Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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04/17/2002 | EP1197974A2 Housing for an electronic component |
04/17/2002 | EP1197586A2 Electrolyte |
04/17/2002 | EP1197267A1 Viscous material applicator |
04/17/2002 | EP1197131A1 A via connector and method of making same |
04/17/2002 | EP1197130A1 Circuitry with integrated passive components and method for producing same |
04/17/2002 | EP1197128A1 A printed circuit board |
04/17/2002 | EP1196966A1 Connector and method for establishing solderfree connections between a rigid main pcb and associated conductors |
04/17/2002 | EP1196960A1 Electrical transmission arrangement |
04/17/2002 | EP1196830A1 A printed circuit production method |
04/17/2002 | EP1196820A2 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows |
04/17/2002 | EP1196798A1 Optical wavelength division multiplexer/demultiplexer having preformed passively aligned optics |
04/17/2002 | EP1196293A2 Apparatus for aligning a flexible circuit on an ink jet printer carriage |
04/17/2002 | EP1196288A1 Method and apparatus for dispensing viscous material |
04/17/2002 | EP1196283A1 Barrier laminate |
04/17/2002 | EP1070444B1 Method and device for producing thin-layer structures |
04/17/2002 | CN2486512Y Vertical isolation support frame of circuit board |
04/17/2002 | CN1345176A Manufacture of modular board |
04/17/2002 | CN1345087A Contact component and its manufacture and probe contact assembly using the contact component |
04/17/2002 | CN1345033A Magnetic head gimbal assembly |
04/17/2002 | CN1083234C Through-connected printed circuit board or process for producing multilayered printed circuit board |
04/17/2002 | CN1083155C Method of bulging substrate by holding soldering paste stacking |
04/17/2002 | CN1083115C Castable composition and rough dielectric sheet |
04/17/2002 | CN1083109C Liquid crystal display and manufacture thereof |
04/17/2002 | CN1083014C Rolled copper foil for flexible PCB and its manufacturing method |
04/17/2002 | CN1082888C laminate and method for preparing same |
04/17/2002 | CN1082842C Ammonia-free deposition of copper by disproportionation |
04/16/2002 | US6373942 Hands-free communication device |
04/16/2002 | US6373736 Isolated converter |
04/16/2002 | US6373718 Construction of fixing flexible sheet on electronic device |
04/16/2002 | US6373717 Electronic package with high density interconnect layer |
04/16/2002 | US6373716 Printed circuit board for surface connection and electronic apparatus employing the same |
04/16/2002 | US6373714 Surface mounting part |
04/16/2002 | US6373709 Flexible wiring board |
04/16/2002 | US6373673 Multi-functional energy conditioner |
04/16/2002 | US6373371 Preformed thermal fuse |
04/16/2002 | US6373269 Circuit board particularly adapted for use with high density test point in-circuit testers |
04/16/2002 | US6373267 Ball grid array-integrated circuit testing device |
04/16/2002 | US6373212 Electric connector |
04/16/2002 | US6373131 TBGA semiconductor package |
04/16/2002 | US6373026 Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board |
04/16/2002 | US6373000 Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board |
04/16/2002 | US6372999 Multilayer wiring board and multilayer wiring package |
04/16/2002 | US6372998 Electrical component connecting structure of wiring board |
04/16/2002 | US6372992 Circuit protective composites |
04/16/2002 | US6372985 Package for electronic components |
04/16/2002 | US6372699 Dissolving oxygen into water to saturate; adding ammonia and hydrogen peroxide |
04/16/2002 | US6372676 Glass comprising calcium-aluminum-boron-silicon oxide that produces crystalline wollastonite upon firing; and alumina, mullite, cordierite, or forsterite |
04/16/2002 | US6372624 Method for fabricating solder bumps by wave soldering |
04/16/2002 | US6372622 Fine pitch bumping with improved device standoff and bump volume |
04/16/2002 | US6372620 Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device |
04/16/2002 | US6372547 Method for manufacturing electronic device with resin layer between chip carrier and circuit wiring board |
