| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 05/08/2002 | CN1347941A Size for filling through-hole and printing circuit board with the same size |
| 05/08/2002 | CN1084586C Circuit board with primary and secondary through holes |
| 05/08/2002 | CN1084585C Moulded socket for electronic component installation |
| 05/08/2002 | CN1084584C Loop base |
| 05/08/2002 | CN1084548C High frequency amplifier with guard circuit and radio transmitting apparatus including the same |
| 05/08/2002 | CN1084529C Connector of circuit board terminal |
| 05/07/2002 | US6385758 System and method for compacting a graphic layout |
| 05/07/2002 | US6385565 System and method for determining the desired decoupling components for power distribution systems using a computer system |
| 05/07/2002 | US6384911 Apparatus and method for detecting accuracy of drill holes on a printed circuit board |
| 05/07/2002 | US6384890 Connection assembly for reflective liquid crystal projection with branched PCB display |
| 05/07/2002 | US6384706 Multilayer printed board with a double plane spiral interconnection structure |
| 05/07/2002 | US6384485 Semiconductor device |
| 05/07/2002 | US6384477 Multiple line grid array package |
| 05/07/2002 | US6384425 Nonconductive substrate forming a strip or a panel on which a multiplicity of carrier elements is formed |
| 05/07/2002 | US6384347 Glass-ceramic wiring board |
| 05/07/2002 | US6384345 Three dimensional circuit body and method of manufacturing the same |
| 05/07/2002 | US6384344 Circuit board for mounting electronic parts |
| 05/07/2002 | US6384343 Semiconductor device |
| 05/07/2002 | US6384342 Heat-resistant electronic systems and circuit boards with heat resistant reinforcement dispersed in liquid metal |
| 05/07/2002 | US6384341 Differential connector footprint for a multi-layer circuit board |
| 05/07/2002 | US6384339 Printed circuit board assembly having adhesive joint |
| 05/07/2002 | US6383891 Method for forming bump and semiconductor device |
| 05/07/2002 | US6383839 Vertically mountable semiconductor device and methods |
| 05/07/2002 | US6383720 Method of manufacturing fine pattern and printed circuit board manufactured with this method |
| 05/07/2002 | US6383693 Transparent sustrate, blanket masking layer and photoresists and latent image patterns |
| 05/07/2002 | US6383617 Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby |
| 05/07/2002 | US6383616 Resonant tag; configured to circuit pattern having openings and adhered to dielectric film |
| 05/07/2002 | US6383603 Printed wiring board and manufacturing method thereof |
| 05/07/2002 | US6383555 Misted precursor deposition apparatus and method with improved mist and mist flow |
| 05/07/2002 | US6383401 Forming microelectronic circuit packages without use of commoning bars, specifically manufacturing flexible wiring boards having nickel/gold wirebonding surface on wirebond and ball grid array pads |
| 05/07/2002 | US6383357 Three-dimensional metallic structure |
| 05/07/2002 | US6383327 Conductive pattern producing method |
| 05/07/2002 | US6383305 Method for the making soldering flux and resulting weld joint |
| 05/07/2002 | US6383303 High volume fluid head |
| 05/07/2002 | US6383272 Process for improving the adhesion of polymeric materials to metal surfaces |
| 05/07/2002 | US6383269 Aqueous electrolytes for immersion plating |
| 05/07/2002 | US6383254 Treatment solution and treatment method for reducing copper oxides |
| 05/07/2002 | US6383005 Integrated circuit socket with contact pad |
| 05/07/2002 | US6382964 Process and apparatus for heat-treating substrate having film-forming composition thereon |
| 05/07/2002 | US6382497 Reflow soldering apparatus and method |
| 05/07/2002 | US6381838 BGA package and method of manufacturing the same |
| 05/07/2002 | US6381837 Method for making an electronic circuit assembly |
| 05/02/2002 | WO2002035903A2 Electronic component, component mounting equipment, and component mounting method |
| 05/02/2002 | WO2002035897A1 Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production |
| 05/02/2002 | WO2002035896A1 Integrated circuit carrier with recesses |
| 05/02/2002 | WO2002035655A2 Surface mount connector lead |
| 05/02/2002 | WO2002035555A1 Coated particle |
| 05/02/2002 | WO2002035289A2 Method and materials for printing particle-enhanced electrical contacts |
| 05/02/2002 | WO2002034964A1 Leadfree chemical nickel alloy |
| 05/02/2002 | WO2002034509A1 Laminate |
| 05/02/2002 | WO2002006898A3 Material and method for making an electroconductive pattern |
| 05/02/2002 | WO2001025317A3 Method of treating epoxy resin-cured product |
| 05/02/2002 | WO2000078109A9 Improved bga solder ball shear strength |
| 05/02/2002 | WO2000054107A9 Step and flash imprint lithography |
| 05/02/2002 | US20020052150 Ultraminiature optical jack |
| 05/02/2002 | US20020052146 Circuit board apparatus with pin connectors |
| 05/02/2002 | US20020052107 Wiring forming method |
| 05/02/2002 | US20020052104 Semiconductor chip installing tape, semiconductor device and a method for fabricating thereof |
