| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 04/23/2002 | US6376782 Resinous circuit board with pins improved in joining strength |
| 04/23/2002 | US6376780 Method for strengthening air bridge circuits |
| 04/23/2002 | US6376778 Printed circuit board assembly |
| 04/23/2002 | US6376769 High-density electronic package, and method for making same |
| 04/23/2002 | US6376158 Methods for selectively filling apertures |
| 04/23/2002 | US6376134 Automated, flow-through, dual side, laser direct imaging process and apparatus which provides capability to simultaneously register and image both sides of substrate in continuous flow-through process |
| 04/23/2002 | US6376053 Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same |
| 04/23/2002 | US6376052 Multilayer printed wiring board and its production process, resin composition for filling through-hole |
| 04/23/2002 | US6376051 Mounting structure for an electronic component and method for producing the same |
| 04/23/2002 | US6376050 Electric connecting method and apparatus |
| 04/23/2002 | US6376049 Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
| 04/23/2002 | US6376008 Resin/copper/metal laminate and method of producing same |
| 04/23/2002 | US6375823 Plating method and plating apparatus |
| 04/23/2002 | US6375822 Method for enhancing the solderability of a surface |
| 04/23/2002 | US6375731 Cationic conditioning agent, binder or an anionic dispersant that improve the adhesion of carbon particles and coverage, printed circuit board |
| 04/23/2002 | US6375494 Metal component carrier |
| 04/23/2002 | US6375475 Method and structure for controlled shock and vibration of electrical interconnects |
| 04/23/2002 | US6375472 Apparatus and method of mounting a bracket apparatus to a circuit board |
| 04/23/2002 | US6375365 Apparatus and packaging method to assemble optical modules to a common substrate with adjustable plugs |
| 04/23/2002 | US6375088 Fluid delivery device with pulsating linear discharge and fluid cleaning method |
| 04/23/2002 | US6375064 Method of forming projecting electrodes and method of manufacturing semiconductor device provided with projecting electrodes |
| 04/23/2002 | US6375063 Multi-step stud design and method for producing closely packed interconnects in magnetic recording heads |
| 04/23/2002 | US6375062 Surface bumping method and structure formed thereby |
| 04/23/2002 | US6375060 Fluxless solder attachment of a microelectronic chip to a substrate |
| 04/23/2002 | US6374733 Method of manufacturing ceramic substrate |
| 04/23/2002 | US6374729 Apparatus for transporting circuit boards in a screen printer |
| 04/23/2002 | US6374487 Method of making a connection to a microelectronic element |
| 04/18/2002 | WO2002032203A1 A method of making a gasket on a pcb and a pcb |
| 04/18/2002 | WO2002032201A1 Method of jetting viscous medium |
| 04/18/2002 | WO2002032200A1 Substrate cleaning |
| 04/18/2002 | WO2002032199A1 Printed circuit board and method for producing a printed circuit board of this type and for producing a laminar composite material for such a printed circuit board |
| 04/18/2002 | WO2002032198A2 Microelectronic magnetic structure, device including the structure, and methods of forming the structure and device |
| 04/18/2002 | WO2002032193A1 Method and structure for substrate having inserted electrodes for flat display device and the device using the structure |
| 04/18/2002 | WO2002031922A1 Method for connecting flat film cables |
| 04/18/2002 | WO2002031516A1 Module for a testing device for testing printed circuit boards |
| 04/18/2002 | WO2002031221A1 Method of producing a metallised product |
| 04/18/2002 | WO2002031214A1 Metallized film, method for the production thereof, and its use |
| 04/18/2002 | WO2002031068A1 Ink-jet ink and process for producing the same |
| 04/18/2002 | WO2002031054A1 Curable composition, varnish, and layered product |
| 04/18/2002 | WO2002031027A1 Coating composition |
| 04/18/2002 | WO2002030668A1 Hot lamination of a dry photoresist film onto a board for printed circuit |
| 04/18/2002 | WO2002030665A1 Film with multilayered metal and process for producing the same |
| 04/18/2002 | WO2002030636A1 Circuit board production method and circuit board production data |
| 04/18/2002 | WO2002013585A3 Electrical assembly and method for producing said electrical assembly |
| 04/18/2002 | WO2002008347A3 Resist ink composition |
| 04/18/2002 | WO2001091525A3 High-speed fabrication of highly uniform ultra-small metallic microspheres |
| 04/18/2002 | WO2001091176A3 Trilayer/bilayer solder bumps and fabrication methods therefor |
| 04/18/2002 | WO2001063994A3 Tamper proof case for electronic devices having memories with sensitive information |
| 04/18/2002 | WO2001004643A3 Wafer-level burn-in and test cartridge and methods |
| 04/18/2002 | US20020045394 Wiring board and a process of producing a wiring board |
| 04/18/2002 | US20020045368 Electrical connector |
