| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/06/2002 | WO2002045160A1 Flexible electronic device |
| 06/06/2002 | WO2002044274A1 Liquid thermosetting resin composition, printed wiring boards and process for their production |
| 06/06/2002 | WO2002036273A8 Catalyst solutions useful in activating substrates for subsequent plating |
| 06/06/2002 | WO2002020686A3 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same |
| 06/06/2002 | WO2002016068A3 Controlled and programmed deposition of flux on a flip-chip die by spraying |
| 06/06/2002 | WO2002014404A3 Polyarylether-polyetherimide compositions |
| 06/06/2002 | WO2002009485A3 Flip chip package, circuit board thereof and packaging method thereof |
| 06/06/2002 | WO2002009484A3 Electrical component assembly and method of fabrication |
| 06/06/2002 | US20020068426 Microelectronic packages having deformed bonded leads and methods therefor |
| 06/06/2002 | US20020068417 Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures |
| 06/06/2002 | US20020068389 Fexible electronic device |
| 06/06/2002 | US20020068382 Method for mounting flip chip on circuit board through reliable electrical connections at low contact resistance |
| 06/06/2002 | US20020068381 Ultra-fine contact alignment |
| 06/06/2002 | US20020068188 Method for depositing metal and metal oxide films and patterned films |
| 06/06/2002 | US20020068127 Process for selectively plating areas of a substrate |
| 06/06/2002 | US20020067621 Support, especially for taillights of motor vehicles, as well as method for fastening electronic components, preferably leds, to such a support |
| 06/06/2002 | US20020067587 High performance capacitor |
| 06/06/2002 | US20020067486 Solderability assessment |
| 06/06/2002 | US20020067457 Liquid crystal device and manufacturing method therefor |
| 06/06/2002 | US20020067456 Liquid crystal display element |
| 06/06/2002 | US20020067452 Active matrix liquid-crystal display device |
| 06/06/2002 | US20020067183 Methods of engaging electrically conductive pads on a semiconductor substrate |
| 06/06/2002 | US20020067181 Probe card assembly and kit, and methods of making same |
| 06/06/2002 | US20020067162 Sensor module |
| 06/06/2002 | US20020066978 Method of forming articles including waveguides via capillary micromolding and microtransfer molding |
| 06/06/2002 | US20020066961 Circuit Substrate and manufacturing method thereof |
| 06/06/2002 | US20020066949 BGA package and method of manufacturing the same |
| 06/06/2002 | US20020066905 Wing-shaped surface mount package for light emitting diodes |
| 06/06/2002 | US20020066881 Casting or embedding compound having electromagnetic shielding properties for manufacturing electronic components |
| 06/06/2002 | US20020066776 Method for forming end-face electrode |
| 06/06/2002 | US20020066767 Bonding apparatus and bonding tool for component |
| 06/06/2002 | US20020066766 Automatic soldering apparatus |
| 06/06/2002 | US20020066673 Method for plating copper conductors and devices formed |
| 06/06/2002 | US20020066672 Process for manufacturing a wiring board |
| 06/06/2002 | US20020066671 Seed layer deposition |
| 06/06/2002 | US20020066595 Wiring board and method of producing wiring board |
| 06/06/2002 | US20020066594 Circuit board and connection structure of terminal portion of the same |
| 06/06/2002 | US20020066593 Method for forming an electrically isolated via in a multilayer ceramic package and an electrical connection formed with the via |
| 06/06/2002 | US20020066590 Board integrated resilient contact elements array and method of fabrication |
| 06/06/2002 | US20020066584 Electric terminal for an electronic device |
| 06/06/2002 | US20020066583 Electron device and semiconductor device |
| 06/06/2002 | US20020066528 Method of producing a laminated structure |
| 06/06/2002 | US20020066524 Piezoelectric film type actuator, liquid discharge head, and method of manufacturing the same |
| 06/06/2002 | US20020066523 Attaching devices using polymers |
| 06/06/2002 | US20020066179 System and method for metalization of deep vias |
| 06/06/2002 | DE10151125A1 Anschlussstruktur und zugehöriges Herstellungsverfahren sowie die Anschlussstruktur verwendende Prüfanschlussanordnung Terminal structure and manufacturing method thereof, and the connection structure Prüfanschlussanordnung use |
| 06/06/2002 | DE10146940A1 Leiterplatte und Verfahren zur Herstellung derselben Printed circuit board and method of manufacturing the same |
| 06/06/2002 | DE10136524A1 Verbindungsverfahren und Verbindungsstruktur von gedruckten Leiterplatten Connection method and connecting structure of printed circuit boards |
| 06/06/2002 | DE10117777A1 Verfahren zum Herstellen eines Mehrschichtsubstrats hoher Dichte A method of manufacturing a high-density multi-layer substrate |
