| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/02/2002 | US6365844 Printed wiring board |
| 04/02/2002 | US6365843 Multilayer printed wiring board |
| 04/02/2002 | US6365842 Electrical circuits, circuits, and electrical couplings |
| 04/02/2002 | US6365841 Printed circuit board with resist coating defining reference marks |
| 04/02/2002 | US6365840 Electrical connecting device and electrical connecting method |
| 04/02/2002 | US6365828 Electromagnetic interference suppressing device and circuit |
| 04/02/2002 | US6365594 As opioid agonists and antagonists and are useful as i.a. analgesics |
| 04/02/2002 | US6365499 Chip carrier and method of manufacturing and mounting the same |
| 04/02/2002 | US6365440 Method for contacting a circuit chip |
| 04/02/2002 | US6365432 Fabrication process of semiconductor package and semiconductor package |
| 04/02/2002 | US6365265 Photosensitive insulating paste and thick-film multi-layer circuit substrate |
| 04/02/2002 | US6365085 Comprises a cavity to which a plurality of bus bars are juxtaposedly inserted provided with gap portions to which a resin material to be injected therethrough and a plurality of holder pins provided |
| 04/02/2002 | US6365057 Circuit manufacturing using etched tri-metal media |
| 04/02/2002 | US6364713 Electrical connector adapter assembly |
| 04/02/2002 | US6364712 Filter device for at least one electrical line connectable externally to a housing |
| 04/02/2002 | US6364709 Small form-factor pluggable transceiver cage |
| 04/02/2002 | US6364668 Electrical connection system and method for flat circuits |
| 04/02/2002 | US6364205 Chip card having a contact zone and method of producing such a chip card |
| 04/02/2002 | US6364196 Method and apparatus for aligning and attaching balls to a substrate |
| 04/02/2002 | US6363847 Method of applying adhesive material to parts mounted circuit board |
| 04/02/2002 | US6363846 Screen printing apparatus having a camera apparatus |
| 04/02/2002 | CA2321345A1 Use of graphite in a composite to reduce ice accretion |
| 04/02/2002 | CA2182237C Interconnect arrangement for printed circuits |
| 03/28/2002 | WO2002026008A1 Hermetically sealed component assembly package |
| 03/28/2002 | WO2002026007A1 Flux applying method and device, flow soldering method and device and electronic circuit board |
| 03/28/2002 | WO2002026006A1 Flux applying method, flow soldering method and devices therefor and electronic circuit board |
| 03/28/2002 | WO2002025825A2 Method for assembling components and antennae in radio frequency identification devices |
| 03/28/2002 | WO2002025797A2 Electronic transformer/inductor devices and methods for making same |
| 03/28/2002 | WO2002025731A1 Electronic equipment |
| 03/28/2002 | WO2002025709A2 Integrated thin film capacitor/inductor/interconnect system and method |
| 03/28/2002 | WO2002025702A2 Semiconductor product with a silver and gold alloy |
| 03/28/2002 | WO2002025378A1 Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
| 03/28/2002 | WO2002025298A1 Inspection unit and method of manufacturing substrate |
| 03/28/2002 | WO2002025070A1 Connecting device for routing control and power signals to an internal combustion engine valve actuators |
| 03/28/2002 | WO2002024979A1 Electrolyte and method for depositing tin-copper alloy layers |
| 03/28/2002 | WO2002024977A1 A method for wet etching |
| 03/28/2002 | WO2002024974A2 Process for treating adhesion promoted metal surfaces |
| 03/28/2002 | WO2002024785A1 Heat-resistant resin precursor, heat-resistant resin and insulating film and semiconductor device |
| 03/28/2002 | WO2002024592A1 Glass fiber coating for inhibiting conductive anodic filament formation in electronic supports |
| 03/28/2002 | WO2002024449A1 Multilayered 4-methyl-1-pentene copolymer film and process for producing the same |
| 03/28/2002 | WO2002024444A1 Copper foil for high-density ultrafine wiring board |
| 03/28/2002 | WO2002024431A1 Multi-layered structures and methods for manufacturing the multi-layered structures |
| 03/28/2002 | WO2002024391A1 Polymer collar for solder bumps |
| 03/28/2002 | WO2001099479A3 Bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure, and associated electrical power distribution structures |
| 03/28/2002 | WO2001097583A3 Molded electronic assembly |
| 03/28/2002 | WO2001091184A3 Semiconductor component comprising a surface metallization |
| 03/28/2002 | WO2001069640A3 Method for applying metallic strip conductors acting as electrodes on a channel plate made of glass for large-surface flat screens |
| 03/28/2002 | WO2001029928A3 Device for electrically and mechanically connecting two printed circuit boards |
| 03/28/2002 | US20020037672 Socket, circuit board, and sub-circuit board for semiconductor integrated circuit device |
| 03/28/2002 | US20020037657 Spiral contactor and manufacturing method for this apparatus, and a semiconductor inspecting equipment and electronical parts using this apparatus |
| 03/28/2002 | US20020037656 Interconnect structure |
