| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/11/2002 | US20020041146 Display device using COF |
| 04/11/2002 | US20020041110 Vehicle inner circuit panel, vehicle panel assembly and vehicle panel assembly wirign construction |
| 04/11/2002 | US20020041036 Microelectronic assemblies with composite conductive elements |
| 04/11/2002 | US20020041032 Copper clad laminate |
| 04/11/2002 | US20020041025 Semiconductor device and method of manufacturing the same |
| 04/11/2002 | US20020041014 Semiconductor component having a chip carrier with openings for making contact |
| 04/11/2002 | US20020041009 Transmission line assembly chip and a manufacturing method thereof in a multi-chip module |
| 04/11/2002 | US20020040923 Contact structure for connecting two substrates and also process for producing such a contact structure |
| 04/11/2002 | US20020040922 Multi-modal soldering inspection system |
| 04/11/2002 | US20020040893 Method and apparatus for drilling printed wiring boards |
| 04/11/2002 | US20020040811 Processor power delivery system |
| 04/11/2002 | US20020040810 Mounting electronic components |
| 04/11/2002 | US20020040809 Multilayer type printed-wiring board and method of measuring impedance of multilayer type printed-wiring board |
| 04/11/2002 | US20020040808 Method of making a gasket on a PCB and a PCB |
| 04/11/2002 | US20020040804 Electrically conductive wire |
| 04/11/2002 | US20020040760 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same |
| 04/11/2002 | US20020040758 Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material |
| 04/11/2002 | US20020040654 Device to produce electronic circuits |
| 04/11/2002 | US20020040624 Solder paste |
| 04/11/2002 | US20020040522 Process for the production of composite ceramic printed wiring board |
| 04/11/2002 | US20020040521 Methods of bonding solder balls to bond pads on a substrate, and bonding frames |
| 04/11/2002 | US20020040519 Method of detecting position of printed-wiring board, and method and system for effecting working operation on the board, using detected board position |
| 04/11/2002 | DE10149559A1 Verfahren und Vorrichtung zum Bohren gedruckter Verdrahtungsplatten Method and apparatus for drilling printed wiring boards |
| 04/11/2002 | DE10135479A1 Eingangs-/Ausgangsverbinder für ein tragbares Kommunikationsgerät mit einer Leiterplatte Input / output connector for a portable communication device with a printed circuit board |
| 04/11/2002 | DE10050167A1 Production of electrically conducting pathways on an insulating substrate comprises forming the pathways in a layer made of metallic molybdenum and/or tungsten powder applied on the substrate using an IR laser |
| 04/11/2002 | DE10047972A1 Verfahren zur Herstellung einer Transponderspule A method for producing a transponder coil |
| 04/11/2002 | DE10043814C1 Continuous electrochemical treatment of circuit boards or other goods, comprises placing electrically-insulating, ion-permeable material between electrodes and objects |
| 04/11/2002 | CA2424945A1 Transparent substrate and hinged optical assembly |
| 04/11/2002 | CA2423066A1 Method for enhancing the solderability of a surface |
| 04/11/2002 | CA2417071A1 Bath and method of electroless plating of silver on metal surfaces |
| 04/10/2002 | EP1196020A2 Method of detecting position of printed-wiring board |
| 04/10/2002 | EP1196016A2 Wiring substrate and manufacturing method of the same along with electroless copper plating solution used therefor |
| 04/10/2002 | EP1196015A1 Method for soldering and soldered joint |
| 04/10/2002 | EP1196014A1 Printed wiring board unit, hierarchical mounting auxiliary substrate and electronic apparatus |
| 04/10/2002 | EP1196013A2 Printed circuit board and manufacturing method of the printed circuit board |
| 04/10/2002 | EP1195839A1 Waveguide coupler |
| 04/10/2002 | EP1195818A2 Display device using cof |
| 04/10/2002 | EP1195776A2 Wiring boards and processes for manufacturing wiring boards |
| 04/10/2002 | EP1195746A2 Semiconductor device, semiconductor module and hard disk |
| 04/10/2002 | EP1195218A2 Curcuit board cooling apparatus with air guide plates |
| 04/10/2002 | EP1195217A1 Method of soldering using lead-free solder and bonded article prepared through soldering by the method |
| 04/10/2002 | EP1195083A1 Underfilling material for semiconductor package |
| 04/10/2002 | EP1195082A2 Printed circuit fabrication |
| 04/10/2002 | EP1195081A1 Transition between asymmetric stripline and microstrip in cavity |
| 04/10/2002 | EP1195080A1 Transition between symmetric stripline and asymmetric stripline |
| 04/10/2002 | EP1195079A1 An arrangement for mounting chips in multilayer printed circuit boards |
| 04/10/2002 | EP1194955A1 High-density electronic package, and method for making same |
