited cooper foil |
| 02/27/2002 | CN1337312A Flexible metal laminated body and producing method thereof |
| 02/27/2002 | CN1337298A Scriber wheel for brittle base-board |
| 02/27/2002 | CN1080082C 印刷电路板 A printed circuit board |
| 02/27/2002 | CN1080004C Electric member having leads |
| 02/27/2002 | CN1079958C Stable ionomeric photoresist emulsion and process of preparation and use thereof |
| 02/26/2002 | US6351393 Electronic package for electronic components and method of making same |
| 02/26/2002 | US6351386 Component shim for mounting a component on a heat spreader |
| 02/26/2002 | US6351351 Magnetic head suspension |
| 02/26/2002 | US6351195 High frequency circuit device, antenna-sharing device, and communication apparatus having spaced apart ground electrodes |
| 02/26/2002 | US6351194 Electronic component utilizing face-down mounting |
| 02/26/2002 | US6351031 Semiconductor device and method for manufacturing substrate of the same |
| 02/26/2002 | US6351026 Multilayered wiring structure and method of manufacturing the same |
| 02/26/2002 | US6350957 Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board |
| 02/26/2002 | US6350953 Method for potting a populated assembly using an anti-vibration potting compound, populated assembly and controller having a populated assembly |
| 02/26/2002 | US6350792 Radiation-curable compositions and cured articles |
| 02/26/2002 | US6350669 Method of bonding ball grid array package to circuit board without causing package collapse |
| 02/26/2002 | US6350668 Low cost chip size package and method of fabricating the same |
| 02/26/2002 | US6350560 Rinse composition |
| 02/26/2002 | US6350555 Direct write imaging medium |
| 02/26/2002 | US6350494 Controlling drops of metal, raster scanning and blanking |
| 02/26/2002 | US6350405 Drops of liquid metal are emitted from an acoustic device through an inert gas; the inert gas prevents formation of an oxide skin; drops can form solder bumps, circuit traces, or a three-dimensional device |
| 02/26/2002 | US6350387 Multilayer combined rigid/flex printed circuit board containing flexible soldermask |
| 02/26/2002 | US6350365 Method of producing multilayer circuit board |
| 02/26/2002 | US6350364 Method for improvement of planarity of electroplated copper |
| 02/26/2002 | US6350362 Method and device for regulating the concentration of substances in electrolytes |
| 02/26/2002 | US6350360 Method of fabricating a 3-dimensional tool master |
| 02/26/2002 | US6350334 Method of manufacturing a multi-layered ceramic substrate |
| 02/26/2002 | US6350134 Electrical connector having triad contact groups arranged in an alternating inverted sequence |
| 02/26/2002 | US6349908 Standoff assembly and method for supporting an electrical component |
| 02/26/2002 | US6349872 Packaging method |
| 02/26/2002 | US6349871 Process for reworking circuit boards |
| 02/26/2002 | US6349861 Jet solder feeding device and soldering method |
| 02/26/2002 | US6349456 Method of manufacturing photodefined integral capacitor with self-aligned dielectric and electrodes |
| 02/26/2002 | CA2266607C Photoimageable composition having improved photoinitiator system |
| 02/26/2002 | CA2248497C Composition and method for stripping solder and tin from printed circuit boards |
| 02/21/2002 | WO2002015659A1 Method and device for the fixing of electronic circuits |
| 02/21/2002 | WO2002015654A1 Mounting method and mounting device |
| 02/21/2002 | WO2002015653A1 Compliant interconnect assembly |
| 02/21/2002 | WO2002015652A1 Flexible wiring board for front-back connection |
| 02/21/2002 | WO2002015423A1 Transmitter and receiver module |
| 02/21/2002 | WO2002015266A2 Direct build-up layer on an encapsulated die package |
| 02/21/2002 | WO2002014404A2 Polyarylether-polyetherimide compositions |
| 02/21/2002 | WO2002014010A1 Solder ball delivery and reflow apparatus and method |
| 02/21/2002 | WO2002014009A1 Container device with adjustable volume for immobilizing solder shperes and method thereof |
| 02/21/2002 | WO2002014008A1 Soldering method for mounting electric components |
| 02/21/2002 | WO2001069987A3 Printed circuit board assembly with improved thermal performance |
| 02/21/2002 | WO2001050821A3 Conditioning of through holes and glass |
