| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 05/23/2002 | US20020060160 Method and structure for producing bumps on an IC package substrate |
| 05/23/2002 | US20020060092 Method for connecting electrical components |
| 05/23/2002 | US20020060091 Ceramic circuit board and method of manufacturing the same |
| 05/23/2002 | US20020060090 Printed circuit board and manufacturing method of the printed circuit board |
| 05/23/2002 | US20020060087 Cable and method of manufacturing it |
| 05/23/2002 | US20020059875 Screen printing apparatus and method of the same |
| 05/23/2002 | US20020059871 Position adjustment in laser-assisted pressing |
| 05/23/2002 | US20020059723 Electronic package for electronic components and method of making same |
| 05/23/2002 | US20020059721 Apparatus and method for printed circuit board repair |
| 05/23/2002 | DE10065895C1 Electronic component used as an integrated circuit comprises a screen for electromagnetic scattering, a semiconductor chip made from a semiconductor substrate and an electrically conducting trenched layer |
| 05/23/2002 | DE10056904A1 Connector device for electrical circuit boards uses electrically-conductive spring elements clipped over surface-mounted contact bodies |
| 05/23/2002 | DE10038390C1 Funktionell asymmetrische Schaltungsträgeranordnung mit spiegelsymmetrischer Bauteileanordnung Functionally asymmetric circuit carrier assembly with a mirror-symmetrical arrangement of components |
| 05/23/2002 | CA2427923A1 Positive type photosensitive epoxy resin composition and printed circuit board using the same |
| 05/23/2002 | CA2400321A1 Electronic component-use substrate and electronic component |
| 05/22/2002 | EP1207730A1 Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board |
| 05/22/2002 | EP1207728A1 Automatic seperator and method to obtain circuits for microelectronics |
| 05/22/2002 | EP1207727A2 Compliant laminate connector |
| 05/22/2002 | EP1207424A1 Photosolder resist composition |
| 05/22/2002 | EP1206825A1 Universal energy conditioning interposer with circuit architecture |
| 05/22/2002 | EP1206780A1 Method and device for insulating electro-technical components |
| 05/22/2002 | EP1206725A1 Connector arrangement |
| 05/22/2002 | EP1206325A2 Vapor phase connection techniques |
| 05/22/2002 | EP0980642B9 Process and apparatus for the treatment of flat-form material, especially of printed circuit boards |
| 05/22/2002 | EP0659032B1 Electronic component |
| 05/22/2002 | CN1350771A Multilayer printed-circuit board and method of manufacture |
| 05/22/2002 | CN1350770A Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards |
| 05/22/2002 | CN1350690A Ultra-small resistor-capacitor thin film network for inverted mounting to a surface |
| 05/22/2002 | CN1350660A 光敏组合物 Photosensitive composition |
| 05/22/2002 | CN1350486A Silk-screen printing machine |
| 05/22/2002 | CN1350422A Element mounting method |
| 05/22/2002 | CN1350421A Element mounting system and mounting method |
| 05/22/2002 | CN1350420A Soldering tin electroplating method to organic circuit board |
| 05/22/2002 | CN1350350A 电池连接器 Battery Connector |
| 05/22/2002 | CN1350325A Contact structure member and production method thereof, and probe contact assembly using said contact structure member |
| 05/22/2002 | CN1350323A Lead wire frame and method for manufacturing lead wire frame |
| 05/22/2002 | CN1350305A Surface-sticked PTC Thermosensitive resistor and sticking method |
| 05/22/2002 | CN1350201A Wiring base plate, display device, semiconductor chip and electronic machine |
| 05/22/2002 | CA2363459A1 Strain relief for bga connector |
| 05/21/2002 | US6392899 Processor power delivery system |
| 05/21/2002 | US6392898 Package substrate |
| 05/21/2002 | US6392897 Circuit module |
| 05/21/2002 | US6392896 Semiconductor package containing multiple memory units |
| 05/21/2002 | US6392881 Portable electronic device |
| 05/21/2002 | US6392778 Opto-electronic element |
| 05/21/2002 | US6392530 Resistor array board |
| 05/21/2002 | US6392524 Photolithographically-patterned out-of-plane coil structures and method of making |
| 05/21/2002 | US6392429 Temporary semiconductor package having dense array external contacts |
| 05/21/2002 | US6392426 Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate |
| 05/21/2002 | US6392301 Chip package and method |
| 05/21/2002 | US6392293 Semiconductor package with sloped outer leads |
| 05/21/2002 | US6392174 Printed circuit board with fixed contacts of switch formed thereon and switch using same |