| 06/06/2002 | DE10060343A1 Polierslurry für das chemisch-mechanische Polieren von Metall- und Dielektrikastrukturen Polishing slurry for chemical mechanical polishing of metal and dielectric structures |
| 06/06/2002 | DE10059761A1 Injection molded circuit carrier or molded interconnect device |
| 06/06/2002 | DE10057606A1 Arrangement for contacting planar transformer ferrite core with earth has conducting track structure(s) on circuit board surface facing core; core and circuit board are joined by adhesive |
| 06/06/2002 | DE10056665A1 Lenkstockschalter, insbesondere für Fahrzeuge Steering column switch, in particular for vehicles |
| 06/06/2002 | DE10055040C1 Ceramic circuit board mounting method uses adhesive structure applied to support surface or underside of ceramic circuit board |
| 06/06/2002 | DE10043526C1 Verfahren zur haftfesten Metallbeschichtung und metallbeschichtetes Funktionselement Method for adherent metal coating and metal coated functional element |
| 06/05/2002 | EP1211921A2 Part for soldering to a printed wiring board |
| 06/05/2002 | EP1211920A1 Multilayer printed wiring board, solder resist composition, method for manufacturing multilayer printed wiring board, and semiconductor device |
| 06/05/2002 | EP1211730A2 Stacked power amplifier module |
| 06/05/2002 | EP1211720A2 Bump forming method and bump forming apparatus |
| 06/05/2002 | EP1211719A1 Polishing slurry for the chemical mechanical polishing of metal and dielectric structures |
| 06/05/2002 | EP1211583A2 Method and device for working planning |
| 06/05/2002 | EP1211441A2 Push button range selector with LED indicator |
| 06/05/2002 | EP1211139A1 Wire harness for vehicle |
| 06/05/2002 | EP1210850A1 Method for treating multiple-layer substrates |
| 06/05/2002 | EP1210849A1 Multi-connectable printed circuit board |
| 06/05/2002 | EP1210848A1 Bidirectional interface tool for pwb development |
| 06/05/2002 | EP1210733A1 Method for producing via-connections in a substrate and substrate equipped with same |
| 06/05/2002 | EP1210725A1 Ion reflectron comprising a flexible printed circuit board |
| 06/05/2002 | EP1116302B1 Connecting system |
| 06/05/2002 | EP1105942B1 Contact device mainly intended for contact between electric components and circuit supports and method for producing said device |
| 06/05/2002 | EP0806127B1 An environmentally desirable printed circuit and associated apparatus |
| 06/05/2002 | CN1352870A Composition and method for manufacturing integral resistor in printed circuit boards |
| 06/05/2002 | CN1352869A Sandwich-structured intelligent power module |
| 06/05/2002 | CN1352805A Substrate with at least two metallized polymer bumps for soldered connection to wiring |
| 06/05/2002 | CN1352804A High-density electronic package and method for making same |
| 06/05/2002 | CN1352496A 双超外差调谐器 Double superheterodyne tuner |
| 06/05/2002 | CN1352473A Multiple line grid connector |
| 06/05/2002 | CN1086101C Method of manufacturing a printed circuit board |
| 06/04/2002 | US6401048 Circuit trace probe and method |
| 06/04/2002 | US6401001 Layer manufacturing using deposition of fused droplets |
| 06/04/2002 | US6400570 Plated through-holes for signal interconnections in an electronic component assembly |
| 06/04/2002 | US6400551 Structure of a capacitor |
| 06/04/2002 | US6400323 Antenna coil for IC card and manufacturing method thereof |
| 06/04/2002 | US6400251 Chip thermistor |
| 06/04/2002 | US6400241 Microwave circuit module and a device for connecting it to another module |
| 06/04/2002 | US6400234 Strip line feeding apparatus |
| 06/04/2002 | US6400172 Semiconductor components having lasered machined conductive vias |
| 06/04/2002 | US6400169 Test socket with interposer for testing semiconductor components having contact balls |
| 06/04/2002 | US6400033 Reinforcing solder connections of electronic devices |
| 06/04/2002 | US6400028 Alignment of vias in circuit boards or similar structures |
| 06/04/2002 | US6400020 Aggregate of semiconductor devices including semiconductor packages arranged on a first tape and wound on a reel and also including a spacer tape provided with spacers |
| 06/04/2002 | US6400019 Semiconductor device with wiring substrate |
| 06/04/2002 | US6400018 Via plug adapter |
| 06/04/2002 | US6400011 Semiconductor laser module |
| 06/04/2002 | US6400010 Substrate including a metal portion and a resin portion |
| 06/04/2002 | US6400006 Integrated component, composite element comprising an integrated component and a conductor structure, chip card, and method of producing the integrated component |
| 06/04/2002 | US6399903 Multifunctional laminate structure and process |
| 06/04/2002 | US6399899 Suspension board with circuit |
| 06/04/2002 | US6399897 Multi-layer wiring substrate |
| 06/04/2002 | US6399896 Circuit package having low modulus, conformal mounting pads |