| 02/21/2002 | WO2000070127A9 Method and apparatus related to an electroplated structure |
| 02/21/2002 | US20020022388 Electrical connector housing |
| 02/21/2002 | US20020022385 Connection structure and connection method of both circuit boards |
| 02/21/2002 | US20020022384 Conductive adhesive having a palladium matrix interface between two metal surfaces |
| 02/21/2002 | US20020022383 Compression connector |
| 02/21/2002 | US20020022194 Photosensitive resin composition and photoresist ink for manufacturing printed wiring boards |
| 02/21/2002 | US20020022191 Material and method for making an electroconductive pattern |
| 02/21/2002 | US20020022138 Process for producing heat-resistant resin film having metallic thin film, process for producing endless belt, endless belt, and apparatus for forming image |
| 02/21/2002 | US20020022110 Printed circuit board having inductive vias |
| 02/21/2002 | US20020022000 Mixture of solder material and hydrogen storage material |
| 02/21/2002 | US20020021561 Aggregate of electronic components and mounting method thereof |
| 02/21/2002 | US20020021556 Vapor chamber with integrated pin array |
| 02/21/2002 | US20020021532 Fiber reinforced laminate actuator arm for disc drives |
| 02/21/2002 | US20020021204 Method and component for forming an embedded resistor in a multi-layer printed circuit |
| 02/21/2002 | US20020020956 Fixing member for fixing an object to be attached to a plate and clamp with fixing member |
| 02/21/2002 | US20020020929 Semiconductor device and a method of manufacturing the same |
| 02/21/2002 | US20020020927 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer |
| 02/21/2002 | US20020020925 Semiconductor module and producing method therefor |
| 02/21/2002 | US20020020914 Method and apparatus providing redundancy for fabricating highly reliable memory modules |
| 02/21/2002 | US20020020910 Semiconductor device including bonding wire bonded to electronic part and method for manufacturing the same |
| 02/21/2002 | US20020020901 Semiconductor device and method for production thereof |
| 02/21/2002 | US20020020898 Microelectronic substrates with integrated devices |
| 02/21/2002 | US20020020897 Thermally conductive substrate, thermally conductive substrate manufacturing method and power module |
| 02/21/2002 | US20020020896 Electronic component device and method of manufacturing the same |
| 02/21/2002 | US20020020811 Semiconductor parts and semiconductor mounting apparatus |
| 02/21/2002 | US20020020695 Reflow soldering apparatus |
| 02/21/2002 | US20020020627 Filling a metal such as copper in fine interconnection pattern recesses on a semiconductor |
| 02/21/2002 | US20020020620 Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with |
| 02/21/2002 | US20020020557 Printed wiring board, and method and apparatus for manufacturing the same |
| 02/21/2002 | US20020020556 Printed wiring board, and method and apparatus for manufactujring the same |
| 02/21/2002 | US20020020555 Printed wiring board and method of producing the same |
| 02/21/2002 | US20020020553 Method and component for forming an embedded resistor in a multi-layer printed circuit |
| 02/21/2002 | US20020020552 Circuit board and a method for making the same |
| 02/21/2002 | US20020020551 Controlled-shaped solder reservoirs for increasing the volume of solder bumps |
| 02/21/2002 | US20020020550 Method for dispensing adhesive on a circuit-board carrier member and circuit-board provided thereby |
| 02/21/2002 | US20020020549 Component for use in forming printed circuit boards |
| 02/21/2002 | US20020020548 Multi-layer circuit board and method of manufacturing same |
| 02/21/2002 | US20020020491 Joining with electronic circuit using printable anisotropic conductive adhesive or paste; radio frequency identification devices or smart cards |
| 02/21/2002 | US20020020346 Dual track stenciling system with solder gathering head |
| 02/21/2002 | US20020020310 Screen-printing plate, manufacturing method of laminated- ceramic electronic devices, and laminated-ceramic electronic device manufactured by the method |
| 02/21/2002 | US20020020309 Hot pressing apparatus |
| 02/21/2002 | US20020020058 Method of mounting a BGA |