Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2002
03/14/2002US20020030268 Hybrid integrated circuit device
03/14/2002US20020030266 Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument
03/14/2002US20020030256 Memory card
03/14/2002US20020030250 Thick film millimeter wave transceiver module
03/14/2002US20020030178 Etching solutions and processes for manufacturing flexible wiring boards
03/14/2002US20020030036 Circuit having bus bars and junction box containing the circuit
03/14/2002US20020029961 Electro-chemical deposition system
03/14/2002US20020029906 Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board
03/14/2002US20020029905 Method for manufacturing modular board
03/14/2002US20020029904 Printed circuit board with smd components
03/14/2002US20020029903 Adapter for a ball grid array device
03/14/2002US20020029902 Microelectronic assemblies having solder-wettable pads and conductive elements
03/14/2002US20020029901 Micro grid array solder interconnection structure with solder columns for second level packaging joining a module and printed circuit board
03/14/2002US20020029900 Synthetic resin capping layer on a printed circuit
03/14/2002US20020029875 Electronic apparatus provided with an electronic circuit substrate
03/14/2002US20020029838 Multilayered board and method for fabricating the same
03/14/2002US20020029837 Manufacturing apparatus for manufacturing electronic monolithic ceramic components
03/14/2002US20020029704 Screen printing paste, screen printing method, and baked thick film body
03/14/2002US20020029670 Gang punch tool assembly
03/14/2002US20020029659 Directing capillary stream of molten metal from orifice, wherein droplets form from stream due to capillary stream break-up; imparting electrostatic charge to droplets; deflecting droplets by directing through electric field
03/14/2002US20020029486 Board for measuring offset of component mounting apparatus, and method for measuring offset of component mounting apparatus
03/14/2002DE10042764A1 Verfahren zur Herstellung eines massereichen ohmschen Widerstands und elektronische Baueinheit Process for the preparation of a massive ohmic resistor and electronic assembly
03/14/2002DE10042122A1 Process for forming high copper adhesive strength on dielectric layers structured by a laser comprises applying a dielectric layer on a circuit board, bringing to a specified viscosity, and irradiating the dielectric layer with particles
03/14/2002DE10042098A1 Gasversorgung für Additive Lithographie Gas supply for additives lithography
03/14/2002DE10040335A1 Cleaning method for electronic components such as circuit boards contaminated with solder paste or adhesive in production process, using dry ice particle beam
03/14/2002DE10036900A1 Verfahren zur Kontaktierung einer flexiblen Leiterplatte mit einem Kontaktpartner und Anordnung aus flexibler Leiterplatte und Kontaktpartner Method for contacting a flexible circuit board with a contact partner and assembly of flexible printed circuit board and Partners
03/14/2002DE10007642C2 Verfahren zum Trennen von Substraten im Nutzenformat mit vorgegebenen Sollbruchstellen A method of separating substrates in the panel format with predetermined breaking points
03/13/2002EP1187523A2 High-frequency module and manufacturing method of the same
03/13/2002EP1187521A1 Process for manufacturing a supporting board for electronic components
03/13/2002EP1187520A2 Electrical circuit board and a method for making the same
03/13/2002EP1187519A2 Electrical circuit board and a method for making the same
03/13/2002EP1187518A2 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure
03/13/2002EP1187517A2 Metal stencils
03/13/2002EP1187516A2 Lubricant sheet for making hole and method of making hole with drill
03/13/2002EP1187515A2 Process and apparatus for treating objects, especially circuit boards
03/13/2002EP1187514A2 Printed wiring board
03/13/2002EP1187320A2 Method for manufacturing radio frequency module components with surface acoustic wave element
03/13/2002EP1187260A1 Terminal for electrical and mechanical connection to a printed circuit board
03/13/2002EP1187259A2 Electrical connection box for a vehicle
03/13/2002EP1187258A1 Fuse relay junction block for use in automobiles
03/13/2002EP1187212A2 Display apparatus
03/13/2002EP1187204A2 Circuit device and method of manufacturing the same
03/13/2002EP1187198A2 Metal-ceramic circuit board and manufacturing method thereof
03/13/2002EP1186955A2 Masks and mask precursors, electronic part precursors and electronic parts
03/13/2002EP1186938A2 Semiconductor device, liquid crystal module adopting same, method of manufacturing liquid crystal module and electronic equipment adopting same