04/16/2002 | US6372543 Wrap-around interconnect for fine pitch ball grid array |
04/16/2002 | US6372540 Moisture-resistant integrated circuit chip package and method |
04/16/2002 | US6372364 Nanostructure coatings |
04/16/2002 | US6372113 Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same |
04/16/2002 | US6372101 Apparatus for preventing drag-out |
04/16/2002 | US6372077 Method for isolating ultrafine and fine particles and resulting particles |
04/16/2002 | US6372061 Rolled copper foil for flexible printed circuit and method of manufacturing the same |
04/16/2002 | US6372055 Method for replenishing baths |
04/16/2002 | US6372027 Organometallic layer deposited on inorganic substrate by treating with composition comprising a silane, an azole, an oxygen carrier, an acid |
04/16/2002 | US6371898 Tool-change system for a machine tool with a number of machining heads |
04/16/2002 | US6371805 Cable assembly and method for making the same |
04/16/2002 | US6371799 Interfaces and housing for a vehicle electric power distribution system |
04/16/2002 | US6371017 Printing method and printing apparatus |
04/16/2002 | US6370768 Circuit board, a method for manufacturing same, and a method of electroless plating |
04/16/2002 | US6370766 Manufacture of printed circuit cards |
04/16/2002 | US6370748 Device to produce multi-layer electronic circuits |
04/11/2002 | WO2002030170A1 Methods of manufacturing a printed circuit board shielded against interfering radiation |
04/11/2002 | WO2002030167A1 Process for producing circuit substrate |
04/11/2002 | WO2002030166A2 Compliant attachment interface |
04/11/2002 | WO2002030165A2 Apparatus for coupling power to electronics module |
04/11/2002 | WO2002029923A1 Self-aligned transition between a transmission line and a module |
04/11/2002 | WO2002029770A1 Display module |
04/11/2002 | WO2002029496A1 Resist stripping process |
04/11/2002 | WO2002029465A1 Transparent substrate and hinged optical assembly |
04/11/2002 | WO2002029383A2 Optical inspection system having integrated component learning |
04/11/2002 | WO2002029137A2 Method and associated apparatus for tilting a substrate upon entry for metal deposition |
04/11/2002 | WO2002029135A1 Method for enhancing the solderability of a surface |
04/11/2002 | WO2002029132A1 Bath and method of electroless plating of silver on metal surfaces |
04/11/2002 | WO2002028981A1 Hydrophobic composition and use on a substrate for preventing ice formation and corrosion |
04/11/2002 | WO2002028662A1 Card type recording medium and production method therefor |
04/11/2002 | WO2002028638A1 Circuit protective composites |
04/11/2002 | WO2002028589A1 Method and device for applying pieces of material to a workpiece |
04/11/2002 | WO2002028588A1 Method and device for applying material to a workpiece |
04/11/2002 | WO2002028586A1 Method for applying solder to a substrate or a chip without using flux |
04/11/2002 | WO2002028585A2 Method for ablating points of contact (debumping) |
04/11/2002 | WO2002028584A1 System and method for mounting electronic components onto flexible substrates |
04/11/2002 | WO2002028583A1 System and method for mounting electronic components onto flexible substrates |
04/11/2002 | WO2001078199A3 Printed circuit board assembly |
04/11/2002 | US20020042906 Apparatus for and method of preparing pattern data of electronic part |
04/11/2002 | US20020042904 Placement/net wiring processing system |
04/11/2002 | US20020042214 Processor power delivery system |
04/11/2002 | US20020042198 Method in etching of a substrate |
04/11/2002 | US20020042164 Electronic device assembly and a method of connecting electronic devices constituting the same |
04/11/2002 | US20020041950 Wiring boards and processes for manufacturing wiring boards |
04/11/2002 | US20020041740 Transparent substrate and hinged optical assembly |
04/11/2002 | US20020041489 Semiconductor package with stress inhibiting intermediate mounting substrate |
04/11/2002 | US20020041485 Circuit board cooling apparatus with air guide plates |
04/11/2002 | US20020041219 Surface mount RC devices |
04/11/2002 | US20020041188 Method and apparatus for inspecting printed wiring boards |