| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 05/02/2002 | EP1202401A2 Battery connector |
| 05/02/2002 | EP1202390A2 An electronic component and a method of manufacturing the same |
| 05/02/2002 | EP1202349A2 Semiconductor module and method of manufacturing the same |
| 05/02/2002 | EP1202345A2 Semiconductor power element heat dissipation board, conductor plate therefor, heat sink material and solder material |
| 05/02/2002 | EP1202329A2 Mask Restraining method and apparatus |
| 05/02/2002 | EP1202070A2 Method of inspecting an electrical disconnection between circuits |
| 05/02/2002 | EP1202024A1 Sensor module with stamped sheet metal part ( magneto resistive throttle valve sensor ) |
| 05/02/2002 | EP1201786A2 Seed layer deposition |
| 05/02/2002 | EP1201724A1 Pressure-sensitive adhesive tape for provisionally fixing green sheet for ceramic electronic part and process for producing ceramic electronic part |
| 05/02/2002 | EP1201108A1 A circuit singulation system and method |
| 05/02/2002 | EP1201007A1 Antenna for contactless cards, hybrid cards and electronic labels |
| 05/02/2002 | EP1200989A2 Sputtering process |
| 05/02/2002 | EP1200968A1 Aqueous carbon composition and method for coating a non conductive substrate |
| 05/02/2002 | EP1200533A1 Method of producing a laminated structure |
| 05/02/2002 | EP1200509A1 Composites of powdered fillers and polymer matrix and process for preparing them |
| 05/02/2002 | EP1200340A1 Method for preparing highly stabilised hydroxylamine solutions |
| 05/02/2002 | EP1200224A1 Printhead for jetting a hot liquid medium and method of producing a joint that comprises a metallic solder |
| 05/02/2002 | EP1200223A1 Print chip for a printing head working according to the ink printing principle |
| 05/02/2002 | EP1012354B1 Lead-free tin solder |
| 05/02/2002 | EP1007766B1 Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated |
| 05/02/2002 | EP0966557B1 Circuitry and method for an electroplating plant or etching plant pulse power supply |
| 05/02/2002 | EP0956161A4 Ipc (chip) termination machine |
| 05/02/2002 | DE10052532A1 Arrangement, used as card of sensor, has circuit board with regions separated by slit-like recess which terminates inside circuit board and extends up to moisture-impermeable barrier layer |
| 05/02/2002 | DE10052398A1 Holder for semiconducting lamp has LED pivotably clamped between two sprung metal current carrying strips whose other ends have current connection pins for soldering or plug-in |
| 05/02/2002 | DE10049664A1 Abtragen von Kontaktstellen (De-bumping) Removal of contact points (De-bumping) |
| 05/02/2002 | DE10049301A1 Modul für eine Prüfvorrichtung zum Testen von Leiterplatten Module for a test apparatus for testing printed circuit boards |
| 05/02/2002 | DE10048457A1 Anordnung und Verfahren zum Kontaktieren eines Motor- oder Getriebebauteils an eine elektrische Leiterplatte Apparatus and method for contacting an engine or transmission component of an electrical circuit board |
| 05/02/2002 | DE10047153A1 Fastening unit for attaching electronic components to circuit board, has fastening region constructed for mechanical and electrical surface contact with substrate |
| 05/02/2002 | CA2432333A1 Lead-free chemical nickel alloy |
| 05/02/2002 | CA2426124A1 Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production |
| 05/01/2002 | CN2488629Y End-milling cutter capable of regenerating and reusing for cutting printed circuit board |
| 05/01/2002 | CN1347278A Printed wiring board and method for mfg. same |
| 05/01/2002 | CN1347277A Method for mfg. multilayer printed wiring board and multilayer printed wiring board thereby |
| 05/01/2002 | CN1347276A Method for making multi-layer PCB composed of flexible and rigid layers |
| 05/01/2002 | CN1347275A Soldering method between golden fingers on PCB and pins of flexible printed circuit |
| 05/01/2002 | CN1347274A 多层印刷线路板 Multilayer printed circuit boards |
| 05/01/2002 | CN1347174A Ic插座 Ic Socket |
| 05/01/2002 | CN1347154A Semiconductor device and semiconductor assembly |
| 05/01/2002 | CN1347143A Spiral contactor and mfg. method thereof, semiconductor detection apparatus using same and electronic element |
| 05/01/2002 | CN1347139A Method and device for mfg. electronic parts |
| 05/01/2002 | CN1346755A Pedalling force testing device |
| 05/01/2002 | CN1084136C Circuit-board card with circular welding plate |
| 04/30/2002 | US6381553 Methods and systems for determining a ball-grid array seating plane |
| 04/30/2002 | US6381164 Low profile, high density memory system |
| 04/30/2002 | US6381117 Ceramic electronic component |
| 04/30/2002 | US6380918 Liquid crystal display device |
| 04/30/2002 | US6380754 Removable electrical interconnect apparatuses including an engagement proble |
| 04/30/2002 | US6380681 Video Display and manufacturing method therefor |
| 04/30/2002 | US6380624 Stacked integrated circuit structure |
| 04/30/2002 | US6380621 Semiconductor device and manufacturing method thereof |
