| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/09/2002 | US6367679 Detection of flux residue |
| 04/09/2002 | US6367678 Process for stacking layers that form a multilayer printed circuit |
| 04/09/2002 | US6367532 Laminator |
| 04/09/2002 | US6367378 Reel feed screen printing method and printing machine |
| 04/04/2002 | WO2002028155A1 Low-inductance connector for printed-circuit board |
| 04/04/2002 | WO2002027791A2 Polymer stud grid array and method for production thereof |
| 04/04/2002 | WO2002027786A1 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 04/04/2002 | WO2002027651A1 Method for producing a transponder coil |
| 04/04/2002 | WO2002027407A1 Resist pattern, process for producing the same, and utilization thereof |
| 04/04/2002 | WO2002027074A1 Method for selectively metallizing dielectric materials |
| 04/04/2002 | WO2002027069A1 Systems and methods for preventing and/or reducing corrosion in various articles |
| 04/04/2002 | WO2002026440A1 Multiple spindle multiple carriage spindle positioning system |
| 04/04/2002 | WO2002011506A3 Vapor chamber with integrated pin array |
| 04/04/2002 | WO2002003766A3 Process for thick film circuit patterning |
| 04/04/2002 | WO2001093647A3 Filling method |
| 04/04/2002 | WO2001093324A3 Substrate adapted to accommodate a circuit configuration and method for producing the same |
| 04/04/2002 | WO2001067494A3 Precision electroplated solder bumps and method for manufacturing thereof |
| 04/04/2002 | WO2001063985A3 Electronic supports and methods and apparatus for forming apertures in electronic supports |
| 04/04/2002 | WO2001056079A3 A method for transferring and stacking of semiconductor devices |
| 04/04/2002 | US20020040082 Polymeric coating compositions, polymer coated substrates,and methods of making and using the same |
| 04/04/2002 | US20020039854 IC socket |
| 04/04/2002 | US20020039849 Spring connector for electrically connecting tracks of a display screen with an electrical circuit |
| 04/04/2002 | US20020039847 Grid interposer |
| 04/04/2002 | US20020039808 Capable of meeting miniaturization and high integration |
| 04/04/2002 | US20020039644 Particularly, it relates to a printed wiring board for a very thin ball grid array type plastic package. |
| 04/04/2002 | US20020039283 Battery pack and battery case used for the same, and method for producing the sames |
| 04/04/2002 | US20020039023 Inductive sensor |
| 04/04/2002 | US20020038821 PC adapter cards and method of manufacturing the same |
| 04/04/2002 | US20020038815 Process and apparatus for flow soldering |
| 04/04/2002 | US20020038814 Method and apparatus for applying viscous material |
| 04/04/2002 | US20020038790 Micro-etching composition for copper or copper alloy, micro-etching method, and method for manufacturing printed circuit board |
| 04/04/2002 | US20020038764 Using pulsation reverse current |
| 04/04/2002 | US20020038726 Polymer stud grid array and method for producing such a polymer stud grid array |
| 04/04/2002 | US20020038725 Circuit board and production of the same |
| 04/04/2002 | US20020038723 Mounting mechanism of metal plate on printed board |
| 04/04/2002 | US20020038721 Wiring circuit board having bumps and method of producing same |
| 04/04/2002 | US20020038582 Impregnating filler with polyarylene ether; melting; uniformdispersion |
| 04/04/2002 | US20020038509 Bump structure and method for making the same |
| 04/04/2002 | US20020038507 Process for producing an industrial member having throughholes of high aspect ratio |
| 04/04/2002 | DE10136078A1 Zusammensetzung zum Mikroätzen von Kupfer oder Kupferlegierung, Verfahren zum Mikroätzen und Verfahren zum Herstellen einer Schaltungsplatte Microetching composition for copper or copper alloy, and method for microetching method of manufacturing a circuit board |
| 04/04/2002 | DE10053410C1 Polishing device for coated circuit board plate has polishing tool controlled depending on measured coating thickness at each position for providing uniform coating thickness |
| 04/04/2002 | DE10050798C1 Flat laminated cable connection method has solder-coated metal strip used for bonding cable conductors of overlapping cable ends together |
| 04/04/2002 | DE10045534A1 Electronic component has capillary elements as connection elements, which are connected with contact areas of a carrier |
| 04/04/2002 | DE10045072A1 Verfahren zur Herstellung einer elektrisch leitfähigen Struktur auf einer nichtplanen Oberfläche und Verwendung des Verfahrens A process for producing an electrically conductive pattern on a non-planar surface, and using the method |
| 04/04/2002 | DE10044209A1 Verfahren und Vorrichtung zur Behandlung von Gegenständen, besonders Leiterplatten Method and apparatus for treating objects, particularly printed circuit boards |
| 04/04/2002 | DE10043817A1 Continuous electrochemical plant metallizing, etching, oxidizing and reducing e.g. PCBs, wafers and hybrids, controls electrode approach during conveying |