03/13/2002EP1186624A1 Organosiloxane polymers and photo-curable resin compositions
03/13/2002EP1186478A2 Circuit having bus bars and junction box containing the circuit
03/13/2002EP1186370A2 Process and device for producing a laser weld joint
03/13/2002EP1186213A1 Method and apparatus for reducing electrical resonances and noise propagation in power distribution circuits employing plane conductors
03/13/2002EP1186036A1 Electronic device with flexible contacting points
03/13/2002EP1186031A1 Substrate with at least two metallized polymer bumps for soldered connection to wiring
03/13/2002EP1186021A1 Microelectronic subassembly
03/13/2002EP0958718B1 Process and apparatus for the coating of boards
03/13/2002EP0906827B1 Screen printing method and apparatus therefor
03/13/2002CN2482313Y Flexible printed circuit board structure
03/13/2002CN1340291A Shield can having tapered wall ends for surface mounting and radiotelephones incorporating same
03/13/2002CN1340289A Circuit forming board and method of manufacturing circuit forming board
03/13/2002CN1340288A Surface-treated copper foil and its preparing method
03/13/2002CN1340163A Method for verification of polarity, presence, alignment of components and short circuit on a printed circuit board
03/13/2002CN1339993A Method and apparatus for dispensing material in a printer
03/13/2002CN1339992A Compact reflow and cleaning apparatus
03/13/2002CN1339941A Line board and its producing mehtod
03/13/2002CN1339940A Multiplayer circuit base and its producing method
03/13/2002CN1339822A Base for producing semiconductor device by using three element alloy
03/13/2002CN1339692A Plate for measuring deviation of element mounting device and its measuring method
03/13/2002CN1339621A Holding device
03/13/2002CN1080984C Panel assembly structure
03/13/2002CN1080981C Printed wiring board
03/13/2002CN1080616C Solder and soldered electronic component and electric circuit board
03/13/2002CN1080599C Spreading apparatus
03/12/2002US6356455 Thin integral resistor/capacitor/inductor package, method of manufacture
03/12/2002US6356453 Electronic package having flip chip integrated circuit and passive chip component
03/12/2002US6356452 Soldermask opening to prevent delamination
03/12/2002US6356451 Multi-layered substrate, method for manufacturing the multi-layered substrate and electric apparatus
03/12/2002US6356449 Flexible printed circuit board mounting structure and recording/reproducing device using the same
03/12/2002US6356448 Inter-circuit encapsulated packaging for power delivery
03/12/2002US6356447 Surface mounted conduction heat sink
03/12/2002US6356431 Connection pins of a capacitor
03/12/2002US6356337 Two-sided substrate imaging using single-approach projection optics
03/12/2002US6356333 Conductive adhesive with conductive particles, mounting structure, liquid crystal device and electronic device using the same
03/12/2002US6356321 Liquid crystal display panel holder
03/12/2002US6356234 Electrical circuit
03/12/2002US6356173 High-frequency module coupled via aperture in a ground plane
03/12/2002US6356166 Multi-layer switched line phase shifter
03/12/2002US6356002 Electrical slip ring having a higher circuit density
03/12/2002US6355881 Means for sealing an electronic or optical component within an enclosure housing
03/12/2002US6355750 Curable adhesive comprising siloxane-containing maleimide compound and free radical- or photoinitiator; semiconductors, integrated circuits
03/12/2002US6355504 Electrical interconnections, methods of conducting electricity, and methods of reducing horizontal conductivity within an anisotropic conductive adhesive
03/12/2002US6355360 Separator sheet laminate for use in the manufacture of printed circuit boards
03/12/2002US6355354 For corrosion and erosion resistance, abrasion resistance, and electrical and thermal insulation
03/12/2002US6355324 Multiple coated substrates
03/12/2002US6355298 Positioning transferring device relative to surface so that recognizing means disposed on transferring device detects alignment mark on surface; positioning transferring device; aligning one of transferring devices; placing two elements
03/12/2002US6355198 Method of forming articles including waveguides via capillary micromolding and microtransfer molding
03/12/2002US6355131 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same
03/12/2002US6355113 Multiple solvent cleaning system
03/12/2002US6355101 Flux transfer apparatus
03/12/2002US6354874 Component for mounting on a circuit board
03/12/2002US6354868 Vehicle power distribution box
03/12/2002US6354850 Electrical connector with feature for limiting the effects of coefficient of thermal expansion differential
03/12/2002US6354846 Electrical connection box