| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/12/2002 | US6354845 Apparatus and method for connecting a plurality of electrical circuits borne upon a plurality of substrates |
| 03/12/2002 | US6354844 Land grid array alignment and engagement design |
| 03/12/2002 | US6354484 Process for producing a metal-ceramic composite substrate |
| 03/12/2002 | US6354481 Compact reflow and cleaning apparatus |
| 03/12/2002 | US6354200 Mask for screen printing, the method for producing same and circuit board produced by screen printing with such mask |
| 03/12/2002 | US6354199 Screen printing method and holding table for plate to be printed |
| 03/12/2002 | US6354000 Method of creating an electrical interconnect device bearing an array of electrical contact pads |
| 03/12/2002 | US6353999 Method of making mechanical-laser structure |
| 03/12/2002 | US6353998 Method for clamping a circuit component to a printed circuit board before soldering |
| 03/12/2002 | US6353997 Layer build-up method for manufacturing multi-layer board |
| 03/07/2002 | WO2002019784A1 Sequentially processed circuitry |
| 03/07/2002 | WO2002019783A1 Circuit board unit and method of manufacture thereof |
| 03/07/2002 | WO2002019782A1 Collective method for flush filling of through holes in a substrate |
| 03/07/2002 | WO2002019430A2 Hybrid substrate with embedded capacitors and methods of manufacture |
| 03/07/2002 | WO2002019375A1 Device, set and method for carrying a gas or a liquid to a surface through a tube |
| 03/07/2002 | WO2002019349A1 Method for producing a large-mass ohmic resistor for protecting electronic assemblies from surges, and an electronic assembly |
| 03/07/2002 | WO2002018313A1 Oxetane-modified compounds and photocuring compounds derived therefrom, processes for preparation of both and curing compositions contaning the photocuring compounds |
| 03/07/2002 | WO2002018080A1 Metal colloidal solution composition and conductor or ink for forming semiconductor pattern comprising it and method for forming conductor or semiconductor pattern |
| 03/07/2002 | WO2001065294A3 Apparatus and packaging method to assemble optical modules to a common substrate with adjustable plugs |
| 03/07/2002 | WO2001059185A3 Pre-plate treating system |
| 03/07/2002 | WO2001054232A3 Flexible compliant interconnect assembly |
| 03/07/2002 | WO2001029288B1 Conveyorized electroplating device |
| 03/07/2002 | US20020028601 Jack connector |
| 03/07/2002 | US20020028599 Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials |
| 03/07/2002 | US20020028596 Mounting pin and mounting device |
| 03/07/2002 | US20020028595 Method for assembling integral type electronic component and integral type electronic component |
| 03/07/2002 | US20020028591 Electrical connection box for a vehicle |
| 03/07/2002 | US20020028590 Junction box |
| 03/07/2002 | US20020028534 Deflectable interconnect |
| 03/07/2002 | US20020028530 High-frequency module and manufacturing method of the same |
| 03/07/2002 | US20020028525 Method for manufacturing circuit devices |
| 03/07/2002 | US20020028410 Process for patterning non-photoimagable ceramic tape |
| 03/07/2002 | US20020028327 Conductive polymer interconnection configurations |
| 03/07/2002 | US20020028293 Liquid crystal polymers for flexible circuits |
| 03/07/2002 | US20020028284 Method to embed passive components |
| 03/07/2002 | US20020027763 Floating plate capacitor with extremely wide band low impedance |
| 03/07/2002 | US20020027760 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 03/07/2002 | US20020027654 Microvia inspection system |
| 03/07/2002 | US20020027634 Liquid crystal display device having a flexible circuit board |
| 03/07/2002 | US20020027629 Liquid crystal display panel and a substrate therefor |
| 03/07/2002 | US20020027531 Circuit module |
| 03/07/2002 | US20020027294 Electrical component assembly and method of fabrication |
| 03/07/2002 | US20020027282 Composite monolithic electronic component |
| 03/07/2002 | US20020027277 Deflectable interconnect |
| 03/07/2002 | US20020027276 Circuit device and method of manufacturing the same |
| 03/07/2002 | US20020027265 Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame |
| 03/07/2002 | US20020027129 Method for introducing plated-through holes into an electrically insulating base material having a metal layer on each side |
| 03/07/2002 | US20020027127 Method of manufacturing wireless suspension blank |
| 03/07/2002 | US20020027071 Inflatable compliant bladder assembly |
| 03/07/2002 | US20020027022 Front-and-back electrically conductive substrate and method for manufacturing same |
| 03/07/2002 | US20020027021 Printed circuit board with reduced crosstalk noise and method of forming wiring lines on a board to form such a printed circuit board |
| 03/07/2002 | US20020027020 Through-hole structure and printed circuit board including the through-hole structure |
