| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 04/25/2002 | WO2001065344A3 Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
| 04/25/2002 | US20020049270 Less anisotropic films |
| 04/25/2002 | US20020049042 RF module |
| 04/25/2002 | US20020049008 Electronic component and a method of manufacturing the same |
| 04/25/2002 | US20020049000 Battery connector |
| 04/25/2002 | US20020048986 Electrical connector with discrete sections |
| 04/25/2002 | US20020048977 Device connection method and structure thereof |
| 04/25/2002 | US20020048974 Electrical component housing structures and their method of manfacture |
| 04/25/2002 | US20020048973 Contact structure and production method thereof and probe contact assembly using same |
| 04/25/2002 | US20020048954 Contact structure and production method thereof and probe contact assembly using same |
| 04/25/2002 | US20020048924 For connecting a nonconducting substrate and a chip without lateral shorting |
| 04/25/2002 | US20020048826 Wafer level burn-in and electrical test system and method |
| 04/25/2002 | US20020048685 Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom |
| 04/25/2002 | US20020048677 Hydrogen peroxide, inorganic acid, corrosion inhibitor, ammonium ion, and water; adhesion between copper circuit trace, and an epoxy insulator |
| 04/25/2002 | US20020048666 Multilayered ceramic board, method for fabricating the same, and electronic device using multilayered ceramic board |
| 04/25/2002 | US20020048664 Light energy is irradiated onto the surface of the high polymer material in a desired area; improving wettability |
| 04/25/2002 | US20020048630 Constructed to prevent corners from peeling and raising off a substrate; has a spiral configuration and includes straight lines and corners connected to the straight lines. |
| 04/25/2002 | US20020048160 Electric component connecting structure |
| 04/25/2002 | US20020048159 Surface-mountable impedance device |
| 04/25/2002 | US20020048156 Flexible wiring substrate and its manufacturing method |
| 04/25/2002 | US20020048137 Two-layered embedded capacitor |
| 04/25/2002 | US20020048009 Balanced positioning system for use lithographic apparatus |
| 04/25/2002 | US20020047978 Semiconductor device, liquid crystal module adopting same, method of manufacturing liquid crystal module, and electronic equipment adopting same |
| 04/25/2002 | US20020047956 Display apparatus |
| 04/25/2002 | US20020047878 Processing method of electroless plating and ink-jet head and production method thereof |
| 04/25/2002 | US20020047772 Electrical-resistant via hole and process of fabricating the same |
| 04/25/2002 | US20020047768 Microelectronic magnetic structure, device including the structure, and methods of forming the structure and device |
| 04/25/2002 | US20020047749 Chip element mounting method and surface-mount type crystal oscillator |
| 04/25/2002 | US20020047720 CSP BGA test socket with insert and method |
| 04/25/2002 | US20020047504 Solder-bonding structure and brushless motor having the same |
| 04/25/2002 | US20020047216 Ball grid array |
| 04/25/2002 | US20020047197 Semiconductor device module frame and group thereof |
| 04/25/2002 | US20020047193 Circuit carrier, in particular printed circuit board |
| 04/25/2002 | US20020047186 Semiconductor leadframes comprising silver plating |
| 04/25/2002 | US20020047133 Chip carrier film, method of manufacturing the chip carrier film and liquid crystal dispaly using the chip carrier film |
| 04/25/2002 | US20020047052 Dispensing assembly |
| 04/25/2002 | US20020047038 Circuit board bonding method, branch circuit and its designing method, waveguide-microstrip transition, and application to HF circuit, antenna and communication system |
| 04/25/2002 | US20020046996 Production of conductor tracks on plastics by means of laser energy |
| 04/25/2002 | US20020046881 Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder |
| 04/25/2002 | US20020046880 Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring board |
| 04/25/2002 | US20020046873 Method for making a flexible circuit interposer having high-aspect ratio conductors |
| 04/25/2002 | US20020046860 Reflow encapsulant |
| 04/25/2002 | US20020046856 Method of reforming reformable members of an electronic package and the resultant electronic package |
| 04/25/2002 | US20020046784 Applying a treatment fluid in lieu of cutting oil during the fabrication of the cutting tool, which include a compound containing phosphorus and nitrogen/hydrogen groups, forming phosphorus based protective layer and hydrid and nitride |
| 04/25/2002 | US20020046627 Solder particles having a specified particle size distribution; storage stability |
| 04/25/2002 | DE10143919A1 Electroconductive paste for forming through hole conductor, contains organic vehicle containing solvent and binder spherical/granular form electroconductive metal powder, and resin powder having low water absorptivity |
| 04/25/2002 | DE10143743A1 Production of a printed circuit board comprises illumination through a resist pattern of a conductive board having at least one photoconductive layer, whose chargeability is altered by illumination |
| 04/25/2002 | DE10127268A1 Printed circuit board as a circuit carrier with two metal outer layers and a metal intermediate layer has insulating layers between the outer and intermediate layers with a cooling component on an outer layer linked via a heat path. |