| 04/10/2002 | EP1050201B1 Rotative cutting method and device for printed circuit boards and electric conductors |
| 04/10/2002 | EP1046198B1 Electric connector |
| 04/10/2002 | EP0908312B1 Screen printing method and screen printing press |
| 04/10/2002 | EP0692137B1 Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors |
| 04/10/2002 | CN2485915Y Back inserting needle for circuit board |
| 04/10/2002 | CN1344484A Method for mfg multilayer printed circuit board and composite foil for use therein |
| 04/10/2002 | CN1344483A Method for introducing plated-through holes in electrically insulating base material that is provided with layers on both sides |
| 04/10/2002 | CN1344286A Urethane oligomer, resin compsns. thereof, and cured article thereof |
| 04/10/2002 | CN1344184A Polymer-coated metal composites by dip autopolymerization |
| 04/10/2002 | CN1344134A Method for increasing adhesion property of macromolecular material and metal surface |
| 04/10/2002 | CN1344133A Mfg. method of circuit device |
| 04/10/2002 | CN1344132A Technology for laminating 6-layer circuit board suitable for high-speed signals and its product |
| 04/10/2002 | CN1344131A Laser perforation method for PCB and substrate |
| 04/10/2002 | CN1344130A Technology for laminating 6-layer circuit board and its product |
| 04/10/2002 | CN1344129A Technology for laminating 6-layer circuit board and its product |
| 04/10/2002 | CN1344128A Technology for laminating 6-layer circuit board and its product |
| 04/10/2002 | CN1344025A Distribution base, its mfg. method, displaying device and electronic device |
| 04/10/2002 | CN1344022A Surface electrode structure on ceramic multilayer substrate and its mfg. method |
| 04/10/2002 | CN1344019A Method for forming end face electrode |
| 04/10/2002 | CN1082783C Multilayer printed circuit boards |
| 04/10/2002 | CN1082712C Method of mfg. electric bulb for display |
| 04/10/2002 | CN1082679C Photosensitive resin compsn. for sandblast resist layer |
| 04/10/2002 | CN1082441C Screen printer and screen printing method |
| 04/10/2002 | CN1082422C Process for mfg. resin-encapsulated electronic product |
| 04/10/2002 | CN1082400C Method for coating polymerization on metal substrates |
| 04/09/2002 | US6370034 Printed circuit board for electrical devices having RF components, particularly for mobile radio telecommunication devices |
| 04/09/2002 | US6370032 Compliant microelectronic mounting device |
| 04/09/2002 | US6370030 Device and method in electronics systems |
| 04/09/2002 | US6370012 Capacitor laminate for use in printed circuit board and as an interconnector |
| 04/09/2002 | US6369877 System, method and article of manufacture for direct image processing of printed circuit boards |
| 04/09/2002 | US6369595 CSP BGA test socket with insert and method |
| 04/09/2002 | US6369591 Apparatus and method using photoelectric effect for testing electrical traces |
| 04/09/2002 | US6369451 Solder balls and columns with stratified underfills on substrate for flip chip joining |
| 04/09/2002 | US6369450 Method of producing mounting structure and mounting structure produced by the same |
| 04/09/2002 | US6369383 Flexboard reflector |
| 04/09/2002 | US6369354 Excimer laser ablation process control of multilaminate materials |
| 04/09/2002 | US6369345 Method and apparatus for reflowing solder paste using a light source |
| 04/09/2002 | US6369336 Printed circuit board |
| 04/09/2002 | US6369335 Mother substrate, substrate element and method for manufacturing the same |
| 04/09/2002 | US6369334 Printed circuit board with wire adds and component adds having 7-shaped and semicircular terminations |
| 04/09/2002 | US6369333 Flexible connection system |
| 04/09/2002 | US6369332 Metal-base multilayer circuit substrate with heat conducting adhesive |
| 04/09/2002 | US6368897 Method for manufactoring and using stencil/screen |
| 04/09/2002 | US6368716 Flame retardant adhesive composition and laminates |
| 04/09/2002 | US6368697 Method of manufacturing an interlayer via and a laminate precursor useful for same |
| 04/09/2002 | US6368540 Process of shaping a printed circuit board |
| 04/09/2002 | US6368482 Plating processes utilizing high intensity acoustic beams |
| 04/09/2002 | US6368412 Apparatus with high temperature gas releasing means for vapor deposition of parylene polymer without peeling |
| 04/09/2002 | US6368147 Zero insertion force percutaneous connector and flexible brain probe assembly |
| 04/09/2002 | US6368136 Locking assembly for securing semiconductor device to carrier substrate |
| 04/09/2002 | US6368119 Electrical connection box |
| 04/09/2002 | US6368115 Method and apparatus for connecting circuit boards |
| 04/09/2002 | US6367763 Test mounting for grid array packages |