| 03/28/2002 | US20020037481 Photochemical metal organic deposition patterning process |
| 03/28/2002 | US20020037473 Printed circuit substrate with controlled placement covercoat layer |
| 03/28/2002 | US20020037435 Circuit substrate |
| 03/28/2002 | US20020037400 As a patch board for protection in order to efficiently carry out in small hole drilling |
| 03/28/2002 | US20020037397 Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board |
| 03/28/2002 | US20020037363 Imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance |
| 03/28/2002 | US20020036898 Article with electronic circuit formed and method of manufacturing the same |
| 03/28/2002 | US20020036759 Automatic exposing apparatus for both sides and exposing method thereof for works |
| 03/28/2002 | US20020036746 Display panel and method of producing the same |
| 03/28/2002 | US20020036511 Printed circuit board and method of manufacturing the same |
| 03/28/2002 | US20020036345 High frequency flip chip module and assembling method thereof |
| 03/28/2002 | US20020036344 Semiconductor device provided with low melting point metal bumps |
| 03/28/2002 | US20020036341 Printed board unit |
| 03/28/2002 | US20020036227 Low temperature solder chip attach structure |
| 03/28/2002 | US20020036224 Hermetically sealed component assembly package |
| 03/28/2002 | US20020036223 Soldering apparatus |
| 03/28/2002 | US20020036099 Circuit board for transmitting signals, method for producing the same, and electronic device having the same |
| 03/28/2002 | US20020036054 Printed circuit board and method manufacturing the same |
| 03/28/2002 | US20020035785 Method of drilling a circuit substrate |
| 03/28/2002 | US20020035784 Method of producing wiring board |
| 03/28/2002 | US20020035782 Method and apparatus for manufacturing electronic parts |
| 03/28/2002 | US20020035780 Battery powerable apparatus, radio frequency communication device, and electric circuit |
| 03/28/2002 | DE10145147A1 Connecting structure used for forming electrical connection in highly integrated circuits comprises connecting substrate, connecting elements mounted on horizontal surface of the substrate, base region, and spring region |
| 03/28/2002 | DE10066028A1 Kupfersubstrat mit aufgerauhten Oberflächen Copper substrate with roughened surfaces |
| 03/28/2002 | DE10048466C1 Electrical contacting device for flexible circuit board has sliding element between contact spring and flexible circuit board for movement of contact spring into its end position |
| 03/28/2002 | DE10045359A1 Vorrichtung zum Aufbringen von Lotpaste auf eine Leiterplatte Apparatus for applying solder paste to a circuit board |
| 03/28/2002 | DE10043728A1 Verfahren und Vorrichtung zum Prüfen von Leiterplatten mit einem Paralleltester Method and apparatus for testing circuit boards with a parallel tester |
| 03/28/2002 | DE10043471A1 Metallschablonen Metal stencils |
| 03/28/2002 | DE10042653A1 Ceramic multiple layer circuit element for linking adjacent electrically conductive elements has stacked ceramic layers with different relative permittivities and green ceramic foil with lowered crystallizing temperature. |
| 03/27/2002 | EP1191829A2 Surface electrode structure on ceramic multi-layer substrate and process for producing the same |
| 03/27/2002 | EP1191635A2 Interconnect structure |
| 03/27/2002 | EP1191588A2 A spiral contactor and manufacturing method therefor |
| 03/27/2002 | EP1191587A2 Packaging structure and method for automotive components |
| 03/27/2002 | EP1191555A2 Formation of an embedded capacitor plane using a thin polyimide dielectric |
| 03/27/2002 | EP1191127A1 Process for selective metallization of dielectric materials |
| 03/27/2002 | EP1190830A2 A method of forming a switch pattern on a switch substrate and a switch substrate |
| 03/27/2002 | EP1190801A1 Apparatus for multi-point deposition of solder paste on a printed circuit board |
| 03/27/2002 | EP1190609A1 Microfiber dielectrics which facilitate laser via drilling |
| 03/27/2002 | EP1190608A1 Porous power and ground planes for reduced pcb delamination and better reliability |
| 03/27/2002 | EP1190607A1 Integrated circuits with copper metallization for interconnections |
| 03/27/2002 | EP1190606A1 High density substrate and methods for manufacturing same |
| 03/27/2002 | EP1190374A2 High-reliability touch panel |
| 03/27/2002 | EP1190111A2 Method of coating ceramics using ccvd |
| 03/27/2002 | EP1189725A1 A control method for copper content in a solder dipping bath |
| 03/27/2002 | EP1106040B1 Method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections |
| 03/27/2002 | EP1051888B1 Process and solution for the preliminary treatment of copper surfaces |
| 03/27/2002 | EP0947124B1 A method for adding layers to a pwb which yields high levels of copper to dielectric adhesion |
| 03/27/2002 | EP0944453B1 Soldering/unsoldering arrangement |
| 03/27/2002 | CN2483939Y Blanking component of printed circuit board forming machine |