| 03/07/2002 | US20020027018 Insulative ceramic compact |
| 03/07/2002 | US20020027016 Manufacture of dendrites and their use |
| 03/07/2002 | US20020027011 Multi-chip module made of a low temperature co-fired ceramic and mounting method thereof |
| 03/07/2002 | US20020026980 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same |
| 03/07/2002 | US20020026978 Multilayer ceramic substrate and manufacturing method therefor |
| 03/07/2002 | US20020026876 Printing of a conductive coating on an electric unit |
| 03/07/2002 | US20020026709 Manufacture of a wiring loom |
| 03/07/2002 | US20020026703 Method for mounting parts, and IC card and manufacturing method thereof |
| 03/07/2002 | DE10139111A1 Verfahren für das Verbinden eines leitfähigen Klebers und einer Elektrode sowie einer verbundenen Struktur A method of bonding a conductive adhesive and an electrode as well as a connected structure |
| 03/07/2002 | DE10133712A1 Soldering method for soldering component to PCB, involves soldering elements of component and contacts of component onto PCB using different temperatures |
| 03/07/2002 | DE10041872A1 Production of substrates used for electronic circuits comprises electroplating copper layers on a support and processing to leave circuit lines |
| 03/07/2002 | DE10039927A1 Housing for surface mounted device (SMD) component, has heat slug joined to molded body for supply and removal of heat |
| 03/07/2002 | DE10038330A1 Lötverfahren zur Befestigung elektrischer Bauelemente Soldering for mounting electrical components |
| 03/07/2002 | DE10037818A1 Process for structuring unburned layers used in high frequency switches comprises preparing a layer succession of two layers, and structuring at least one of the layers on the outer side of the succession using a photosensitive layer |
| 03/07/2002 | DE10028184A1 Vorrichtung zum Verbindung von elektrischen Leitern Device for connection of electrical conductors |
| 03/06/2002 | EP1185156A1 Device for transferring/holding sheetlike member and its method |
| 03/06/2002 | EP1185153A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 03/06/2002 | EP1185152A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 03/06/2002 | EP1185151A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 03/06/2002 | EP1185150A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 03/06/2002 | EP1185057A2 Connection structure for connecting a display module and a printed substrate by using a semiconductor device |
| 03/06/2002 | EP1184979A2 Radio frequency module parts including surface elastic wave elements and manufacturing method thereof |
| 03/06/2002 | EP1184904A2 Substrate for manufacturing a semiconductor device with three element alloy |
| 03/06/2002 | EP1184898A1 Method and apparatus for forming thin film of metal |
| 03/06/2002 | EP1184880A2 Conductive adhesive and packaging structure using the same |
| 03/06/2002 | EP1184398A1 Oligomer for media to entrap microorganism, oligomer-polymerized hydrous gel, and oligomer-polymerized hydrous gel entrapping microrganism |
| 03/06/2002 | EP1184165A1 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil |
| 03/06/2002 | EP1184131A1 Workholder system for a drilling machine, in particular for printed circuit boards |
| 03/06/2002 | EP1183916A1 Sandwich-structured intelligent power module |
| 03/06/2002 | EP1183751A1 Rf switch |
| 03/06/2002 | EP1183462A1 Integrated powertrain control system for large engines |
| 03/06/2002 | EP1112676B1 Method and device for processing substrates |
| 03/06/2002 | EP1015220A4 Injection molding encapsulation for an electronic device directly onto a substrate |
| 03/06/2002 | EP0993677B1 Thermal release for fixing on a circuit substrate |
| 03/06/2002 | EP0902977B1 Surface mount package with heat transfer feature |
| 03/06/2002 | EP0876195B1 Method of filtering the organic solutions arising in the production of circuit boards |
| 03/06/2002 | CN2481114Y Inner base board fastener for printed circuit board |
| 03/06/2002 | CN2481113Y Tin-soldering machine for electric circuit board |
| 03/06/2002 | CN1339244A Method and system for processing metal-cold laminate for printed-circuit board |
| 03/06/2002 | CN1339174A Electronic parts mounting method and device therefor |
| 03/06/2002 | CN1339055A Adhesive, electrode-connecting structure, and method of connecting electrodes |
| 03/06/2002 | CN1339049A Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module |
| 03/06/2002 | CN1338893A Liquid for reducing copper oxides and process thereof |
| 03/06/2002 | CN1338892A Solder ball releaser |
| 03/06/2002 | CN1338891A Process for preparing thin EBGA substrate |
| 03/06/2002 | CN1338890A Electronic elements and manufacture thereof |
| 03/06/2002 | CN1338889A Multilayer printed circuit board and manufacture thereof |
| 03/06/2002 | CN1338880A Photoelectric device and electronic apparatus |