| 04/25/2002 | DE10054088C1 Kunststoff-Spritzgussteil und Verwendung Plastic injection molding and using |
| 04/25/2002 | DE10052247A1 Schaltungsstrukturen auf thermisch gespritzten Schichten Circuit patterns on thermally sprayed coatings |
| 04/25/2002 | DE10051884A1 Verfahren zur Herstellung von Leiterfolie-Trägergehäuse-Einheiten A process for the production of printed circuit film carrier housing units |
| 04/25/2002 | DE10051560A1 Elektrische Baugruppe mit einer Haltevorrichtung und einem daran festgelegten elektrischen Bauelement An electrical assembly with a holding device and an electrical component secured thereto |
| 04/25/2002 | DE10051547A1 Mounting rack for electrical or electronic components, comprises at least one conduction web with small thermal conduction selection |
| 04/25/2002 | DE10050862A1 Bad und Verfahren zum stromlosen Abscheiden von Silber auf Metalloberflächen Bath and method for electroless plating of silver onto metal surfaces |
| 04/25/2002 | DE10050797A1 Device for making a conductive connection of foil cable ends with anisotropic conductive glues e.g. for motor vehicle, has two plastic support halves, guiders for positioning cable ends and fasteners to keep the ends in a joined position. |
| 04/25/2002 | DE10050591A1 Foil conductor manufacturing method has plastics foils applied to microstructured surfaces of electrical conductor path |
| 04/25/2002 | DE10048873A1 Method and device for producing a multilayer structure for a printed circuit board rolls on a liquid hardening insulation coating on one side of a base board while applying a conductive foil to the coating before hardening. |
| 04/25/2002 | DE10046600A1 Acid aqueous electrolyte, used for coating electronic components with a tin-copper alloy, comprises alkyl sulfonic acids and/or alkanol sulfonic acids, soluble tin (II) salts, soluble copper (II) salts, and organic sulfur compounds |
| 04/25/2002 | DE10028561C2 Verbindungsanordnung Connector assembly |
| 04/25/2002 | CA2425946A1 Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node |
| 04/25/2002 | CA2420031A1 Fine featured moldings of liquid crystalline polymers |
| 04/24/2002 | EP1199915A2 Circuit structures on thermally sprayed layers |
| 04/24/2002 | EP1199914A2 Electrical assembly comprising a holding device and an electrical component attached to it |
| 04/24/2002 | EP1199913A2 Method for making units comprising a circuit foil and a carrier housing |
| 04/24/2002 | EP1199912A2 Carrier structure for spatial shaping of a circuit foil and method therefor |
| 04/24/2002 | EP1199775A2 Method of electrically connecting two devices and structure therefore |
| 04/24/2002 | EP1199571A2 Apparatus for inspecting display board or circuit board |
| 04/24/2002 | EP1199383A2 Seed layer repair bath |
| 04/24/2002 | EP1199328A1 Thermally conductive polymer sheet |
| 04/24/2002 | EP1199123A1 Ultra fine composite metal particles |
| 04/24/2002 | EP1198860A1 Electrical transmission arrangement |
| 04/24/2002 | EP1198831A1 Method for selectively coating ceramic surfaces |
| 04/24/2002 | EP1198799A1 Method of producing pi-conjugated polymers |
| 04/24/2002 | EP1198624A1 Process for electroplating a work piece coated with an electrically conducting polymer |
| 04/24/2002 | EP1198532A1 Dielectric material including particulate filler |
| 04/24/2002 | EP1198352A1 Method and apparatus for dispensing viscous material |
| 04/24/2002 | EP1198351A1 Method and apparatus for dispensing viscous material |
| 04/24/2002 | EP0858859B1 Solder for electronic part bonding electrodes, and soldering method |
| 04/24/2002 | CN2487489Y Three-phase asynchronous induction electromagnetic pump for molten metal soft hard-soldering |
| 04/24/2002 | CN2487477Y Device for aligning row of inserted drills |
| 04/24/2002 | CN1346584A Dispensing assembly |
| 04/24/2002 | CN1346536A Predistortion generator coupled with RF amplifier |
| 04/24/2002 | CN1346513A Metal core substrate printed wiring board enabling thermally enhanced ball grid array (BGA) packages and method |
| 04/24/2002 | CN1346310A Flexible alminate for flexible circuit |
| 04/24/2002 | CN1346309A Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same |
| 04/24/2002 | CN1346299A Dispensing assembly |
| 04/24/2002 | CN1346180A 电路器件 Circuit devices |
| 04/24/2002 | CN1346177A Method for making RF module element iwth sound wave surface wave unit |
| 04/24/2002 | CN1346172A Heat radiation increased and over current load avoided small sized power supply |
| 04/24/2002 | CN1346165A Spring connector for electrically connecting indication screen channel with circuit |
| 04/24/2002 | CN1346147A Circuit board with convex and making method thereof |
| 04/24/2002 | CN1345689A Film adhering device |
| 04/24/2002 | CN1345645A Ultrasonic laser flux-free soft soldering method |
| 04/24/2002 | CN1083685C Apparatus for the wave soldering of circuit boards |
| 04/24/2002 | CN1083301C Vacuum flash exaporated polymer composites |
| 04/23/2002 | US6377468 Electric circuit apparatus |
| 04/23/2002 | US6377465 Printing wiring board |
| 04/23/2002 | US6376921 Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame |
| 04/23/2002 | US6376917 Semiconductor device |
| 04/23/2002 | US6376908 Semiconductor plastic package and process for the production thereof |