| 05/21/2002 | US6392165 Adapter for a ball grid array device |
| 05/21/2002 | US6392164 Multi-level circuit substrate, method for manufacturing same and method for adjusting a characteristic impedance therefor |
| 05/21/2002 | US6392163 Controlled-shaped solder reservoirs for increasing the volume of solder bumps |
| 05/21/2002 | US6392161 Mounting substrate |
| 05/21/2002 | US6392160 Backplane for radio frequency signals |
| 05/21/2002 | US6392159 Embedded structure for engineering change and repair of circuit boards |
| 05/21/2002 | US6392148 Wire harness joint |
| 05/21/2002 | US6392004 Electronics |
| 05/21/2002 | US6391932 Dielectric polyimide |
| 05/21/2002 | US6391686 Adhesive material applying method and apparatus, interconnect substrate, semiconductor device and manufacturing method thereof, circuit board and electronic instrument |
| 05/21/2002 | US6391684 Lead frame and manufacturing method thereof |
| 05/21/2002 | US6391669 Embedded structures to provide electrical testing for via to via and interface layer alignment as well as for conductive interface electrical integrity in multilayer devices |
| 05/21/2002 | US6391526 Thick film low value high frequency inductor, and method of making the same |
| 05/21/2002 | US6391524 Article having imagable coatings |
| 05/21/2002 | US6391473 Cu plated ceramic substrate and a method of manufacturing the same |
| 05/21/2002 | US6391468 Soldered integrated circuit connections |
| 05/21/2002 | US6391460 Rubber for hot press cushioning pad, manufacturing method thereof, hot press cushioning pad and method of manufacturing printed circuit board |
| 05/21/2002 | US6391220 Methods for fabricating flexible circuit structures |
| 05/21/2002 | US6391217 Methods and apparatus for forming submicron patterns on films |
| 05/21/2002 | US6391211 Method for making an electrical circuit board |
| 05/21/2002 | US6391210 Process for manufacturing a multi-layer circuit board |
| 05/21/2002 | US6391138 Method of fabricating a laminated circuit assembly and product thereof |
| 05/21/2002 | US6391123 Solder paste |
| 05/21/2002 | US6391117 Method of washing substrate with UV radiation and ultrasonic cleaning |
| 05/21/2002 | US6391087 Adding alkali hydroxide to copper salt |
| 05/21/2002 | US6391082 Composites of powdered fillers and polymer matrix |
| 05/21/2002 | US6390854 Resin shield circuit device |
| 05/21/2002 | US6390830 Bus bar-connecting structure |
| 05/21/2002 | US6390439 Hybrid molds for molten solder screening process |
| 05/21/2002 | US6390356 Method of forming cylindrical bumps on a substrate for integrated circuits |
| 05/21/2002 | US6390355 Method for forming a metallic contact on an electronic printed circuit board and a product therefrom |
| 05/21/2002 | US6390351 Apparatus and method of transferring conductive balls and apparatus and method of supplying conductive balls |
| 05/21/2002 | US6390106 Multidirectional liquid sprayer used in a wet process |
| 05/21/2002 | US6389940 Gang punch tool assembly |
| 05/21/2002 | US6389708 Tab and slot design optimized for blind alignment of components |
| 05/21/2002 | US6389690 Method of coating printed circuit board |
| 05/21/2002 | US6389686 Process for fabricating a thin multi-layer circuit board |
| 05/21/2002 | US6389683 Apparatus and method for mounting electronic component |
| 05/21/2002 | US6389680 Method of manufacturing electronic component |
| 05/16/2002 | WO2002039802A2 Methods of positioning components using liquid prime movers and related structures |
| 05/16/2002 | WO2002039797A1 A dielectric spacing layer |
| 05/16/2002 | WO2002039795A1 Circuit board assembly |
| 05/16/2002 | WO2002039794A2 System and method for fabricating printed circuit boards |
| 05/16/2002 | WO2002039793A2 Multi-layer printed circuit board fabrication system and method |
| 05/16/2002 | WO2002039583A1 Electronic device, semiconductor device comprising such a device and method of manufacturing such a device |
| 05/16/2002 | WO2002039498A2 Methods and systems for positioning substrates |
| 05/16/2002 | WO2002039463A2 Methods and system for attaching substrates using solder structures |
| 05/16/2002 | WO2002039326A1 System and method for monitoring and improving dimensional stability and registration accuracy of multi-layer pcb manufacture |
| 05/16/2002 | WO2002038318A1 Method for defined mechanical drilling of electric printed circuit boards or printed circuit board stacks and drilling support for use in this method |