| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 06/04/2002 | US6399895 Component hybridizing system allowing for defective planarity |
| 06/04/2002 | US6399894 Wire bond compensation |
| 06/04/2002 | US6399893 Electronic device |
| 06/04/2002 | US6399892 CTE compensated chip interposer |
| 06/04/2002 | US6399891 Alternating polyimide films, with a thermal expansion coefficient of 2-5 ppm/degrees c, and metal films; because thermal expansion coefficient is close to that of semiconductor element no breakage occurs at connecting parts |
| 06/04/2002 | US6399889 Head interconnect circuit with alignment finger |
| 06/04/2002 | US6399562 Solvent compositions |
| 06/04/2002 | US6399475 Forming metal layer on semiconductor; nickel or cobalt alloyed with silver or palladium; stress resistance |
| 06/04/2002 | US6399474 Method and apparatus for precoining BGA type packages prior to electrical characterization |
| 06/04/2002 | US6399417 Method of fabricating plated circuit lines over ball grid array substrate |
| 06/04/2002 | US6399285 Method for forming a thin film and for manufacturing a thin film |
| 06/04/2002 | US6399282 Method for forming conductive pattern and producing ceramic multi-layer substrate |
| 06/04/2002 | US6399277 Photopolymerizable thermosetting resin composition |
| 06/04/2002 | US6399258 Focusing laser beams |
| 06/04/2002 | US6399230 Multilayer ceramic circuit boards with embedded resistors |
| 06/04/2002 | US6399212 Silicon dioxide-coated polyolefin resin and process for its production |
| 06/04/2002 | US6399210 Alkoxyhydridosiloxane resins |
| 06/04/2002 | US6399178 Rigid adhesive underfill preform, as for a flip-chip device |
| 06/04/2002 | US6399019 Silver and active metal optionally with copper or titanium oxide paste; temperature lower than eutectic point; high strength; thermal impact resistance; power modules |
| 06/04/2002 | US6399008 Method for processing ceramic green sheets |
| 06/04/2002 | US6398937 Vibration of an electrolysis solution to increase uniformity of copper electrodeposition using transducers positioned between anodes |
| 06/04/2002 | US6398935 Method for manufacturing pcb's |
| 06/04/2002 | US6398856 Alkylenediamine or polyamine, hydrazine or hypophosphite reducing agent, and gold cyanide; direct thin film deposition on nickel metal or alloy solder ball; minimized drop of shear strength resulting from heat history |
| 06/04/2002 | US6398573 Locking assembly for securing semiconductor device to carrier substrate |
| 06/04/2002 | US6398561 Contact structure of lead |
| 06/04/2002 | US6398559 Connecting terminal and a connecting terminal assembly |
| 06/04/2002 | US6398104 Apparatus and method for inerting a wave soldering installation |
| 06/04/2002 | US6398099 Apparatus for manufacturing plug and method of manufacturing the same |
| 06/04/2002 | US6397741 Squeegee holder with electronic measuring apparatus |
| 06/04/2002 | US6397465 Connection of electrical contacts utilizing a combination laser and fiber optic push connect system |
| 06/04/2002 | US6397460 Electrical connector |
| 06/04/2002 | US6397459 Printed wiring board with mounted circuit elements using a terminal density conversion board |
| 06/04/2002 | CA2364053A1 Polishing slurry for the chemical-mechanical polishing of metal and dielectric structures |
| 06/04/2002 | CA2036241C Thin film electrical component |
| 05/30/2002 | WO2002043455A1 Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body |
| 05/30/2002 | WO2002043379A1 Folder type multi display device |
| 05/30/2002 | WO2002043084A1 System, printed circuit board, charger device, user device, and apparatus |
| 05/30/2002 | WO2002042523A2 2,4-hexadienoic acid and derivatives as corrosion inhibitors |
| 05/30/2002 | WO2002042514A1 Method for treating carrier films by means of heavy ion irradiation |
| 05/30/2002 | WO2002042016A1 Method of processing printed board scrap and apparatus for the same |
| 05/30/2002 | WO2002017380A3 Selective flux deposition |
| 05/30/2002 | WO2002007952A3 Method and apparatus for fine feature spray deposition |
| 05/30/2002 | WO2001098838A3 Method of forming optical images, mask for use in this method, method of manufacturing a device using this method, and apparatus for carrying out this method |
| 05/30/2002 | WO2001074529A3 Laser system and method for single pass micromachining of multilayer workpieces |
| 05/30/2002 | US20020065965 Solderless electronics packaging and methods of manufacture |
| 05/30/2002 | US20020065331 Having low dielectric constants useful in electronic component manufacture |
| 05/30/2002 | US20020065052 Complete outdoor radio unit for LMDS |
| 05/30/2002 | US20020064947 Wiring substrate and manufacturing method of the same along with electroless copper plating solution used therefor |
| 05/30/2002 | US20020064933 Method of forming solder bumps |
