| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/21/2002 | DE10017887C1 Selective, metal-based activation of substrates for wet-chemical, electroless plating, especially on circuit board for microelectronic device, uses vesicles to transport activator metal or precursor to selected area |
| 03/21/2002 | DE10015214C1 Verfahren zur Metallisierung eines Isolators und/oder eines Dielektrikums A process for the metallization of an insulator and / or a dielectric |
| 03/20/2002 | EP1189495A1 Method of manufacturing multilayer ceramic substrate, and conductor paste |
| 03/20/2002 | EP1189345A2 High frequency module device and method for its preparation |
| 03/20/2002 | EP1189308A1 Electrical connection material and electrical connection method |
| 03/20/2002 | EP1189282A1 Semiconductor device, method of manufacturing electronic device, electronic device, and portable information terminal |
| 03/20/2002 | EP1189277A1 Electronic circuit substrate and electronic module using such a substrate |
| 03/20/2002 | EP1189250A1 Functionally asymmetrical circuit support arrangement with mirror-inverted assembly |
| 03/20/2002 | EP1189247A2 Broadband microwave choke and surface mounting carrier |
| 03/20/2002 | EP1189111A1 Production device for printed board, production method for printed board and printed board |
| 03/20/2002 | EP1189016A1 Method for manufacturing mounted AFM probes by soldering |
| 03/20/2002 | EP1188778A1 Thermosetting resin composition, and resin coated metal foil, prepreg and film-shaped adhesive all using the composition |
| 03/20/2002 | EP1188506A1 Process and apparatus for flow soldering |
| 03/20/2002 | EP1188212A1 A multi-functional energy conditioner |
| 03/20/2002 | EP1188199A1 Multilayer microwave couplers using vertically-connected stripline |
| 03/20/2002 | EP1187698A1 Beam shaping and projection imaging with solid state uv gaussian beam to form vias |
| 03/20/2002 | EP1019960A4 Ball grid array semiconductor package and method for making the same |
| 03/20/2002 | EP1015667B1 Method and device for regulating the concentration of substances in electrolytes |
| 03/20/2002 | CN1341277A Apparatus for plating semiconductor substrate, method for plating semiconductor substrate |
| 03/20/2002 | CN1341166A Semiconductor wafer electroplating and electrolyzing apparatus and method |
| 03/20/2002 | CN1341153A Method for treating brittle thin metal strip and magnetic parts made from nanocrystalline alloy strip |
| 03/20/2002 | CN1341044A Method for making segmented through holes in printed circuit boards |
| 03/20/2002 | CN1340881A Connection structure for display module and printed base plate and semiconductor device, display module and electronic member |
| 03/20/2002 | CN1340856A RF module member including surface elastic wave element and its manufacture method |
| 03/20/2002 | CN1340852A Technology for making printed convex block on semiconductor carrier |
| 03/20/2002 | CN1340851A Electronic device and its manufacture method |
| 03/20/2002 | CN1340850A Assembling method for monolithic electronic member and monolithic electronic member |
| 03/20/2002 | CN1340584A Conductive adhesive and assembled structural body by use of said adhesive |
| 03/20/2002 | CN1081434C Multi-layer printed circuit board and method for mfg. same |
| 03/19/2002 | US6359561 Method of manufacturing and testing an electronic device, and an electronic device |
| 03/19/2002 | US6359341 Ball grid array integrated circuit package structure |
| 03/19/2002 | US6359337 Composite electrical contact structure and method for manufacturing the same |
| 03/19/2002 | US6359332 Printed-wiring substrate having lead pins |
| 03/19/2002 | US6359255 Method for forming a through hole in a ceramic green sheet |
| 03/19/2002 | US6359237 Multi-layer printed board |
| 03/19/2002 | US6359236 Mounting component with leads having polymeric strips |
| 03/19/2002 | US6359235 Electrical device mounting wiring board and method of producing the same |
| 03/19/2002 | US6359233 Printed circuit board multipack structure having internal gold fingers and multipack and printed circuit board formed therefrom, and methods of manufacture thereof |
| 03/19/2002 | US6359035 For producing multilayer printed wiring boards, does not cause dust explosion, dielectrics |
| 03/19/2002 | US6358834 Method of forming bumps on wafers or substrates |
| 03/19/2002 | US6358767 Method of manufacturing semiconductor device |
| 03/19/2002 | US6358664 Electronically active primer layers for thermal patterning of materials for electronic devices |
| 03/19/2002 | US6358630 Soldering member for printed wiring boards |
| 03/19/2002 | US6358627 Rolling ball connector |
| 03/19/2002 | US6358439 For forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices |
| 03/19/2002 | US6358390 Obtaining a surface charge on ceramic materiall depositing an electroconductive material on surface of ceramic material; activating electroconductive material; electrolytically plating metal on surface of electroconductive material |
