| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/06/2002 | CN1080530C Miniature speeching body |
| 03/05/2002 | US6353540 Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board. |
| 03/05/2002 | US6353420 Wireless article including a plural-turn loop antenna |
| 03/05/2002 | US6353202 Apparatus and method for producing a chip-substrate connection |
| 03/05/2002 | US6353191 Column grid array connector |
| 03/05/2002 | US6353189 Wiring board, wiring board fabrication method, and semiconductor package |
| 03/05/2002 | US6353188 Printed circuit assembly with flexible support |
| 03/05/2002 | US6353182 Proper choice of the encapsulant volumetric CTE for different PGBA substrates |
| 03/05/2002 | US6352925 Method of making electrical conductor system for semiconductor device |
| 03/05/2002 | US6352915 Method for manufacturing semiconductor package containing cylindrical type bump grid array |
| 03/05/2002 | US6352875 Photoelectric conversion apparatus and method of manufacturing the same |
| 03/05/2002 | US6352816 Printing and PCB members and methods for producing same |
| 03/05/2002 | US6352775 Conductive, multilayer-structured resin particles and anisotropic conductive adhesives using the same |
| 03/05/2002 | US6352743 Semiconductor copper band pad surface protection |
| 03/05/2002 | US6352437 Solder ball terminal |
| 03/05/2002 | US6352436 Self retained pressure connection |
| 03/05/2002 | US6352435 Chip socket assembly and chip file assembly for semiconductor chips |
| 03/05/2002 | US6352423 Apparatus for underfilling semiconductor devices |
| 03/05/2002 | US6352189 Ball suction head |
| 03/05/2002 | US6352153 Solder ball container |
| 03/05/2002 | US6352084 Substrate treatment device |
| 03/05/2002 | US6352026 Screen printing apparatus for printing layers having different thicknesses |
| 03/05/2002 | US6352025 Solder printing apparatus |
| 03/05/2002 | US6352014 Method for making punches using multi-layer ceramic technology |
| 03/05/2002 | US6351885 Method of making conductive bump on wiring board |
| 03/05/2002 | US6351884 Process for manufacturing printed circuit boards and process for connecting wires thereto |
| 03/05/2002 | US6351880 Method of forming multi-chip module having an integral capacitor element |
| 03/05/2002 | US6351871 Aqueous quaternary ammonium hydroxide as a screening mask cleaner |
| 03/05/2002 | CA2238778C Hardenable photoimageable compositions |
| 03/01/2002 | CA2317233A1 Ultrasonically assisted plating bath for vias metallization in printed circuit board manufacturing |
| 02/28/2002 | WO2002017695A1 Method of film laminating |
| 02/28/2002 | WO2002017694A1 Installation device |
| 02/28/2002 | WO2002017693A1 Installation substrate, method of mounting installation substrate, and bulb socket using installation substrate |
| 02/28/2002 | WO2002017502A1 Radio transmitting/receiving device |
| 02/28/2002 | WO2002017439A1 Controller with helical spring contacts |
| 02/28/2002 | WO2002017438A1 Interposer for use in electronic packages |
| 02/28/2002 | WO2002017396A1 Substrate for manufacturing a semiconductor device with three element alloy |
| 02/28/2002 | WO2002017387A2 Conductive material patterning methods |
| 02/28/2002 | WO2002017380A2 Selective flux deposition |
| 02/28/2002 | WO2002017378A1 Mounting method and device |
| 02/28/2002 | WO2002016524A1 Process for improving polymer to metal adhesion |
| 02/28/2002 | WO2002016473A1 Polyimides for high-frequency applications |
| 02/28/2002 | WO2002016135A1 Method and apparatus for dispensing viscous material |
| 02/28/2002 | WO2002016129A1 Copper-clad laminate |
| 02/28/2002 | WO2002016068A2 Controlled and programmed deposition of flux on a flip-chip die by spraying |
| 02/28/2002 | WO2001076808A3 A method and system for laser drilling |
| 02/28/2002 | WO2001075970A3 Element and method for connecting constituents of an electronic assembly |
| 02/28/2002 | WO2001070843A3 High molecular weight epoxy resin and resinous composition for printed circuit board |
| 02/28/2002 | WO2001063668A3 Method of forming lead-free solder alloys by electrochemical deposition process |
| 02/28/2002 | US20020025699 Electrical connector housing |
| 02/28/2002 | US20020025697 Connector jack attaching structure and electronic camera |
| 02/28/2002 | US20020025668 Wiring pattern formation method and original substrate used for the method |
| 02/28/2002 | US20020025603 Method for mounting an electronic component |
| 02/28/2002 | US20020025599 Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball |
| 02/28/2002 | US20020025439 Dielectric ceramic composition and multi layered ceramic substrate |
