Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/2002
05/14/2002US6387505 Prepreg which is composed of mixture of polycarbodiimide resin and epoxy resin and which has film shape
05/14/2002US6387499 Coated solder spheres and method for producing the same
05/14/2002US6387387 Electronic component material containing pest repellent, electronic component using the same, and its manufacturing method
05/14/2002US6387205 Coating multilayer thermosetting resin on cloth fibers; curing
05/14/2002US6387181 Coating device for coating solder resist on both sides of a printed circuit board
05/14/2002US6386892 Tin paste overflow-protective electric connector
05/14/2002US6386890 Printed circuit board to module mounting and interconnecting structure and method
05/14/2002US6386708 Projection display device
05/14/2002US6386436 Method of forming a solder ball
05/14/2002US6386435 Systems and methods for distributing solder paste using a tool having a solder paste aperture with a non-circular cross-sectional shape
05/14/2002US6386434 Method of attaching a first part to a mating part
05/14/2002US6386433 Solder ball delivery and reflow apparatus and method
05/14/2002US6386429 Printed circuit board header attachment station
05/14/2002US6386426 Solder material and method of manufacturing solder material
05/14/2002CA2093528C Electrical connectors
05/14/2002CA2034209C Method, system and composition for soldering by induction heating
05/10/2002WO2002037911A1 Method and arrangement relating to providing a substrate with cavities
05/10/2002WO2002037909A2 Method and apparatus for distributing power to integrated circuits
05/10/2002WO2002037616A1 Electric resistance measuring connector and measuring device and measuring method for circuit board electric resistance
05/10/2002WO2002037564A2 Film material comprising metal spikes and method for the production thereof
05/10/2002WO2002037248A2 A power distribution system with a dedicated power structure and a high performance voltage regulator
05/10/2002WO2002036345A1 Squeeze unit and cream solder printer
05/10/2002WO2002036273A1 Catalyst solutions useful in activating substrates for subsequent plating
05/10/2002WO2001067512A3 Method and apparatus for delivering power to high performance electronic assemblies
05/10/2002WO2001036171A3 A method and apparatus using printer means for manufacturing an item
05/09/2002US20020055789 System and method for side to side registration in a printed circuit imager
05/09/2002US20020055550 Containing units from 4,4'-(9H-fluoren-9-ylidene) bis((2-propenyl) phenol)
05/09/2002US20020055283 Multiple line grid connector
05/09/2002US20020055282 Electronic components with plurality of contoured microelectronic spring contacts
05/09/2002US20020055255 Electrode forming method and bump electrode formable base used therefor
05/09/2002US20020055237 Method for transferring semiconductor device layers to different substrates
05/09/2002US20020055062 Photosensitive resin composition and circuit board
05/09/2002US20020054998 Conntacting surface with a medium comprising at least one silicate and having a basic pH and wherein medium is substantially free of chromates, introducing a current to medium using surface as cathode; recovering the substrate
05/09/2002US20020054955 Coating uninsulated portion of copper circuit with layer of ceramic having thickness for soldering without fluxing; integrated circuits
05/09/2002US20020054800 PCB separator having monitoring system for route finding and adjusting purposes
05/09/2002US20020054486 Printed wiring board unit, auxiliary substrate for hierarchical mounting, and electronic apparatus
05/09/2002US20020054484 Electrical device allowing for increased device densities
05/09/2002US20020054473 Vehicle power distributor and method of connecting control circuit board to vehicle power distributor
05/09/2002US20020054471 Method of making a parallel capacitor laminate
05/09/2002US20020054467 Multi-layered substrate with a built-in capacitor design and a method of making the same
05/09/2002US20020053919 Test socket and methods
05/09/2002US20020053747 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
05/09/2002US20020053735 Method for assembling components and antennae in radio frequency identification devices
05/09/2002US20020053734 Probe card assembly and kit, and methods of making same
05/09/2002US20020053728 Panel stacking of BGA devices to form three-dimensional modules
05/09/2002US20020053723 Semiconductor module
05/09/2002US20020053722 Semiconductor device, semiconductor module and hard disk
05/09/2002US20020053720 Substrate for an electronic circuit, and an electronic module using such a substrate
05/09/2002US20020053591 Solder ball delivery and reflow method
