| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 05/29/2002 | CN2493946Y Small size inserting type photo connected module casing |
| 05/29/2002 | CN2493341Y Double-track type soldering machine |
| 05/29/2002 | CN1351817A Device for transfering/holding sheetlike member and its method |
| 05/29/2002 | CN1351816A Compensation model and registration simulator apparatus and method for manufacturing of printed circuit boards |
| 05/29/2002 | CN1351815A Flexible printed wiring board and its production method |
| 05/29/2002 | CN1351529A Beam shaping and projection imaging with solid state UV gaussien beam to form vias |
| 05/29/2002 | CN1351466A Manufacture of mixed integrated circuit device |
| 05/29/2002 | CN1351376A Semiconductor modules and manufacture thereof |
| 05/29/2002 | CN1351375A Modular assembly and electronic component |
| 05/29/2002 | CN1351269A Miniature optical plug |
| 05/29/2002 | CN1085931C Resin-coated copper foil for multilayer printed wiring board and multiplayer printed wiring board provided with said copper foil |
| 05/29/2002 | CN1085889C Compositions for diffusion patterning |
| 05/29/2002 | CN1085877C Flexible circuit board fitting structure and recording copying device of using the same |
| 05/28/2002 | US6396978 Optical wavelength division multiplexer/demultiplexer having patterned opaque regions to reduce optical noise |
| 05/28/2002 | US6396713 Attenuation of electromagnetic waves; signal, powrer, grounding layers |
| 05/28/2002 | US6396712 Method and apparatus for coupling circuit components |
| 05/28/2002 | US6396709 Printed-circuit board having rigid and elastically deformable sections and device having such a printed-circuit board |
| 05/28/2002 | US6396707 Ball grid array package |
| 05/28/2002 | US6396706 Self-heating circuit board |
| 05/28/2002 | US6396702 Control module for a motor vehicle cab |
| 05/28/2002 | US6396694 Closed box for electronic equipment |
| 05/28/2002 | US6396665 Head suspension assembly with a relay printed circuit board having openings through which electrodes protude |
| 05/28/2002 | US6396561 Method and device for exposing both sides of a sheet |
| 05/28/2002 | US6396387 Thin films resistors |
| 05/28/2002 | US6396264 Triplate striplines used in a high-frequency circuit and a shielded-loop magnetic field detector |
| 05/28/2002 | US6396141 Tape ball grid array with interconnected ground plane |
| 05/28/2002 | US6396135 Substrate for use in semiconductor packaging |
| 05/28/2002 | US6396128 Fixing structure and fixing method for semiconductor integrated circuit apparatus |
| 05/28/2002 | US6396001 Printed circuit board and method of making the same |
| 05/28/2002 | US6395997 Flat circuit with connector |
| 05/28/2002 | US6395996 Multi-layered substrate with a built-in capacitor design |
| 05/28/2002 | US6395995 Apparatus for coupling integrated circuit packages to bonding pads having vias |
| 05/28/2002 | US6395994 Etched tri-metal with integrated wire traces for wire bonding |
| 05/28/2002 | US6395993 Multilayer flexible wiring boards |
| 05/28/2002 | US6395992 Heat bonding using polyimide |
| 05/28/2002 | US6395991 Column grid array substrate attachment with heat sink stress relief |
| 05/28/2002 | US6395982 Leaded semiconductor device package for use in nonsoldering assembling |
| 05/28/2002 | US6395658 Ceramic containing barium oxide |
| 05/28/2002 | US6395633 Method of forming micro-via |
| 05/28/2002 | US6395625 Method for manufacturing solder mask of printed circuit board |
| 05/28/2002 | US6395582 Methods for forming ground vias in semiconductor packages |
| 05/28/2002 | US6395458 Mixing benzotriazole with development solution |
| 05/28/2002 | US6395452 Photoresist ink |
| 05/28/2002 | US6395399 Metallic foil, e.g. copper, having a polyimide layer produced by forming a film of a polyamic acid varnish followed by imidating and having a specific expansion coefficient and softening point; printed circuits; noncurling |
| 05/28/2002 | US6395378 PCB and method for making PCB with thin copper layer |
| 05/28/2002 | US6395374 Method of making microwave, multifunction modules using fluoropolymer composite substrates |
| 05/28/2002 | US6395337 Substrate with ceramic coating for camber modification and method for making |
| 05/28/2002 | US6395335 Filling, scraping squeegee |
| 05/28/2002 | US6395332 Fine copper powder and process for producing the same |
| 05/28/2002 | US6395329 Printed circuit board manufacture |
| 05/28/2002 | US6395163 Process for the electrolytic processing especially of flat items and arrangement for implementing the process |
| 05/28/2002 | US6395124 Providingstructure comprising at least two layers and a photopolymerizable adhesive between layers; directing actinic radiation within identified spectral region to cure photopolymerizable adhesive and form laminate structure |