| 05/02/2002 | US20020052062 Layers of a conductive pattern isolated by a trench are formed on a conductive foil to form a multilayered wiring structure, a circuit is mounted and molded with an insulating resin and the back surface of the conductive foil is etched |
| 05/02/2002 | US20020051944 Light of a specific wavelength, which hardens a plating resist, is absorbed by the catalytic layer and does not cause any halation at a boundary between the catalytic layer and the plating resist |
| 05/02/2002 | US20020051942 Photo-or heat-curable resin composition and multilayer printed wiring board |
| 05/02/2002 | US20020051915 Manufacturing apparatus for printed boards, manufacturing method of printed boards and the printed board |
| 05/02/2002 | US20020051848 Metal carbide bonds ceramic and substrate at high temperature minimizing gravitational segregations during metallization |
| 05/02/2002 | US20020051831 Apparatus for encasing array packages |
| 05/02/2002 | US20020051728 Vibrating melt of solder alloy in crucible under pressure to force the melt to drop through crucible orifices, forming droplets in nonoxidizing gas atmosphere, then solidifying; for use in bump connections in semiconductors |
| 05/02/2002 | US20020051684 Lubricant sheet for making hole and method of making hole with drill |
| 05/02/2002 | US20020051351 Protection against folding and displacement for a flexible printed circuit board in a contact-making region |
| 05/02/2002 | US20020051348 Electronic components mounting structure |
| 05/02/2002 | US20020051346 Computer system, electronic circuit board, and card |
| 05/02/2002 | US20020051345 Flexible circuit board and connect structure thereof |
| 05/02/2002 | US20020050921 Circuit arrangement comprising an smd-component, in particular a temperature sensor, and a method of manufacturing a temperature sensor |
| 05/02/2002 | US20020050915 Component holder for a hall sensor and process for manufacturing a component holder |
| 05/02/2002 | US20020050912 Variable voltage protection structures and method for making same |
| 05/02/2002 | US20020050907 Guiding device for guiding conducting wire soldered on printed circuit board |
| 05/02/2002 | US20020050870 Printed board, method for producing the same, and electronic device having the same |
| 05/02/2002 | US20020050652 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer |
| 05/02/2002 | US20020050643 Conductive adhesive agent, packaging structrue, and method for manufacturing the same structure |
| 05/02/2002 | US20020050641 Apparatus and methods of semiconductor packages having circuit-bearing interconnect components |
| 05/02/2002 | US20020050586 Contains copper; for forming via hole conductors to be converted to external electrode terminals |
| 05/02/2002 | US20020050510 Metal-ceramic circuit board and manufacturing method thereof |
| 05/02/2002 | US20020050407 Ground via structures in semiconductor packages |
| 05/02/2002 | US20020050405 Multilayer printed wiring board, method of producing same, mounting substrate and electronics |
| 05/02/2002 | US20020050404 Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof |
| 05/02/2002 | US20020050403 Semiconductor device |
| 05/02/2002 | US20020050402 Low CTE power and ground planes |
| 05/02/2002 | US20020050400 Method and component for forming an embedded resistor in a multi-layer printed circuit |
| 05/02/2002 | US20020050399 Flexible printed circuit film |
| 05/02/2002 | US20020050398 Stress resistant land grid array (LGA) module and method of forming the same |
| 05/02/2002 | US20020050397 Semiconductor module and method of manufacturing the same |
| 05/02/2002 | US20020050391 Wiring unit |
| 05/02/2002 | US20020050381 Flexible printed circuit board, integrated circuit chip mounting flexible printed circuit board, display apparatus incorporating, integrated circuit chip mounted structure, and bonding method of integrated circuit chip mounting flexible printed circuit board |
| 05/02/2002 | US20020050380 Electronic package with plurality of solder-applied areas providing heat transfer |
| 05/02/2002 | US20020050320 Method of bonding a conductive adhesive and an electrode, and a bonded electrode obtained thereby |
| 05/02/2002 | US20020050316 Laminated green base layers containing low temperature sinterable ceramic material, green constraining layer contacting at least one of base layers and containing an unsinterable inorganic material, wiring conductor |
| 05/02/2002 | US20020050217 Screen-printing material replenishing device |
| 05/02/2002 | US20020050186 Introducing a copper slurry having fine granular copper particles having an average particle size of 3 to 5 mu m dispresed in water into a medium type agitation mill and flattening the fine copper powder |
| 05/02/2002 | US20020050061 Method and apparatus for forming pattern onto panel substrate |
| 05/02/2002 | US20020050058 Method and apparatus for improving mounting |
| 05/02/2002 | US20020050055 Boring method for circuit board |
| 05/02/2002 | EP1202615A1 Substate arrangment and element connected thereto |