| 04/18/2002 | US20020045366 Electrical connector |
| 04/18/2002 | US20020045346 Formation of diamond particle interconnects |
| 04/18/2002 | US20020045330 Kinetically controlled solder bonding |
| 04/18/2002 | US20020045294 A method for creating printed circuit board substrates having solder mask-free edges |
| 04/18/2002 | US20020045281 Alignment check method on printed circuit board |
| 04/18/2002 | US20020045135 Having a conductive via that is filled with an adequate amount of a conductive material to provide an electrical connection. |
| 04/18/2002 | US20020045058 Injection-molded plastic part |
| 04/18/2002 | US20020045042 Good adhesion of metal layer on surface of insulation activated by plasma treatment; molded circuit substrates |
| 04/18/2002 | US20020045036 Bga solder ball shear strength |
| 04/18/2002 | US20020044431 Microchip controller board and manufacturing method thereof |
| 04/18/2002 | US20020044429 Control module for a motor vehicle cab |
| 04/18/2002 | US20020044401 Multi-functional energy conditioner |
| 04/18/2002 | US20020044331 Busbars for electrically powered cells |
| 04/18/2002 | US20020044329 Electrooptical unit and electronic apparatus |
| 04/18/2002 | US20020044033 Waveguide coupler |
| 04/18/2002 | US20020044030 Radio frequency module parts including surface elastic wave elements and manufacturing method thereof |
| 04/18/2002 | US20020044029 Surface mount RC devices |
| 04/18/2002 | US20020044022 Oscillator and an oscillator characteristic adjustment method |
| 04/18/2002 | US20020043982 Apparatus for inspecting display board or circuit board |
| 04/18/2002 | US20020043726 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer |
| 04/18/2002 | US20020043711 Stereolithographic method and apparatus for fabricating stabilizers for flip-chip type semiconductor devices and resulting structures |
| 04/18/2002 | US20020043705 Semiconductor device and its manufacturing method |
| 04/18/2002 | US20020043652 Conductive adhesive and packaging structure using the same |
| 04/18/2002 | US20020043570 Dispensing assembly |
| 04/18/2002 | US20020043556 Low-cost high-density gang-punch |
| 04/18/2002 | US20020043552 High-speed direct writing with metallic microspheres |
| 04/18/2002 | US20020043549 Sealant against potting compound |
| 04/18/2002 | US20020043402 Printed circuit board with integral heat sink for semiconductor package |
| 04/18/2002 | US20020043399 Multilayered wiring board, a production process for, and semiconductor device using, the same |
| 04/18/2002 | US20020043398 Conductive plastic, conductive circuits formed thereof, and method of forming the conductive circuits |
| 04/18/2002 | US20020043396 Connection method and connection structure of pad electrodes, and inspecting methods for connection state thereof |
| 04/18/2002 | US20020043395 Via connector and method of making same |
| 04/18/2002 | US20020043107 Copper face rust-inhibiting film thickness measuring method and apparatus |
| 04/18/2002 | US20020042994 Structure and method for laminating and fixing thin plate parts and method for fabricating ink-jet printer head |
| 04/18/2002 | US20020042988 Method and apparatus in a production line |
| 04/18/2002 | US20020042960 Soldering iron cleaning apparatus |
| 04/18/2002 | DE10101948A1 Verfahren zum Anordnen eines Halbleiterchips auf einem Substrat und auf einem Substrat montierbarer Halbleiterbaustein A method for disposing a semiconductor chip on a substrate and on a substrate mountable semiconductor module |
| 04/18/2002 | DE10051337A1 Semiconductor module used in electronic devices comprises a conductor plate having a lower insulation layer connected to a conducting layer via a device for shutting off the potential |
| 04/18/2002 | DE10047897A1 Electronic subassembly e.g. for SMD-components, has metal bridges/webs embedded in electrically-insulating material of assembly board |
| 04/18/2002 | DE10044441A1 Ceramic carrier e.g. circular ceramic heating plate for electric oven, has electric terminal joined to carrier via ceramic adaptor |
| 04/18/2002 | DE10029630C2 Vorrichtung zum Schutz von elektronischen Baugruppen gegen Zerstörung durch elektrostatische Entladung Device for protecting electronic components against damage caused by electrostatic discharge |
| 04/17/2002 | EP1198165A2 Shielding method using a ferrite encapsulate coating |
| 04/17/2002 | EP1198164A1 A method of making a gasket on a PCB and a PCB. |
| 04/17/2002 | EP1198163A1 Process for connecting electroconducing tracks which are separated by a laminar insulating material and printed circuit obtained |
| 04/17/2002 | EP1198162A2 Electronic component mounted member and repair method thereof |
| 04/17/2002 | EP1198161A1 Method for securing and processing thin film materials |
| 04/17/2002 | EP1198001A2 Method of testing and mounting devices using a resilient contact structure |
| 04/17/2002 | EP1198000A1 Semiconductor device and assembly board |
| 04/17/2002 | EP1197998A2 Antireflective porogens |