| 04/04/2002 | DE10043815A1 Contacting planar goods, e.g. PCBs and printed circuit films for diverse electrolytic treatments, connects goods without relative motion for duration of treatment |
| 04/04/2002 | DE10040303A1 Circuit board production method, involves providing sounding pads connected to metallic edge of respective inside layer and sounding drilling in area of pads determining depth of inside layer |
| 04/04/2002 | DE10036901A1 Verfahren und Vorrichtung zur Erzeugung einer Laserschweißverbindung Method and device for producing a laser weld joint |
| 04/03/2002 | EP1194030A1 Method for mounting semiconductor element to circuit board, and semiconductor device |
| 04/03/2002 | EP1194025A1 Multilayer printed wiring board |
| 04/03/2002 | EP1194024A1 Multilayer printed-circuit board and method of manufacture |
| 04/03/2002 | EP1194023A1 Multilayered printed wiring board and production method therefor |
| 04/03/2002 | EP1194022A1 Multilayer printed wiring board and method of manufacturing multilayer printed wiring board |
| 04/03/2002 | EP1194021A2 Method of producing multilayer printed wiring board and multilayer printed wiring board |
| 04/03/2002 | EP1194020A2 Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board |
| 04/03/2002 | EP1194019A1 Sealant against potting compound |
| 04/03/2002 | EP1193803A1 IC socket |
| 04/03/2002 | EP1193802A1 Spring connector for connecting a display to a printed circuit board |
| 04/03/2002 | EP1193757A2 Conductive metal particles, conductive composite metal particles and applied products using the same |
| 04/03/2002 | EP1193755A1 Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them |
| 04/03/2002 | EP1193750A2 Micro soldering method and apparatus |
| 04/03/2002 | EP1193738A2 Method and apparatus for manufacturing chips |
| 04/03/2002 | EP1193280A1 Polyimide resin, resin composition with improved moisture resistance comprising the same, adhesive solution, filmy bonding member, layered adhesive film, and processes for producing these |
| 04/03/2002 | EP1193056A1 Silicone elastomer stamp with hydrophilic surfaces and method of making same |
| 04/03/2002 | EP1193040A1 Injection moulded plastic element and use |
| 04/03/2002 | EP1193018A2 Soldering apparatus |
| 04/03/2002 | EP1192848A1 Tooling fixture |
| 04/03/2002 | EP1192842A1 A method and an arrangement for the electrical contact of components |
| 04/03/2002 | EP1192841A1 Intelligent power module |
| 04/03/2002 | EP1192682A1 Ablative method for forming rf ceramic block filters |
| 04/03/2002 | EP1192654A1 Electrical-mechanical connection between electronic circuit systems and substrates and method for the production thereof |
| 04/03/2002 | EP1192472A1 Wedge mount for integrated circuit sensors |
| 04/03/2002 | EP1192199A1 Phenol-novolacs with improved optical properties |
| 04/03/2002 | EP1192047A1 Wiper blades for screen printing |
| 04/03/2002 | EP0995235B1 Contact for very small liaison contacts and method for producing a contact |
| 04/03/2002 | EP0950271B1 Component for contacting a measuring unit and method for its production |
| 04/03/2002 | EP0834242B1 Connection substrate |
| 04/03/2002 | CN1343440A Method and arrangement for electrical contact of componnets |
| 04/03/2002 | CN1343365A Arrangement for enabling trimming on substrate and method of producing substrate that enables trimming |
| 04/03/2002 | CN1343320A Liquid crystal display and its inspecting method |
| 04/03/2002 | CN1343200A Method for producing alkanesulfonic acids |
| 04/03/2002 | CN1343090A Connection method for printing insulating layer of laminated electronic device |
| 04/03/2002 | CN1343089A Printed circuit board with channel and manufacturing method thereof |
| 04/03/2002 | CN1343088A Technology for making high-accuracy flexible circuit board |
| 04/03/2002 | CN1343087A 线路板 PCB |
| 04/03/2002 | CN1343086A 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 04/03/2002 | CN1082332C Multilayer printed circuit board |
| 04/03/2002 | CN1082251C 坐标输入装置 Coordinate input means |
| 04/02/2002 | US6366467 Dual-socket interposer and method of fabrication therefor |
| 04/02/2002 | US6366466 Multi-layer printed circuit board with signal traces of varying width |
| 04/02/2002 | US6366331 Active matrix liquid-crystal display device having improved terminal connections |
| 04/02/2002 | US6366194 Component holder for a hall sensor and process for manufacturing a component holder |
| 04/02/2002 | US6366192 Structure of making a thick film low value high frequency inductor |
| 04/02/2002 | US6365977 Insulating interposer between two electronic components and process thereof |
| 04/02/2002 | US6365974 Flex circuit substrate for an integrated circuit package |
| 04/02/2002 | US6365973 Filled solder |
| 04/02/2002 | US6365965 Power semiconductor module with terminals having holes for better adhesion |
| 04/02/2002 | US6365962 Flip-chip on flex for high performance packaging applications |
| 04/02/2002 | US6365949 Substrate having a unidirectional conductivity perpendicular to its surface, devices comprising such a substrate and methods for manufacturing such a substrate |