Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
04/2002
04/17/2002EP1197974A2 Housing for an electronic component
04/17/2002EP1197586A2 Electrolyte
04/17/2002EP1197267A1 Viscous material applicator
04/17/2002EP1197131A1 A via connector and method of making same
04/17/2002EP1197130A1 Circuitry with integrated passive components and method for producing same
04/17/2002EP1197128A1 A printed circuit board
04/17/2002EP1196966A1 Connector and method for establishing solderfree connections between a rigid main pcb and associated conductors
04/17/2002EP1196960A1 Electrical transmission arrangement
04/17/2002EP1196830A1 A printed circuit production method
04/17/2002EP1196820A2 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows
04/17/2002EP1196798A1 Optical wavelength division multiplexer/demultiplexer having preformed passively aligned optics
04/17/2002EP1196293A2 Apparatus for aligning a flexible circuit on an ink jet printer carriage
04/17/2002EP1196288A1 Method and apparatus for dispensing viscous material
04/17/2002EP1196283A1 Barrier laminate
04/17/2002EP1070444B1 Method and device for producing thin-layer structures
04/17/2002CN2486512Y Vertical isolation support frame of circuit board
04/17/2002CN1345176A Manufacture of modular board
04/17/2002CN1345087A Contact component and its manufacture and probe contact assembly using the contact component
04/17/2002CN1345033A Magnetic head gimbal assembly
04/17/2002CN1083234C Through-connected printed circuit board or process for producing multilayered printed circuit board
04/17/2002CN1083155C Method of bulging substrate by holding soldering paste stacking
04/17/2002CN1083115C Castable composition and rough dielectric sheet
04/17/2002CN1083109C Liquid crystal display and manufacture thereof
04/17/2002CN1083014C Rolled copper foil for flexible PCB and its manufacturing method
04/17/2002CN1082888C laminate and method for preparing same
04/17/2002CN1082842C Ammonia-free deposition of copper by disproportionation
04/16/2002US6373942 Hands-free communication device
04/16/2002US6373736 Isolated converter
04/16/2002US6373718 Construction of fixing flexible sheet on electronic device
04/16/2002US6373717 Electronic package with high density interconnect layer
04/16/2002US6373716 Printed circuit board for surface connection and electronic apparatus employing the same
04/16/2002US6373714 Surface mounting part
04/16/2002US6373709 Flexible wiring board
04/16/2002US6373673 Multi-functional energy conditioner
04/16/2002US6373371 Preformed thermal fuse
04/16/2002US6373269 Circuit board particularly adapted for use with high density test point in-circuit testers
04/16/2002US6373267 Ball grid array-integrated circuit testing device
04/16/2002US6373212 Electric connector
04/16/2002US6373131 TBGA semiconductor package
04/16/2002US6373026 Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board
04/16/2002US6373000 Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board
04/16/2002US6372999 Multilayer wiring board and multilayer wiring package
04/16/2002US6372998 Electrical component connecting structure of wiring board
04/16/2002US6372992 Circuit protective composites
04/16/2002US6372985 Package for electronic components
04/16/2002US6372699 Dissolving oxygen into water to saturate; adding ammonia and hydrogen peroxide
04/16/2002US6372676 Glass comprising calcium-aluminum-boron-silicon oxide that produces crystalline wollastonite upon firing; and alumina, mullite, cordierite, or forsterite
04/16/2002US6372624 Method for fabricating solder bumps by wave soldering
04/16/2002US6372622 Fine pitch bumping with improved device standoff and bump volume
04/16/2002US6372620 Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device
04/16/2002US6372547 Method for manufacturing electronic device with resin layer between chip carrier and circuit wiring board
04/16/2002US6372543 Wrap-around interconnect for fine pitch ball grid array
04/16/2002US6372540 Moisture-resistant integrated circuit chip package and method
04/16/2002US6372364 Nanostructure coatings
04/16/2002US6372113 Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same
04/16/2002US6372101 Apparatus for preventing drag-out
04/16/2002US6372077 Method for isolating ultrafine and fine particles and resulting particles
04/16/2002US6372061 Rolled copper foil for flexible printed circuit and method of manufacturing the same
04/16/2002US6372055 Method for replenishing baths
04/16/2002US6372027 Organometallic layer deposited on inorganic substrate by treating with composition comprising a silane, an azole, an oxygen carrier, an acid
04/16/2002US6371898 Tool-change system for a machine tool with a number of machining heads
04/16/2002US6371805 Cable assembly and method for making the same
04/16/2002US6371799 Interfaces and housing for a vehicle electric power distribution system
04/16/2002US6371017 Printing method and printing apparatus
04/16/2002US6370768 Circuit board, a method for manufacturing same, and a method of electroless plating
04/16/2002US6370766 Manufacture of printed circuit cards
04/16/2002US6370748 Device to produce multi-layer electronic circuits
04/11/2002WO2002030170A1 Methods of manufacturing a printed circuit board shielded against interfering radiation
04/11/2002WO2002030167A1 Process for producing circuit substrate
04/11/2002WO2002030166A2 Compliant attachment interface
04/11/2002WO2002030165A2 Apparatus for coupling power to electronics module
04/11/2002WO2002029923A1 Self-aligned transition between a transmission line and a module
04/11/2002WO2002029770A1 Display module
04/11/2002WO2002029496A1 Resist stripping process
04/11/2002WO2002029465A1 Transparent substrate and hinged optical assembly
04/11/2002WO2002029383A2 Optical inspection system having integrated component learning
04/11/2002WO2002029137A2 Method and associated apparatus for tilting a substrate upon entry for metal deposition
04/11/2002WO2002029135A1 Method for enhancing the solderability of a surface
04/11/2002WO2002029132A1 Bath and method of electroless plating of silver on metal surfaces
04/11/2002WO2002028981A1 Hydrophobic composition and use on a substrate for preventing ice formation and corrosion
04/11/2002WO2002028662A1 Card type recording medium and production method therefor
04/11/2002WO2002028638A1 Circuit protective composites
04/11/2002WO2002028589A1 Method and device for applying pieces of material to a workpiece
04/11/2002WO2002028588A1 Method and device for applying material to a workpiece
04/11/2002WO2002028586A1 Method for applying solder to a substrate or a chip without using flux
04/11/2002WO2002028585A2 Method for ablating points of contact (debumping)
04/11/2002WO2002028584A1 System and method for mounting electronic components onto flexible substrates
04/11/2002WO2002028583A1 System and method for mounting electronic components onto flexible substrates
04/11/2002WO2001078199A3 Printed circuit board assembly
04/11/2002US20020042906 Apparatus for and method of preparing pattern data of electronic part
04/11/2002US20020042904 Placement/net wiring processing system
04/11/2002US20020042214 Processor power delivery system
04/11/2002US20020042198 Method in etching of a substrate
04/11/2002US20020042164 Electronic device assembly and a method of connecting electronic devices constituting the same
04/11/2002US20020041950 Wiring boards and processes for manufacturing wiring boards
04/11/2002US20020041740 Transparent substrate and hinged optical assembly
04/11/2002US20020041489 Semiconductor package with stress inhibiting intermediate mounting substrate
04/11/2002US20020041485 Circuit board cooling apparatus with air guide plates
04/11/2002US20020041219 Surface mount RC devices
04/11/2002US20020041188 Method and apparatus for inspecting printed wiring boards