| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/16/2002 | WO2002023963A3 Method and apparatus for surface mounting electrical devices |
| 05/16/2002 | WO2001079374A3 Stabilized cationically polymerizable composition, and adhesive film and conductor circuit comprising the same |
| 05/16/2002 | US20020058756 Underfill sealants with improved adhesion, improved resistance to moisture absorption and improved resistance to stress cracking |
| 05/16/2002 | US20020058446 Solder-holding clips for applying solder to connectors or the like |
| 05/16/2002 | US20020058429 Device for connecting electrical conductors |
| 05/16/2002 | US20020058428 Circuit-board connecting terminal |
| 05/16/2002 | US20020058406 Bump forming method and bump forming apparatus |
| 05/16/2002 | US20020058404 Methods of forming electrically conductive interconnections and electrically interconnected substrates |
| 05/16/2002 | US20020058396 Use of a reference fiducial on a semiconductor package to monitor and control a singulation method |
| 05/16/2002 | US20020058356 Semiconductor package and mount board, and mounting method using the same |
| 05/16/2002 | US20020058354 Layout method for thin and fine ball grid array package substrate with palting bus |
| 05/16/2002 | US20020058347 Semiconductor package with a controlled impedance bus and method of forming same |
| 05/16/2002 | US20020058151 Surface electrode structure on ceramic multi-layer substrate and process for producing the same |
| 05/16/2002 | US20020058140 Glass fiber coating for inhibiting conductive anodic filament formation in electronic supports |
| 05/16/2002 | US20020058137 Dielectric spacing layer |
| 05/16/2002 | US20020058131 Reducing warpage by use of low temperature sinterable ceramic and an inorganic particle which constrains the shrinkage and which is not sintered at a sintering temperature |
| 05/16/2002 | US20020057986 Solders |
| 05/16/2002 | US20020057560 Shielding case and electronic device having the same |
| 05/16/2002 | US20020057559 PCB structure for regulating constant power source and strengthening ground connections |
| 05/16/2002 | US20020057558 Perimeter matrix ball grid array circuit package with a populated center |
| 05/16/2002 | US20020057557 Circuit unit and method of producing same |
| 05/16/2002 | US20020057555 Electronic unit |
| 05/16/2002 | US20020057554 Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plate |
| 05/16/2002 | US20020057235 Display device |
| 05/16/2002 | US20020057186 Surface-mountable PTC thermistor and mounting method thereof |
| 05/16/2002 | US20020057163 Housing for an electronic component |
| 05/16/2002 | US20020057158 Surface-mount type switching power supply unit and mounting method for the same |
| 05/16/2002 | US20020057029 Coil holder |
| 05/16/2002 | US20020056925 Interconnections with electrically conductive adhesives: structures, materials, method and their applications |
| 05/16/2002 | US20020056897 Electronic component to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same |
| 05/16/2002 | US20020056890 Formation of a metallic interlocking structure |
| 05/16/2002 | US20020056742 Methods and systems for attaching substrates to one another using solder structures having portions with different melting points |
| 05/16/2002 | US20020056702 Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom |
| 05/16/2002 | US20020056645 Immersing electrically conductive substrate having smooth surface having small recesses therein in electroplating bath containing ions of metal to be deposited, immersing counter electrode, passing modulated pulsing current between |
| 05/16/2002 | US20020056571 Process for producing printed circuits and printed circuits thus obtained |
| 05/16/2002 | US20020056509 Manufacturing method of wiring board, and conductive paste used therein |
| 05/16/2002 | US20020056505 Electrical connecting device and electrical connecting method |
| 05/16/2002 | US20020056379 Squeegee for screen printing, and squeegee device equipped with the squeegee |
| 05/16/2002 | US20020056192 Method of producing multilayer printed wiring board and multilayer printed wiring board |
| 05/16/2002 | DE10152408A1 System for automatic mounting of electronic components onto a circuit board uses camera scanning of board |
| 05/16/2002 | DE10132543A1 Heisserhärtende fluorierte Dielektrika und mehrschichtige Leiterplatten Heisserhärtende fluorinated dielectrics and multilayer printed circuit boards |
| 05/16/2002 | DE10107630A1 Electrical connector strips has arrays of contact pins embedded into a main body of insulating material |
| 05/16/2002 | DE10105163A1 Verfahren und Anordnung zum Kontaktieren von auf Sunbstratfolien angeordneten metallischen Kontaktflächen Method and apparatus for contacting arranged on Sunbstratfolien metallic contact surfaces |
| 05/16/2002 | DE10053853A1 Electronic component, for use as ceramic module in mobile radio equipment, comprises covering unit and semiconductor chip and/or passive component arranged between substrate and upper covering plate of covering unit |