| 05/30/2002 | US20020064931 Method and apparatus for applying a protective over-coating to a ball-grid-array (BGA) structure |
| 05/30/2002 | US20020064902 Method for fabricating large area flexible electronics |
| 05/30/2002 | US20020064899 Semiconductor device substrate and semiconductor device fabrication method |
| 05/30/2002 | US20020064728 Near IR sensitive photoimageable/photopolymerizable compositions, media, and associated processes |
| 05/30/2002 | US20020064676 Copper circuitry, and a finish coating of tin, and an alloy cap layer of at least two immersion-platable metals (tin and silver for example); solderable for at least a year |
| 05/30/2002 | US20020064674 Part |
| 05/30/2002 | US20020064591 Substrate plating method and apparatus |
| 05/30/2002 | US20020064029 Stacked power amplifier module |
| 05/30/2002 | US20020063600 High-frequency circuit |
| 05/30/2002 | US20020063512 Fluorescent display device |
| 05/30/2002 | US20020063326 Electronic part unit and circuit board apparatus |
| 05/30/2002 | US20020063325 Substrate structure |
| 05/30/2002 | US20020063321 Microelectronic package with an attachment layer including spacer elements |
| 05/30/2002 | US20020063320 Molded electronic component |
| 05/30/2002 | US20020063318 Ball grid array (BGA) mounting device |
| 05/30/2002 | US20020063315 Quad flat non-leaded package and leadframe for the same |
| 05/30/2002 | US20020063147 Anti-tombstoning solder alloys for surface mount applications |
| 05/30/2002 | US20020063146 Flux composition and soldering method for high density arrays |
| 05/30/2002 | US20020063113 Device and method for processing substrates |
| 05/30/2002 | US20020062990 Through-hole wiring board |
| 05/30/2002 | US20020062989 Grounding terminal and mounting structure of the same on a printed circuit board |
| 05/30/2002 | US20020062988 Electronic component mounted member and repair method thereof |
| 05/30/2002 | US20020062987 Multilayer circuit board and method of manufacturing the same |
| 05/30/2002 | US20020062924 Definable integrated passives for circuitry |
| 05/30/2002 | US20020062923 Methods for reducing void formation upon curing of adhesive formulations and compositions useful therefor |
| 05/30/2002 | US20020062919 Method of producing a laminated structure |
| 05/30/2002 | US20020062760 Useful in metallizing printed circuit boards |
| 05/30/2002 | US20020062557 Cooler chip fabrication method |
| 05/30/2002 | US20020062552 Multilayered ceramic substrate and production method therefor |
| 05/29/2002 | EP1209959A2 Multilayer circuit board and method of manufacturing the same |
| 05/29/2002 | EP1209958A2 Laminated structure for electronic equipment and method of electroless gold plating |
| 05/29/2002 | EP1209957A2 Substrate structure |
| 05/29/2002 | EP1209764A1 Strain relief for BGA connector |
| 05/29/2002 | EP1209736A2 Semiconductor device and method of fabricating semiconductor device |
| 05/29/2002 | EP1209734A2 Multilayered ceramic substrate and production method therefor |
| 05/29/2002 | EP1209527A1 Photoresist composition |
| 05/29/2002 | EP1209253A2 Process for treating adhesion promoted metal surfaces with epoxy resins |
| 05/29/2002 | EP1209211A1 Adhesive, adhesive member, circuit substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 05/29/2002 | EP1208618A1 Control device and soldering method |
| 05/29/2002 | EP1208595A2 Interconnect assemblies and methods |
| 05/29/2002 | EP1208014A2 Positive acting photoresist composition and imageable element |
| 05/29/2002 | EP1103170B1 Printed circuit board with a heatsink and method for mounting a heatsink |
| 05/29/2002 | EP1051748A4 A vertical connector based packaging solution for integrated circuits |
| 05/29/2002 | EP0910480B1 Device for wet coating, in particular printed circuit boards with lacquer |
| 05/29/2002 | DE10159685A1 Verdrahtungssubstrat, Verdrahtungsplatte und Montagestruktur für ein Verdrahtungssubstrat Wiring substrate, the wiring board and mounting structure for the wiring substrate |
| 05/29/2002 | DE10153726A1 Flexible Schaltkreistafel und Verbindung der Struktur davon Flexible circuit board and connecting the structure thereof |
| 05/29/2002 | DE10149912A1 Compact and robust pedal power measurement device has a force branching mechanism that branches a part of the pedal force axially onto a measurement capacitor, the change in capacitance being used to measure the applied force |
| 05/29/2002 | DE10122942A1 Elektrodenformungsverfahren und dafür benutzte Basis zur Formung von Bump-Elektroden Electrodes forming method and used for basis for forming bump electrodes |
| 05/29/2002 | DE10058622A1 Gemouldetes elektronisches Bauelement Gemouldetes electronic component |
| 05/29/2002 | DE10056184A1 Bohrunterlage Drilling |
| 05/29/2002 | DE10055482A1 Film material made from insulating plastic used as a connecting material between electronic components has metal spikes, opposite lying surfaces |