| 05/28/2002 | US6395121 Method for making fabric-based, adhesively mounted printed circuit for upholstered seats and the like |
| 05/28/2002 | US6395120 Applying a layer with pigment or metal, constraint, adhesion on nonsintered ceramic layer |
| 05/28/2002 | US6395118 Method for manufacturing ceramic substrate and non-fired ceramic substrate |
| 05/28/2002 | US6395117 Method for producing ceramic green sheet |
| 05/28/2002 | US6395087 Method and apparatus for dispensing viscous material |
| 05/28/2002 | US6394853 Data connector for selective switching between at least two distinct mating connector plugs |
| 05/28/2002 | US6394851 Cigarette lighter adapter with one-piece solderless ground contact |
| 05/28/2002 | US6394836 Terminal connection structure of flat circuit belt |
| 05/28/2002 | US6394821 Anisotropic conductive film and production method thereof |
| 05/28/2002 | US6394819 Dielectric member for absorbing thermal expansion and contraction at electrical interfaces |
| 05/28/2002 | US6394816 Connecting device for flat circuit |
| 05/28/2002 | US6394334 Method and apparatus for forming solder bumps |
| 05/28/2002 | US6394281 Hermetic sealing |
| 05/28/2002 | US6394158 Method and device for thermally bonding connecting surfaces of two substrates |
| 05/28/2002 | US6393696 Method for manufacturing printed circuit board |
| 05/28/2002 | CA2161770C Process and apparatus for the wave soldering of circuit boards |
| 05/28/2002 | CA2084344C Structure and method for aligning a substrate with respect to orifices in an inkjet printhead |
| 05/23/2002 | WO2002041676A1 Method for increasing the dielectric rigidity and insulating resistance between printed circuit board tracks |
| 05/23/2002 | WO2002041675A1 Method for manufacturing circuit board |
| 05/23/2002 | WO2002041674A1 Arrangement consisting of a circuit carrier and a printed circuit board, or a printed circuit board assembly |
| 05/23/2002 | WO2002041673A2 Adding electrical resistance in series with bypass capacitors to achieve a desired value of electrical impedance between conductors of an electrical power distribution structure |
| 05/23/2002 | WO2002041453A1 Holding element for holding a carrier board |
| 05/23/2002 | WO2002041397A2 Low profile integrated module interconnects |
| 05/23/2002 | WO2002041343A1 Electronic component-use substrate and electronic component |
| 05/23/2002 | WO2002041079A2 Positive type photosensitive epoxy resin composition and printed circuit board using the same |
| 05/23/2002 | WO2002001930A3 Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas |
| 05/23/2002 | WO2001093648A3 Filling device |
| 05/23/2002 | WO2001037622A3 Printed conductor support layer for laminating into a chip card, method for producing a printed conductor support layer and injection molding tool for carrying out the method for producing a printed conductor support layer |
| 05/23/2002 | US20020061687 Solder bearing grid array |
| 05/23/2002 | US20020061668 Probe card and method of fabricating same |
| 05/23/2002 | US20020061665 Method and apparatus for vertically stacking and interconnecting ball grid array (BGA) electronic circuit devices |
| 05/23/2002 | US20020061641 Bump forming method, semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 05/23/2002 | US20020061629 Method of manufacturing multilayered ceramic substrate and green ceramic laminate |
| 05/23/2002 | US20020061415 Resin/copper/metal laminate and method of producing same |
| 05/23/2002 | US20020061401 Conductive metal particles, conductive composite metal particles and applied products using the same |
| 05/23/2002 | US20020061388 Printed circuit board having a pattern of traces formed by screen-printing |
| 05/23/2002 | US20020060906 Interconnecting method of wiring in printed circuit boards and printed circuit board unit |
| 05/23/2002 | US20020060904 Electronic component, circuit device, method for manufacturing the circuit device, and semiconductor device |
| 05/23/2002 | US20020060661 Liquid crystal display device |
| 05/23/2002 | US20020060582 Leadless solder for use at high and low temperatures |
| 05/23/2002 | US20020060580 Probe card |
| 05/23/2002 | US20020060380 Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods |
| 05/23/2002 | US20020060366 Multilayer wiring substrate having differential signal wires and a general signal wire in different planes |
| 05/23/2002 | US20020060361 Semiconductor package for three-dimensional mounting, fabrication method thereof , and semiconductor device |
| 05/23/2002 | US20020060356 Power semiconductor device |
| 05/23/2002 | US20020060342 Semiconductor device with chamfered substrate and method of making the same |
| 05/23/2002 | US20020060289 Ion reflectron comprising a flexible printed circuit board |
| 05/23/2002 | US20020060235 Reflow soldering apparatus and method |