| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/27/2002 | CN2483938Y Air knife/water knife with function of separating buffering rectification |
| 03/27/2002 | CN1342391A Method of manufacturing multilayer wiring board |
| 03/27/2002 | CN1342220A Electrodeposition of metals in small recesses using modulated electric fields |
| 03/27/2002 | CN1342040A Method for applying gluewater on circuit board carrier and circuit board manufactured according to this method |
| 03/27/2002 | CN1342039A Device for removing printed circuit board film |
| 03/27/2002 | CN1342038A Integrated circuit baseplate column-like projection block forming method |
| 03/27/2002 | CN1342036A Printed wiring baseboard and its manufacturing method |
| 03/27/2002 | CN1342035A Circuit device and its manufacturing method |
| 03/27/2002 | CN1341984A 插座接头 Socket joints |
| 03/27/2002 | CN1341543A 芯片元件进给器 Chip component feeder |
| 03/27/2002 | CN1081808C Module structure and electronic device |
| 03/27/2002 | CN1081793C Apparatus and method for detecting outward appearance of electronic elements |
| 03/27/2002 | CA2321010A1 Process for producing a printed circuit |
| 03/26/2002 | US6363217 Convective heater employing foam metal diffuser |
| 03/26/2002 | US6362974 Stacked processor construction and a method for producing same |
| 03/26/2002 | US6362973 Multilayer printed circuit board with placebo vias for controlling interconnect skew |
| 03/26/2002 | US6362969 Arrangement for supporting a circuit board |
| 03/26/2002 | US6362965 Clamping heat sinks to circuit boards over processors |
| 03/26/2002 | US6362525 Circuit structure including a passive element formed within a grid array substrate and method for making the same |
| 03/26/2002 | US6362518 Electronic compoment to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same |
| 03/26/2002 | US6362516 Electronic apparatus |
| 03/26/2002 | US6362438 Enhanced plated-through hole and via contact design |
| 03/26/2002 | US6362437 Mounting structure of integrated circuit device having high effect of buffering stress and high reliability of connection by solder, and method of mounting the same |
| 03/26/2002 | US6362436 Printed wiring board for semiconductor plastic package |
| 03/26/2002 | US6362435 Multi-layer conductor pad for reducing solder voiding |
| 03/26/2002 | US6362434 Magnetic prepreg, its manufacturing method and printed wiring board employing the prepreg |
| 03/26/2002 | US6362433 Flexible printed circuit board |
| 03/26/2002 | US6361924 Applied, in the form of coatings, onto substrates such as printed circuit boards |
| 03/26/2002 | US6361923 Laser ablatable material and its use |
| 03/26/2002 | US6361823 Process for whisker-free aqueous electroless tin plating |
| 03/26/2002 | US6361713 Displacing water from and decontaminating surfaces |
| 03/26/2002 | US6361673 Electroforming cell |
| 03/26/2002 | US6361627 Process of controlling grain growth in metal films |
| 03/26/2002 | US6361606 Method and apparatus for dispensing viscous material |
| 03/26/2002 | US6361332 Retention system for electrical connectors |
| 03/26/2002 | US6361331 Spring structure with self-aligned release material |
| 03/26/2002 | US6361330 Mounting opto-electric modules on circuit boards |
| 03/26/2002 | US6361146 Adhesive bonding laminates |
| 03/26/2002 | US6360939 Lead-free electrical solder and method of manufacturing |
| 03/26/2002 | US6360935 Apparatus and method for assessing solderability |
| 03/26/2002 | US6360435 Bidirectional interface tool for PWB development |
| 03/26/2002 | US6360434 Circuit fabrication |
| 03/26/2002 | US6360433 Universal package and method of forming the same |
| 03/26/2002 | US6360432 Water soluble thermoplastic printed wiring board spacer |
| 03/26/2002 | US6360431 Processor power delivery system |
| 03/26/2002 | CA2242802C Mounting structure for one or more semiconductor devices |
| 03/26/2002 | CA2098844C Method of cloning printed wiring boards |
| 03/21/2002 | WO2002023963A2 Method and apparatus for surface mounting electrical devices |
| 03/21/2002 | WO2002023962A2 Method for the formation of a pattern on an insulating substrate |
| 03/21/2002 | WO2002023961A1 Method for producing an electrically conductive structure on a non-planar surface and the use of said method |
| 03/21/2002 | WO2002023674A2 Thick film millimeter wave transceiver module |
| 03/21/2002 | WO2002023620A2 Connection for conducting high frequency signal between a circuit and a discrete electrical component |
| 03/21/2002 | WO2002023617A1 Two-metal tab tape, double-sided csp tape, bga tape, and method for manufacturing the same |
| 03/21/2002 | WO2002023592A2 Method and apparatus for reducing ic die mass and thickness while improving strength characteristics |
| 03/21/2002 | WO2002023579A1 Electronic device |