| 03/19/2002 | US6358351 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same |
| 03/19/2002 | US6358089 Connector for printed wiring board |
| 03/19/2002 | US6358068 Stress resistant connector and method for reducing stress in housing thereof |
| 03/19/2002 | US6358065 Display unit installing and connecting device |
| 03/19/2002 | US6358064 Z-axis electrical interconnect |
| 03/19/2002 | US6357864 Tab circuit design for simplified use with hot bar soldering technique |
| 03/19/2002 | US6357112 Method of making connection component |
| 03/19/2002 | US6357111 Inter-electrode connection structure, inter-electrode connection method, semiconductor device, semiconductor mounting method, liquid crystal device, and electronic apparatus |
| 03/19/2002 | US6357108 Depaneling system having multiple router stations |
| 03/19/2002 | US6357106 Method for mounting parts and making an IC card |
| 03/19/2002 | CA2219717C Cover for an edge mounted printed circuit board connector |
| 03/15/2002 | CA2357317A1 Substrate for electronic circuit and electronic module using said substrate |
| 03/14/2002 | WO2002021893A2 Method and device for testing printed circuit boards with a parallel tester |
| 03/14/2002 | WO2002021887A1 Durable laminated electronics assembly using epoxy preform |
| 03/14/2002 | WO2002021882A1 Coating removal |
| 03/14/2002 | WO2002021592A2 Method for producing an electroconductive layer on the wall of through holes in a substrate |
| 03/14/2002 | WO2002021591A1 Method for producing electrically conductive layers on the wall of through holes in a substrate |
| 03/14/2002 | WO2002021477A1 Apparatus and method for securing electronic information |
| 03/14/2002 | WO2002021197A1 Connection method |
| 03/14/2002 | WO2002020876A2 Segmenting of processing system into wet and dry areas |
| 03/14/2002 | WO2002020875A2 Method for producing an adhesive metal coating |
| 03/14/2002 | WO2002020686A2 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same |
| 03/14/2002 | WO2002013189A8 Bonding pad of suspension circuit |
| 03/14/2002 | WO2001093280A8 Halogen-free film composite, method for producing the same and its use |
| 03/14/2002 | WO2001083205A3 Reactive multilayer structures for ease of processing and enhanced ductility |
| 03/14/2002 | US20020032824 Tuned stub, SCSI topology |
| 03/14/2002 | US20020032273 Containing a 1H-tetrazole or a 5,5'-bis-1H-tetrazole |
| 03/14/2002 | US20020031923 Chip socket assembly and chip file assembly for semiconductor chips |
| 03/14/2002 | US20020031921 Contact structure of lead |
| 03/14/2002 | US20020031918 Method of manufacture of ceramic composite wiring structures for semiconductor devices |
| 03/14/2002 | US20020031903 Component mounting apparatus and method, component mounting system having the apparatus, and circuit board manufactured by the method |
| 03/14/2002 | US20020031869 Leadframe and method for manufacturing resin-molded semiconductor device |
| 03/14/2002 | US20020031861 Controlled and programmed deposition of flux on a flip-chip die by spraying |
| 03/14/2002 | US20020031857 Vertically mountable semiconductor device and methods |
| 03/14/2002 | US20020031728 Methods of manufacturing electroconductive film, and image forming apparatus including the same film |
| 03/14/2002 | US20020031677 High-speed fabrication of highly uniform ultra-small metallic microspheres |
| 03/14/2002 | US20020031672 Sealed with silicon gel |
| 03/14/2002 | US20020031650 Electronic chip package |
| 03/14/2002 | US20020031642 Method for producing filled vias in electronic components |
| 03/14/2002 | US20020031612 Scanning pattern; accuracy |
| 03/14/2002 | US20020030978 Wiring Board, method for producing same, display device, and electronic device |
| 03/14/2002 | US20020030977 Fan control circuit and package |
| 03/14/2002 | US20020030973 Surface mounted conduction heat sink |
| 03/14/2002 | US20020030972 Heatsink apparatus for de-coupling clamping forces on an integrated circuit package |
| 03/14/2002 | US20020030971 Electronic appliance |
| 03/14/2002 | US20020030940 Head gimbal assembly |
| 03/14/2002 | US20020030935 Bonding pad of suspension circuit |
| 03/14/2002 | US20020030800 Method of forming optical images, mask for use in this method, method of manufacturing a device using this method, and apparatus for carrying out this method |
| 03/14/2002 | US20020030602 Cylindrical battery clip for key fobs |
| 03/14/2002 | US20020030577 Thin-film resistor, wiring substrate, and method for manufacturing the same |
| 03/14/2002 | US20020030573 Insulating ceramic compact, ceramic multilayer substrate, and ceramic electronic device |
| 03/14/2002 | US20020030306 Method and device for making holes in ceramic green sheets |
| 03/14/2002 | US20020030287 Resistance-reducing conductive adhesives for attachment of electronic components |
| 03/14/2002 | US20020030286 Resistance-reducing conductive adhesives for attachment of electronic components |