| 05/16/2002 | DE10052960A1 Bleifreier Chemisch-Nickel-Elektrolyt Lead Free electroless nickel electrolyte |
| 05/16/2002 | DE10043816C1 Device for electrochemically metallizing, etching, oxidizing and reducing material in electrolytic apparatus comprises rigid base body, electrical contacts arranged on base body, contact isolator, counter electrode and electrical connection |
| 05/16/2002 | DE10030144A1 Halbleitervorrichtung und zugehörige Einbaustruktur Semiconductor device and associated mounting structure |
| 05/15/2002 | EP1206171A2 Circuit board and method for manufacturing the same |
| 05/15/2002 | EP1206170A1 Bonded structure and electronic circuit board |
| 05/15/2002 | EP1206006A1 Circuit board assembly |
| 05/15/2002 | EP1205971A2 Electronic component and method and structure for mounting semiconductor device |
| 05/15/2002 | EP1205950A1 Coil holder |
| 05/15/2002 | EP1205804A2 Photosensitive resin composition and circuit board |
| 05/15/2002 | EP1205350A2 Steering column switch |
| 05/15/2002 | EP1205094A1 Component for assembly on a printed circuit board |
| 05/15/2002 | EP1205093A1 Printed circuit substrate with controlled placement covercoat layer |
| 05/15/2002 | EP1204988A2 Controlled compliance fine pitch interconnect |
| 05/15/2002 | EP0956538B1 Modular data medium |
| 05/15/2002 | EP0798779B1 Ceramic circuit board |
| 05/15/2002 | EP0692021B1 Microemulsion and emulsion cleaning compositions |
| 05/15/2002 | CN2492041Y Non-destruction detector for microhole wall of circuit board |
| 05/15/2002 | CN2491166Y Cam-actuated floating target milling machine |
| 05/15/2002 | CN1349659A Burless castellation via process and product for plastic chip carrier |
| 05/15/2002 | CN1349376A Etching liquid, and mehtod for mfg. flexible distributing board |
| 05/15/2002 | CN1349375A Method for fixing and treating film material |
| 05/15/2002 | CN1349258A High density design for organic chip carrier |
| 05/15/2002 | CN1349100A Device for testing display plate or circuit board |
| 05/15/2002 | CN1348976A Binder and adhesive film |
| 05/15/2002 | CN1085035C Chemically grafted electrical device |
| 05/15/2002 | CN1084917C Electrically conductive paste materials and applications |
| 05/14/2002 | US6388895 Telecommunication main distribution frame structure |
| 05/14/2002 | US6388892 Tuner unit |
| 05/14/2002 | US6388890 Technique for reducing the number of layers in a multilayer circuit board |
| 05/14/2002 | US6388889 Electrical connector housing |
| 05/14/2002 | US6388888 Semiconductor device and process for manufacturing the same, liquid crystal module and process for mounting the same |
| 05/14/2002 | US6388885 Controller with helical spring contacts |
| 05/14/2002 | US6388728 Electrode plate, process for producing the plate, liquid crystal device including same and process for producing the device |
| 05/14/2002 | US6388636 Circuit module |
| 05/14/2002 | US6388555 Low profile mount for plural lower electrode metal oxide varistor package and method |
| 05/14/2002 | US6388461 Semiconductor inspection apparatus and inspection method using the apparatus |
| 05/14/2002 | US6388325 Multi-layer interconnect |
| 05/14/2002 | US6388230 Laser imaging of thin layer electronic circuitry material |
| 05/14/2002 | US6388211 Method of molding a molding resin on a substrate having openings, switch substrate with a molding resin, method of forming a switch pattern on a switch substrate, and a switch substrate |
| 05/14/2002 | US6388208 Multi-connection via with electrically isolated segments |
| 05/14/2002 | US6388207 Electronic assembly with trench structures and methods of manufacture |
| 05/14/2002 | US6388206 Microcircuit shielded, controlled impedance “Gatling gun”via |
| 05/14/2002 | US6388205 Printed circuit board with shielded circuitry |
| 05/14/2002 | US6388204 Composite laminate circuit structure and methods of interconnecting the same |
| 05/14/2002 | US6388203 Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby |
| 05/14/2002 | US6388202 Multi layer printed circuit board |
| 05/14/2002 | US6388201 Wired circuit board |
| 05/14/2002 | US6388198 Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality |
| 05/14/2002 | US6387969 Porous article and process for producing porous article |
| 05/14/2002 | US6387859 Method and cleaner composition for stripping copper containing residue layers |
| 05/14/2002 | US6387793 Metallization; applying solder bumps; heating |
| 05/14/2002 | US6387731 Method and apparatus for reducing BGA warpage caused by encapsulation |
| 05/14/2002 | US6387599 Mixing benzotriazole with development solution |
| 05/14/2002 | US6387597 Image exposure of photoresist; heating to transition temperature; focusing |
| 05/14/2002 | US6387579 Method for direct image processing of printed circuit boards |
| 05/14/2002 | US6387507 Microelectronic package comprising high temperature co-fired ceramic body mated to low temperature co-fired ceramic body by bonding layer comprising electrically nonconductive portion and plurality of electrically conductive portions |