05/09/2002US20020053590 Dissolving shunt connection system for ESD sensitive components
05/09/2002US20020053588 Reflow method and reflow device
05/09/2002US20020053519 Seed layer repair
05/09/2002US20020053517 Electolysis to create an alloy of copper, tungsten and/or molybdenum, nickel, cobalt, iron and/or zinc and chlorine
05/09/2002US20020053469 Printed wiring board and manufacturing method of the printed wiring board
05/09/2002US20020053468 Grounding terminal and mounting structure of the same on a printed circuit board
05/09/2002US20020053467 Electronic component with external connection elements
05/09/2002US20020053466 Printed-Circuit board and a semiconductor module, and a manufacturing process of the semiconductor module
05/09/2002US20020053465 Circuit board electrically insulating material, circuit board and method for manufacturing the same
05/09/2002US20020053464 Stress relief bend useful in an integrated circuit redistribution patch
05/09/2002US20020053455 Prefabricated semiconductor chip carrier
05/09/2002US20020053394 Automatic separator and method to obtain circuits for microelectronics
05/09/2002US20020053292 Screen printing apparatus, screen printing method, and paste storage container for screen printing apparatus
05/09/2002US20020053135 Method and noise suppressor unit for installing a common mode choke for noise suppressor in a power source module onto a circuit
05/09/2002US20020053127 Method for manufacturing radio frequency module components with surface acoustic wave element
05/08/2002EP1204307A2 Connector for connecting etched tri-metal circuits
05/08/2002EP1204306A2 Process and arrangement for contacting of metallic pads disposed on substrate foils
05/08/2002EP1204305A2 Device comprising an electrical circuit carried by a carrier element and method for the manufacture of such a device
05/08/2002EP1204304A2 Etched tri-layer metal bonding layer
05/08/2002EP1204303A2 Cladded material construction for etched-tri-metal circuits
05/08/2002EP1204302A1 Flexible connector for high density circuit applications
05/08/2002EP1204301A2 Arrangement for forming an input circuit for recording and processing an electrical signal
05/08/2002EP1204167A1 Grid connector
05/08/2002EP1203970A2 Ultraminiature optical jack
05/08/2002EP1203662A1 Solder-paste printing device and printing method
05/08/2002EP1203516A2 Printed circuit board assembly with improved thermal performance
05/08/2002EP1203110A2 Method for the production of a self-supporting copper foil
05/08/2002EP1202862A1 Improvements relating to screen printing
05/08/2002EP1202833A1 Method of producing microbore holes
05/08/2002EP1004226B1 Method and device for producing wire-written printed circuit boards
05/08/2002EP0988576B1 Substrate having a unidirectional conductivity perpendicular to its surface, devices comprising such a substrate and methods for manufacturing such a substrate
05/08/2002EP0871568A4 Conductive film composite
05/08/2002DE10136082A1 Verfahren zum Vercrimpen und Anschlussklemmencrimpvorrichtung Method for crimping and Anschlussklemmencrimpvorrichtung
05/08/2002DE10110453A1 Verfahren zum Montieren eines Halbleiterchips auf einem Substrat und auf einem Substrat montierbarer Halbleiterbaustein A method of mounting a semiconductor chip on a substrate and on a substrate mountable semiconductor module
05/08/2002DE10052713A1 Anordnung mit einem Substrat und einem damit verbundenen Verbindungselement Device comprising a substrate and an associated connecting element
05/08/2002DE10048290A1 Induktiver Sensor Inductive sensor
05/08/2002CN2489911Y Welding glue removal machine
05/08/2002CN1348678A Multilayer printed wiring board
05/08/2002CN1348677A Circuit board, battery pack, and method of manufacturing circuit board
05/08/2002CN1348605A Integrated circuit
05/08/2002CN1348594A Method for forming transparent conductive film by using chemically amplified resist
05/08/2002CN1348553A Method for patterning thin films
05/08/2002CN1348330A Manufacture of thin core board for multiple-layer circuit board
05/08/2002CN1348329A Conducting pulp and method for producing laminated ceramic electronic parts
05/08/2002CN1348326A Production method of copper foil for fine line use
05/08/2002CN1348320A Oscillator and oscillator character regulating method
05/08/2002CN1348211A Semiconductor device and liquid crystal module using the same, and method for producing liquid crystal module
05/08/2002CN1348205A Method for producing electric circuit device
05/08/2002CN1348204A IC packing substrate structure and its manufacture
05/08/2002CN1348194A Method for producing ceramic wafer and laminated ceramic electronic element
05/08/2002CN1348162A Display device using with COF