| 04/30/2002 | US6380619 Chip-type electronic component having external electrodes that are spaced at predetermined distances from side surfaces of a ceramic substrate |
| 04/30/2002 | US6380616 Semiconductor component with a number of substrate layers and at least one semiconductor chip, and method of producing the semiconductor component |
| 04/30/2002 | US6380513 Method for fixing miniaturized components onto a base plate by soldering |
| 04/30/2002 | US6380511 Laser welded inkjet printhead assembly utilizing a combination laser and fiber optic push connect system |
| 04/30/2002 | US6380494 Micro grid array solder interconnection structure with solder columns for second level packaging joining a module and printed circuit board |
| 04/30/2002 | US6380493 Circuit board |
| 04/30/2002 | US6380491 Method for producing snap fit apertures for RF shield fences |
| 04/30/2002 | US6380487 Circuit board protection system and method |
| 04/30/2002 | US6380343 Applying a curable resin to the flexible circuit which is polybutadiene polyol with a number-average molecular weight of 1,000-8,000 and having 2-10 hydroxy groups per molecuale, and a polybutadiene blocked polyisocyanate, and curing |
| 04/30/2002 | US6380271 Mixing a polybenzoxazole precursor or a polybenzoxazole resin with an oligomer, forming film from resulting mixture, heating film in nitrogen containing oxygen to give rise to thermal decomposition and gasification of oligomer to form resin layer |
| 04/30/2002 | US6380060 Off-center solder ball attach and methods therefor |
| 04/30/2002 | US6380059 Method of breaking electrically conductive traces on substrate into open-circuited state |
| 04/30/2002 | US6379865 Protective coatings deposited by electrophoresis; high electrical resistance; |
| 04/30/2002 | US6379806 Heat-resistant silicone rubber composite sheet having thermal conductivity and method of producing the same |
| 04/30/2002 | US6379784 Aromatic polyimide laminate |
| 04/30/2002 | US6379781 Sheet shaped composite; conductive metal wires |
| 04/30/2002 | US6379772 Avoiding polymer fill of alignment sites |
| 04/30/2002 | US6379755 Cylindrical coil and production process thereof |
| 04/30/2002 | US6379742 Lottery ticket structure |
| 04/30/2002 | US6379569 Masking with hot melt ink |
| 04/30/2002 | US6379487 Forming a laminate for printed circuit boards |
| 04/30/2002 | US6379161 Method of making an electrical connector |
| 04/30/2002 | US6379159 Interposer for chip size package and method for manufacturing the same |
| 04/30/2002 | US6378985 Ink-jet printer having carriage and flexible circuit movably connected, method and apparatus |
| 04/30/2002 | US6378762 Cream solder apparatus and printing method therefor |
| 04/30/2002 | US6378758 Conductive leads with non-wettable surfaces |
| 04/30/2002 | US6378757 Method for edge mounting flex media to a rigid PC board |
| 04/30/2002 | US6378756 Solder ball arrangement device |
| 04/30/2002 | US6378424 Electronic part fabricated by intaglio printing and a method for fabricating the same |
| 04/30/2002 | US6378201 Method for making a printed circuit board |
| 04/30/2002 | US6378199 Multi-layer printed-wiring board process for producing |
| 04/30/2002 | CA2253989C Light emitting diode jig |
| 04/30/2002 | CA2226496C Vacuum flash evaporated polymer composites |
| 04/25/2002 | WO2002034024A1 Sealed housing chamber for a motor vehicle electronic component and method for production thereof |
| 04/25/2002 | WO2002034023A1 Circuit forming board producing method, circuit forming board, and material for circuit forming board |
| 04/25/2002 | WO2002034022A1 Module support for electrical/electronic components |
| 04/25/2002 | WO2002034021A2 Carrier-based electronic module |
| 04/25/2002 | WO2002034020A1 An integrated circuit carrier |
| 04/25/2002 | WO2002034019A1 Method of manufacturing an integrated circuit carrier |
| 04/25/2002 | WO2002034018A1 A multi-chip integrated circuit carrier |
| 04/25/2002 | WO2002034017A2 Fine featured moldings of liquid crystalline polymers |
| 04/25/2002 | WO2002033798A1 Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node |
| 04/25/2002 | WO2002033752A2 Electronic module having canopy-type carriers |
| 04/25/2002 | WO2002033492A1 Nonlinear image distortion correction in printed circuit board manufacturing |
| 04/25/2002 | WO2002032966A1 Photosensitive resin composition, solder resist comprising the same, cover lay film, and printed circuit board |
| 04/25/2002 | WO2002032665A1 A method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article |
| 04/25/2002 | WO2002032660A1 Multilayered metal laminate and process for producing the same |
| 04/25/2002 | WO2002032615A1 Anti-tombstoning solder alloys for surface mount applications |
| 04/25/2002 | WO2002032587A1 Coating device for electric or electronic circuit boards, coating method using this device, and electric or electronic circuit board coated by this method |
| 04/25/2002 | WO2002012114A3 Ceramic microelectromechanical structure |