| 02/28/2002 | US20020024802 Connection structure for display module and printed substrate, semiconductor device, display module, and elecronic component |
| 02/28/2002 | US20020024801 Integrated circuit pakage substrate integrating with decoupling capacitor |
| 02/28/2002 | US20020024642 Two-sided substrate imaging using single-approach projection optics |
| 02/28/2002 | US20020024302 Plasma display panel with an auxiliary bonding pad |
| 02/28/2002 | US20020024138 Wiring board for high dense mounting and method of producing the same |
| 02/28/2002 | US20020024137 Method of securing solder balls and any components fixed to one and the same side of a substrate |
| 02/28/2002 | US20020024136 Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad |
| 02/28/2002 | US20020024127 Semiconductor device and manufacture method of that |
| 02/28/2002 | US20020024025 Semiconductor parts and semiconductor mounting apparatus |
| 02/28/2002 | US20020023946 Method of an apparatus for heating a substrate |
| 02/28/2002 | US20020023945 Low temperature solder column attach by injection molded solder and structure formed |
| 02/28/2002 | US20020023906 Method of producing through-hole in aromatic polyimide film |
| 02/28/2002 | US20020023895 Multilayer circuit board and method of manufacturing the same |
| 02/28/2002 | US20020023844 A one-step, process for producing electrolytic copper foil having a dual-layer copper bond-enhancing treatment electrodeposited on the matte side of the foil, employs two super anodes on a rotating drum cathode to deposit treatment |
| 02/28/2002 | US20020023778 Printed wiring board having via and method of manufacturing the same |
| 02/28/2002 | US20020023777 Printed circuit board and method for producing the same |
| 02/28/2002 | US20020023776 Enhanced surface laminar circuit board |
| 02/28/2002 | US20020023775 Sequentially processed circuitry |
| 02/28/2002 | US20020023774 Singulation methods and substrates for use with same |
| 02/28/2002 | US20020023773 Method for manufacturing raised electrical contact patten of controlled geometry |
| 02/28/2002 | US20020023554 Method and stencil for extruding material on a substrate |
| 02/28/2002 | US20020023344 Printed circuit board manufacturing method |
| 02/28/2002 | US20020023343 Method of manufacturing multi-layer printed wiring board |
| 02/28/2002 | US20020023342 Electronic device and a method of manufacturing the same |
| 02/28/2002 | US20020023307 Dust remover |
| 02/28/2002 | DE10131225A1 Contact of SMT electronic component, such as pluggable connector, has surface of at least one section of contact modified |
| 02/28/2002 | DE10100823C1 Sealed chamber for electronic control unit integrated into vehicle engine or gearbox, is based on dished panel with sealed, flexible printed circuit lead-in and adhered covering |
| 02/28/2002 | DE10040627A1 Method for manufacture of multi-layer circuit boards e.g. for computer mother boards, involves using inductive absorbing regions around the edge of board |
| 02/28/2002 | DE10039558A1 Device for spray treatment of printed circuit boards uses conveyor devices to convey printed circuit boards on a horizontally aligned printed circuit board level and a nozzle device for spraying the top side of printed circuit boards. |
| 02/28/2002 | DE10038510A1 Verfahren zur Kontaktierung elektronischer Schaltungen und elektronische Schaltung A method for contacting electronic circuits and electronic circuit |
| 02/28/2002 | CA2420540A1 Process for improving polymer to metal adhesion |
| 02/27/2002 | EP1182919A2 Board for measuring offset of component mounting apparatus, and method for measuring offset of component mounting apparatus |
| 02/27/2002 | EP1182913A1 High speed circuit board interconnection |
| 02/27/2002 | EP1182768A2 Power converter assembly |
| 02/27/2002 | EP1182737A1 Electrical connector housing |
| 02/27/2002 | EP1182279A1 A holding device |
| 02/27/2002 | EP1182278A2 Manufacturing method of electrodeposited copper foil and electrodeposited copper foil |
| 02/27/2002 | EP1181848A1 Ultraviolet curable silver composition and related method |
| 02/27/2002 | EP1181569A1 A microvia inspection system |
| 02/27/2002 | EP1181566A1 Testing fastenings of printed circuit board |
| 02/27/2002 | EP1181535A1 Method and apparatus for inspecting solder paste deposits on substrates |
| 02/27/2002 | EP1181325A1 Compositions for making ene-thiol elastomers |
| 02/27/2002 | EP0728166B1 Pressure sensitive adhesives |
| 02/27/2002 | CN2479712Y Sectional glued flexible printed circuit board |
| 02/27/2002 | CN2479711Y Anti-fouling device of 'Bantian' machine |