| 03/21/2002 | WO2002023566A2 A lead-less surface mount reed relay |
| 03/21/2002 | WO2002023559A1 Broadband microwave choke and surface mounting carrier |
| 03/21/2002 | WO2002023277A1 Machine for the treatment of printing plates |
| 03/21/2002 | WO2002023275A1 Ultraviolet-curing resin composition and photo solder resist ink containing the same |
| 03/21/2002 | WO2002023273A2 Photosensitive composition, cured article thereof, and printed circuit board using the same |
| 03/21/2002 | WO2002023206A1 Inspection device and inspection method |
| 03/21/2002 | WO2002022916A1 Method of etching, as well as frame element, mask and prefabricated substrate element for use in such etching |
| 03/21/2002 | WO2002022915A2 Removable modular cell for electro-chemical plating |
| 03/21/2002 | WO2002022372A1 Use of electronically active primer layers in thermal patterning of materials |
| 03/21/2002 | WO2002022329A1 Entry boards for use in drilling small holes |
| 03/21/2002 | WO2002022321A2 Multiple blade robot adjustment apparatus and associated method |
| 03/21/2002 | WO2002022302A1 Solder material and electric or electronic device in which the same is used |
| 03/21/2002 | WO2001083623A3 Method of making reactive multilayer foil and resulting product |
| 03/21/2002 | WO2001076333A9 Method and apparatus for applying viscous or paste material onto a substrate |
| 03/21/2002 | WO2001069680A3 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
| 03/21/2002 | US20020035720 Wiring editing method, for semiconductor package, capable of easily editing offset of wiring pattern |
| 03/21/2002 | US20020035196 Mixture containing tetrazole |
| 03/21/2002 | US20020035194 Mixture of borosilicate glass and crystalline glass |
| 03/21/2002 | US20020034934 High-frequency module and radio device using the same |
| 03/21/2002 | US20020034892 Electrical connector |
| 03/21/2002 | US20020034888 Insulating interposer between two electronic components and process thereof |
| 03/21/2002 | US20020034872 Semiconductor device and mounted semiconductor device structure |
| 03/21/2002 | US20020034840 Plasma-processing apparatus, plasma-processing method, plasma-processed board, chip mounting method, and chip mounted assembly |
| 03/21/2002 | US20020034839 Multi-level circuit substrate, method for manufacturing same and method for adjusting a characteristic impedance therefor |
| 03/21/2002 | US20020034833 Methods of testing integrated circuitry, methods of forming tester substrates, and circuitry testing substrates |
| 03/21/2002 | US20020034825 Reactive dye or pigment that changes color when brought into contact with contaminants; preferably, testing liquid is the dye Nile blue and a surfactant |
| 03/21/2002 | US20020034667 Having enhanced electronic properties and are superior to thin film configurations because the thick films have lower loss tangents and are not dependant on substrate materials |
| 03/21/2002 | US20020034620 Mounting structure for an electronic component and method for producing the same |
| 03/21/2002 | US20020034619 Terephthalic acid, ethylene glycol and 1,4-cyclohexane-dimethanol monomers and a fatty ester |
| 03/21/2002 | US20020034617 Method of manufacture of printed wiring boards and flexible circuitry |
| 03/21/2002 | US20020034614 Multilayer board using a glass-ceramic material which can be fired at low temperatures |
| 03/21/2002 | US20020034611 Process of forming a pattern on a substrate |
| 03/21/2002 | US20020034059 Mounting structure for capacitors |
| 03/21/2002 | US20020033532 Electrode bonding structure for reducing the thermal expansion of the flexible printed circuit board during the bonding process |
| 03/21/2002 | US20020033529 Power semiconductor module |
| 03/21/2002 | US20020033525 Packaging method and packaging structures of semiconductor devices |
| 03/21/2002 | US20020033524 Tape-carrier-package semiconductor device and a liquid crystal panel display using such a device as well as a method for testing the disconnection thereof |
| 03/21/2002 | US20020033411 Method and apparatus for flex circuit reflow attachment |
| 03/21/2002 | US20020033387 Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board |
| 03/21/2002 | US20020033341 Immersion in electrolytic cell |
| 03/21/2002 | US20020033275 Printed wiring board comprising substrate with conductor layer having penetrating throughhole filled with material comprising cured paste of epoxy resin, base metal powder filler, and imidazole compound curing agent |
| 03/21/2002 | US20020033204 Mixture of tin with silver and,or bismuth, copper alloy with rosin |
| 03/21/2002 | US20020033087 Cutter wheel for brittle sheets |
| 03/21/2002 | US20020032961 Altering method of circuit pattern of printed-circuit board |
| 03/21/2002 | US20020032958 Method of manufacturing magnetic head assembly |